• 한국주조공학회지
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• 제41권3호
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• pp.241-251
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• 2021

7000계 알루미늄 합금은 다른 Al 합금에 비해 강도가 우수하여 주목을 받고있으며, 7000계 알루미늄 빌렛은 일반적으로 Direct-Chill (DC) 주조 공정을 통해 제조된다. DC 주조 공정으로 제조된 알루미늄 빌렛의 표면 결함은 주로 Exudation과 Meniscus freezing 현상과 관련이 있으며, 이는 합금 성분, 주조 속도 및 주조 온도의 영향을 받는다. 특히, 7000계 알루미늄 합금은 응고 과정에서 응고 온도 범위가 넓어 주조 결함이 발생하기 쉽다. 본 연구에서는 DC 주조 공정에 의해 제조된 Al-8Zn-2Mg-2Cu 합금 빌렛에 대한 표면 결함 변화에 대하여 조사하였다. 빌렛의 표면은 "Wavy" 또는 "Dot" 표면으로 관찰되었다. Wavy 표면은 낮은 주조 속도(200mm/min)와 온도(655℃)에서 Meniscus freezing 현상에 의해 형성되었으며, Concave 영역에서 Meniscus freezing 현상으로 인한 조성작 과냉으로 인해 미세한 수지상 조직이 관찰되었다. 반면에, 주조 온도가 높은 조건(675℃)에서는 Dot 표면이 기공 형성에 의해 형성되었으며, 높은 주조 속도(230mm/min)에서 제조된 Dot 표면을 갖는 빌렛에서는 높은 금속 수두압에 의해 Exudation 층이 형성되었다. Exudation 층의 Dot 영역과 Smooth 영역은 각각 미세한 수지상 형태와 주상정 형태의 조직이 관찰되었으며 이는 Dot 영역에서 가스 기공의 형성에 의한 결과이다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.55-59
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• 2003

Rotor in small-medium induction motor has been usually manufactured by aluminum diecasting. In order to improve efficiency of induction motors, however, it is desirable that pure aluminum is replaced by high electrical conductivity copper alloy. For this purpose, a rotor is thixoformed with Cu-Ca alloy. Thermomechanical processing(TMP) is carried out to modify the semi-solid microstructure of the alloy and final microstructures and filling defects of thixoformed Cu- rotors are investigated. The characteristics of thixoformed Cu-rotor such as motor efficiency and torque are compared with those of Al rotor.

• Journal of Welding and Joining
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• 제14권1호
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• pp.47-56
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• 1996

The purpose of this study is to develope an insert metal which can be brazed at lower temperature than the conventionally used insert metal and provide higher strength joint than base metal. In the review of binary phase diagram concerning Ti, Cu and Ni resulted in the discovery of Si having eutectic composition with them. The microstructure and the distribution of elements in reaction zone between CP Ti and insert metal were investigated by Optical Microscopy, SEM/EDX, EPMA, X-RAY. The newly developed insert metal is Ti-15wt%Cu-18wt%Ni-2wt%Si, which can yield the lower brazing temperature(1183K) compared with the conventional Ti-Cu-Ni system insert metal. The joints with this insert metal had tensile strength of 385MPa in the bonding temperature range of 1183K to 1243K.

• 한국주조공학회지
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• 제21권5호
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• pp.286-289
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• 2001

The glass formation behavior was investigated in the melt spun Zr-Ti-Cu-Ni-X (X=B, P and Si) ribbons. The magnitude of supercooled liquid region of Zr-Ti-Cu-Ni alloy increased with an addition of alloying element. The glass transition temperature and the crystallization temperature increased and the magnitude of supercooled liquid region decreased with increasing the content of alloying elements. The largest supercooled liquid region was observed in the Si containing alloy. This is believed to be due to the dense atom packing with the optimum atomic size ratio of constituent elements.

