• Economic and Environmental Geology
• /
• v.56 no.6
• /
• pp.745-764
• /
• 2023

In the Republic of Congo, Banded iron formations (BIFs) occur in two areas: the Chaillu Massif and the Ivindo Basement Complex, which are segments of the Archean Congo craton outcropping in the northwestern and southwestern parts of the country. They show interesting potential with significant mineral resources reaching 2 Bt and grades up to 60% Fe. BIFs consist mostly of oxide-rich facies (hematite/magnetite), but carbonate-rich facies are also highlighted. They are found across the country within the similar geological sequences composed of amphibolites, gneisses and greenschists. The Post-Archean Australian Shale (PAAS)-normalized patterns of BIFs show enrichment in elements such as SiO₂, Fe₂O₃, CaO, P₂O₅, Cr, Cu, Zn, Nb, Hf, U and depletion in TiO₂, Al₂O₃, MgO, Na₂O, K₂O, Sc, Th, Ba, Zr, Rb, Ni, V. REE diagrams show slight light REEs (rare earth elements; LREEs) compared to heavy REEs (HREEs), and positive La and Eu anomalies. The lithological associations, as well as the very high (Eu/Eu^*)_SN ratios> 1.8 shown by the BIFs, suggest that they are related to Algoma-type BIFs. The positive correlations between Zr and TiO₂, Al₂O₃, Hf suggest that the contamination comes mainly from felsic rocks, while the absence of correlations between MgO and Cr, Ni argues for negligeable contributions from mafic sources. Pr/Pr^* vs. Ce/Ce^* diagram indicates that the Congolese BIFs were formed in basins with redox heterogeneity, which varies from suboxic to anoxic and from oxic to anoxic conditions. They were formed through hydrothermal vents in the seawater, with relatively low proportions of detrital inputs derived from igneous sources through continental weathering. Some Congolese BIFs show high contents in Cr, Ni and Cu, which suggest that iron (Fe) and silicon (Si) have been leached through hydrothermal processes associated with submarine volcanism. We discussed their tectonic setting and depositional environment and proposed that they were deposited in extensional back-arc basins, which also recorded hydrothermal vent fluids.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.1
• /
• pp.33-38
• /
• 2001

We investigate the via-size dependance of as-electroplated- and reflow-bump shapes for realizing both high-density and high-aspect ratio of solder bump. The solder bump is fabricated by subsequent processes as follows. After sputtering a TiW/Al electrode on a 5-inch Si-wafer, a thick photoresist for via formation it obtained by multiple-codling method and then vias with various diameters are defined by a conventional photolithography technique using a contact alinger with an I-line source. After via formation the under ball metallurgy (UBM) structure with Ti-adhesion and Cu-seed layers is sputtered on a sample. Cu-layer and Sn/pb-layer with a competition ratio of 6 to 4 are electroplated by a selective electroplating method. The reflow-bump diameters at bottom are unchanged, compared with as-electroplated diameters. As-electroplated- and reflow-bump shapes, however, depend significantly on the via size. The heights of as-electroplated and reflow bumps increase with the larger cia, while the aspect ratio of bump decreases. The nearest bumps may be touched by decreasing the bump pitch in order to obtain high-density bump. The touching between the nearest bumps occurs during the overplating procedure rather than the reflowing procedure because the mushroom diameter formed by overplating is larger than the reflow-bump diameter. The arrangement as zig-zag rows can be effective for realizing the flip-chip-interconnect bump with both high-density and high-aspect ratio.

• Applied Biological Chemistry
• /
• v.39 no.5
• /
• pp.349-354
• /
• 1996

The Polyvinyl alcohol(PVA) oxidase involved in PVA degradation by microorganism has been purified to homogeneity from culture broth of Xanthomonas campestris J2Y grown in a minimal medium containing PVA as a sole carbon source. The enzyme was purified by DEAE-cellulose chromatograpy and Sephadex G-150 gel filtration. The purified PVA oxidase was electrophoretically homogeneous both in the absence and presence of SDS. The molecular weight of the enzyme was estimated to be about 55,000 daltons by SDS-polyacrylamide gel electrophoresis and Sephadex G-150 gel filtration. The native enzyme existed as a monomer. The optimal pH and temperature was shown to be pH 7 and $37^{\circ}C$ respectively. The activity of enzyme was stable below $55^{\circ}C$ and between pH range of $5{\sim}11$. The enzyme activity was significantly inhibited by metal compounds such as $Ag^{2+},\;Hg^{2+}$. While, metal ions such as $Mn^{2+},\;and\;Cu^{2+}$ stimulated the reaction. Km value of the enzyme for PVA was $7.04{\times}10^{-2}mmol/{\ell}$.

• Journal of the Korean Society of Clothing and Textiles
• /
• v.37 no.7
• /
• pp.874-881
• /
• 2013

Dansam (Salvia miltiorrhiza Bunge) is a perennial plant that belongs to the Labiatae family and is characterized by red pigment found in the epidermis of its roots. Research on the dyeability of Dansam extract was performed with repeated trials under various conditions such as temperature, time, and mordant treatment. Silk fabrics were dyed with Dansam extract and mordanted with various agents such as Al, Fe, Cu, and Sn to evaluate the dyeability and functionality of Dansam extract; subsequently, the K/S value and the change of surface color were analyzed using a colorimeter. In addition, the dyeability of dyed fabrics (such as color fastness to washing, dry cleaning fastness, rubbing fastness and light fastness) and functionality (such as antibacterial activity and deodorization) were analyzed. The surface colors of all dyed fabrics were recorded and the results showed the presence of mostly YR series of colors; in addition, a GY color series appeared in the Fe pre-mordants of the silk fabric. The highest K/S values were recorded in Fe post-mordants. The washing fastness were Level 3 and Level 4; in addition, the dry-cleaning fastness showed excellent results at Level 4 and Level 5. The rubbing fastness was satisfactory at Level 3 and Level 4 and the light fastness was satisfactory at Level 4. The results of the measurements (that pertained to the antibacterial activity of fabrics dyed with Dansam extract) showed a 99.9% bacteria reduction rate of Staphylococcus aureus and Klebsiella pneumoniae. In regards to deodorization ability, dyed fabrics were found to have higher deodorization rates than those not dyed. The dyed fabric demonstrated exceptional deodorization qualities.

