• Title/Summary/Keyword: Cu alloy

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Mechanical and Electrical Properties of Submicrocrystalline Cu-3%Ag Alloy (초미세 결정립 Cu-3%Ag 합금의 기계적/전기적 특성)

  • Ko, Y.G.;Lee, C.W.;NamGung, S.;Lee, D.H.;Shin, D.H.
    • Transactions of Materials Processing
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    • v.18 no.6
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    • pp.476-481
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    • 2009
  • The present work demonstrates the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal channel angular pressing(ECAP). From transmission electron microscope observation, the resulting microstructures of Cu-3%Ag alloy deformed by ECAP for 8-pass or more consist of reasonably fine, equiaxed grains without having a strong preferred orientation, suggesting that microstructure evolution is slower than that of pure-Al and its alloys owing to low stacking fault energy. The results of room temperature tension tests reveal that, as the amount of applied strain increases, the tensile strength of submicrocrystalline Cu-3%Ag alloy increases whereas losing both the ductility and the electrical conductivity. Such phenomenon can be explained based on microstructure featured by the non-equilibrium grain boundaries.

Fabrication and characteristics of NbTi superconducting wires with Cu-Si matrix for AC use (Cu-Si 기지금속을 사용한 교류용 초전도선재 제조 및 특성)

  • Ha, D.W.;Oh, S.S.;Oh, B.H.;Kwon, Y.G.;Cho, J.W.;Ryu, K.S.;Han, I.Y.;Baik, H.K.
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1165-1167
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    • 1995
  • The Cu-Si alloy has been proposed as a new matrix materal for filamentary Nb-Ti wires in AC use. The Cu-Si alloy shows approprite mechanical and electrical properties, and is economically more favourable than the Cu-Ni alloy matrix used currently. Moreover, the addition of Si to Cu prevents the formation of intermetallic compounds around the filaments. After we investigated resistivity and hardness of Cu-Si alloy as matrix materal, investigated CuSi/NbTi interface reactions and superconductivities of superconducting wires that were made by various heat treatment.

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Microstructure and Hardness of Al-Cu Alloy Coating on Monel 400 by Hot Dipping (액상 침적에 의한 Monel 400기지상에 형성된 Al-Cu 합금 코팅층의 조직 및 경도)

  • 조선욱;이임렬
    • Journal of the Korean institute of surface engineering
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    • v.29 no.4
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    • pp.278-285
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    • 1996
  • The structure of coating layer formed by hot dip Al-Cu alloy coating on Monel 1400 metal was studied. The coating layer consists of alloyed layer adjacent to the Monel 400 substrate and Al-Cu alloy. It was found that the hardness of coating increased with dipping time and heat treatment associated with the diffusion and the formation of intermetallic compound at the interface. However the thickness of coating layer was decreased at high dipping temperature due to tile higher viscosity of liquid coating alloy. Diffusion heat treatment at $600^{\circ}C$ after coating resulted in the disappearence of adhered Al(Cu) and $CuAl_2$ phases, and then they transformed into the new phases of CuAl and Al7Cu4Ni at coating layer.

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Thermal behavior of Cu-Cr Alloy Films sputter-deposited onto polyimide (폴리이미드에 스퍼터 증착된 Cu-Cr 합금박막의 열처리 거동)

  • 임준홍;이태곤;김영호;한승희
    • Journal of the Korean institute of surface engineering
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    • v.27 no.5
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    • pp.273-284
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    • 1994
  • Thermal behavior of Cu-Cr thin alloy films has been investigated by SEM, AES, and TEM. Cu-Cr alloy films containing 3wt% Cr, 8wt% Cr have been sputter-deposited onto polyimide substrates and heat treated at $400^{\circ}C$ for 2hrs in the various atmosphere. Before heat treatment, Cu and Cr content in the film are uniform through the thickness and oxygen content in the film is negligible. Redistribution of Cr, Cu, and O in the film due to heat treatment depends on the Cr content and heat treatment atmoshpere. There kinds of thermal behavior are ascribed to the formation of surface and interface oxides as well as internal oxidation. Hillocks are observed on the surface of Cu-Cr alloy films which have been heat treated in N2. The hillocks are composed of large grainss of Cu.