• 열처리공학회지
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• 제20권5호
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• pp.243-249
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• 2007

The age hardening behavior and mechanical properties of an extruded Al-Zn-Mg-(Cu)-0.1 wt.%Sc alloy were investigated with the Sc addition and ageing temperature. The results showed that the $Al_3Sc$ compounds were formed by Sc addition and distributed preferentially along the extrusion direction. The age hardening of Al-Zn-Mg-Cu-0.1 wt.%Sc alloy which was treated by T6 process was more significant than that of Al-Zn-Mg-0.1 wt.%Sc alloy. The tensile property of Al-Zn-Mg-Cu+0.1 wt.%Sc alloy was also higher than that of Al-Zn-Mg-0.1 wt.%Sc alloy, which is 691 MPa and 584 MPa in strength and 9% and 11% in elongation, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1544-1546
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• 1996

Thin films of Cu-Ni alloys of various compositions were prepared by RF sputtering onto glass and stainless steel substrates. The effect of composition, substrate temperature, Ar partial pressure, aging time on the electrical properties of Cu-Ni film strain gages in the thickness range $500{\sim}2000{\AA}$ was studied. The maximum resistivity is obtained from 53wt%Cu-47wt%Ni films, while their TCR becomes minimum. This tendency is very desirable for thin film strain gages.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1000-1001
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• 2006

Two atomized alloy powders were pre-compacted by cold and subsequently hot forged at temperatures ranging from 653K to 845K. The addition of Cu and Mg causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addition to Al-Fe based intermetallics, $Al_2Cu$ and $Al_2CuMg$ intermetallics appeared. The volume fraction of intermetallic dispersoids increased by the addition of Cu and Mg. Compressive strength of the present alloys was closely related to the volume fraction of intermetallic dispersoids.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.126-129
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• 2002

This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

• 한국분말재료학회지
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• 제11권3호
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• pp.193-201
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• 2004

1960년 Au-Si계 합금에서 처음으로 비정질상이 급속 응고법에 의해 보고된 이래/sup 1)/ 지난 40년 간 많은 합금계에서 비정질상이 보고되어졌다. 대표적으로 Fe-, Ni-, Co기 합금 등 많은 합금계에서 비정질상이 보고되었으나, 비정질상의 형성을 위해서는 약 105 K/s이상의 높은 냉각속도를 필요로 하였다. 1980년대 수백 K/s의 낮은 냉각속도 하에서도 비정질상이 형성될 수 있는 다원계 합금(multi-component alloy)이 Mg-Ln-(Ni, Cu, Zn), Ln-Al-TM 합금에서 보고되어 졌으나 많은 관심을 받지 못하다가 1993년 Zr-Ti-Ni-Cu-Be 합금에서 수 ㎝ 크기의 비정질합금 제조가 보고되면서 전 세계적으로 많은 관심을 받게 되었다. Zr-Ti-Ni-Cu-Be계 벌크 비정질 합금이 보고된 후 Zr-(Nb,Pd)-Al-TM, Pd-Cu-Ni-P, Fe-Co-Zr-Mo-W-B, Ti-Zr-Ni-Cu-Sn등 여러 합금계에서 벌크 비정질 합금이 보고되었다. (중략)

• Bulletin of the Korean Chemical Society
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• 제11권1호
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• pp.1-7
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• 1990

We present a theoretical investigation on the etching of an Al solid by $SiCl_4$ molecules at a collision energy of 600 eV. The classical trajectory method is employed to calculate Al etching yields, degree of anisotropy, kinetic energy distribution and angular distribution. The calculated results are compared with the reaction of a Cu solid by $SiCl_4$. The major products of the reaction are aluminum monomers and dimers together with considerable quantities of multimers. The Al solid shows better etching yield and better anisotropy than the Cu solid. This is consistent with the problem in the CMOS micro-fabrication of the CuAl and CuAlSi alloys. The relevance of these calculations for the dry etching of CuAl alloy is discussed.