• Restorative Dentistry and Endodontics
• /
• v.9 no.1
• /
• pp.101-106
• /
• 1983

It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).

• The Korean Journal of Physiology and Pharmacology
• /
• v.14 no.5
• /
• pp.249-256
• /
• 2010

Gender differences in the trace elements of monkey sino-atrial (SA) node were investigated in a process of age-dependent alterations. Sixty hearts from Japanese and rhesus monkeys (30 male and 30 female) used were aged ranging from 1-day- to 30-year-old. The elements were analyzed using an inductively coupled plasma-atomic emission spectrometer (ICP-AES). Advancing age decreased all the trace elements. Ca, P, S and Mg significantly decreased. The correlation coefficients of Ca and P were $-0.178{\pm}0.081$ (p<0.05) and $-0.088{\pm}0.022$ (p<0.05) in male (n=30), and $-0.095{\pm}0.026$ (p<0.05) and $-0.069{\pm}0.017$ (p<0.05) in female (n=30), respectively. The age-dependent coefficients for Fe/Ca, Zn/Ca, Fe/P, Fe/S, Zn/S, Fe/Mg and Zn/Mg were exhibited markedly in male, but all was less in female. In gender-related differences, only a ratio of P/Ca (p<0.05) was significantly observed with ageing. The trace elements such as Cu, Se and Sn were less detected in the SA nodes. These results indicate that the age-dependent changes in the ratios of elements are appeared more rapidly in male monkey SA node, and the gender difference is observed in ratio of P/Ca. The different attenuations may be involved with the age- and gender-related SA nodal functions.

• Journal of Welding and Joining
• /
• v.33 no.3
• /
• pp.25-31
• /
• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• Economic and Environmental Geology
• /
• v.7 no.3
• /
• pp.87-100
• /
• 1974

This paper deals with grain size analysis, heavy mineral analysis and trace element analysis of the recent sediments of Han River basin between Cheongpyong, Gyeonggi province and Seoul. For each location the samples are taken at river shoreline, river berm and river dune. The size analysis discloses that the mean values range from $-1.37{\phi}$ to $-1.60{\phi}$, sorting values range from 0.25 to 1.84, skewness values range from -0.44 to 0.51 and kurtosis values range from -0.1 to 1.75. Based on the textural parameters, the dune sand can be distinguished from the shoreline-berm sand. The content of heavy minerals of each sample ranges from 0.04 to 4.7%. The principal heavy minerals are ilmenite, magnetite, leucoxene, garnet, amphibole, pyroxene, kyanite, zircon, monazite, tourmaline, epidote, limonite, and minor minerals are apatite, sillimanite, andalusite and olivine. In general, dune sand samples contain more heavy minerals than the samples of shoreline or berm sand. This suggests that the heavy mineral concentration is affected by wind action more than by any other causes. The content of ilmenite and leucoxene decreases, whereas the content of zircon and epidote increases as it approaches the downstream region. The differences result from the variance of geological occurrences. The emission spectrochemical analysis and colorimetry analysis revealed that the content of Ni and V in the heavy minerals of the study area are higher than those of other stream sediments in Korea. On the other hand the content of Cu, Ph, Zn, Mo, W, P, Mn, Cr, Ag and Sn are lower in the study area. It has been observed also that the contents of all the elements except for Bi are higher in this area than the samples of marine sediments of Yellow Sea.

• Journal of Welding and Joining
• /
• v.26 no.3
• /
• pp.30-36
• /
• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• The Research Journal of the Costume Culture
• /
• v.18 no.2
• /
• pp.371-381
• /
• 2010

The pine needles can be used for four seasons in normal living and it can be taken friendly everywhere as it is distributed over 50% in Korea. The pine needles consist of vitamins, protein, minerals, essential oil and enzyme related to antimicrobial activity. It has effect like high blood pressure, neuralgia and hanged over by terpene, glucokinin, rutin, apigenic acid and tannin. Also the extract of them can be used for dyeing of fabrics. However, the extract components and effects of them are not well known yet. Therefore, the purpose of this study was to investigate the volatile components of the pine needles extract and functionality. The pine needles extract was dyed into various fabrics(nylon, silk, wool and soybean) and mordanted with Al, Cu, Cr, Fe and Sn. The extracted aroma compounds were compared by gas chromatography-mass spectrometry. The major volatile compounds of pine needles verified by using SPME were alpha-pinene, beta-pinene, beta-phellandrene, caryophyllene, ethanon, benzen. A total of 15 compounds were identified by using the SPME fibers. In the UV-visible spectra, the maximum absorption of wavelength of the pine needles ethanol extract appeared at 460, 630nm for chlorophyll component and at 237, 281nm for tannin component with the pine needles distilled water extract. Most of sample showed high antibacterial effect in none mordant but wool fabric showed high antibacterial effect in mordants. The result of UV block test showed a superior ability of blocking ultraviolet ray infiltration in all sample.