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Nondestructive Techniques for Characterization of Microstructural Evolution during Low Cycle Fatigue of Cu and Cu-Zn Alloy (Cu와 Cu-Zn 합금의 저주기피로 동안 발달한 미세조직 평가를 위한 비파괴기술)

  • Kim, Chung-Seok;Jhang, Kyung-Young;Hyun, Chang-Young
    • Journal of the Korean Society for Nondestructive Testing
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    • v.31 no.1
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    • pp.32-39
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    • 2011
  • The object of this study is to evaluate and discriminate nondestructively the dislocation substructures of Cu and Cu-Zn alloy subjected to the low-cycle-fatigue. The ultrasonic wave velocity, electrical resistivity and positron annhilation lifetime(PAL) were measured to the nondestructive testing. Cyclic fatigue test of Cu and Cu-Zn alloy with much different stacking fault energies was conducted and the correlations between dislocation behavior and nondestructive parameters were studied. Dislocation cell substructure was developed in Cu, while planar array of dislocation structure was developed in Cu-35Zn alloy only increasing dislocation density with fatigue cycles. Decrease in ultrasonic wave velocity, increase in electrical resistivity and PAL were shown because of the development of lattice defects, dislocations and vacancies, by cyclic fatigue at room temperature. In contrast to Cu-Zn alloy of the planar-array dislocation substructure showing continuous changes in the nondestructive parameters, it does not make any noticeable changes in the nondestructive parameters after the evolution of dislocation cell substructure in Cu.

RRA Treatment of Semi-Solid Al-Zn-Mg-Cu Al Alloy Fabricated by Cooling Plate (냉각판으로 제조된 Al-Zn-Mg-Cu계 반응고 알루미늄 합금의 RRA 처리)

  • Kim, Dae-Hwan;Shim, Sung-Yong;Kim, Young-Hwa;Lim, Su-Gun
    • Journal of Korea Foundry Society
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    • v.29 no.6
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    • pp.265-269
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    • 2009
  • The optimum RRA heat treating conditions and SCC (stress corrosion cracking) resistance of semi-solid Al-Zn-Mg-Cu alloy fabricated by inclined cooling plate were compared with those of conventional mould cast alloys. The non-stirring method characterized by using a cooling plate can effectively eliminate dendritic structure and form a fine globular semisolid microstructure in as-cast Al-Zn-Mg-Cu alloy and the SCC resistance of semi-solid Al-Zn-Mg-Cu alloy was higher than that of conventional mold cast alloy. Also, after retrogressed treatment at RRA heat treatment of semi-solid Al-Zn-Mg-Cu alloy, retrogressed treatment time has increased more than 10 minutes at $180^{\circ}C$ to recovery the T6 heat treatment strength.

Effect of Sn Addition on the Fatigue Properties of Al-Cu-Mn Cast Alloy (Al-Cu-Mu 주조합금의 피로성질에 미치는 Sn 첨가의 영향)

  • Kim, Kyung-Hyun;Kim, Jeung-Dae;Kim, In-Bae
    • Korean Journal of Materials Research
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    • v.12 no.4
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    • pp.248-253
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    • 2002
  • Effect of Sn addition on the fatigue properties of Al-Cu-Mn cast alloy was investigated by low and high cycle fatigue tests. Fatigue life showed the maximum value of 5450cycles in the Al-Cu-Mn alloy containing 0.10%Sn, but decreased rapidly beyond 0.20% of Sn additions. It was found that the fatigue strength was 132MPa and fatigue ratio was 0.31 in the alloy containing 0.10%Sn. Metallographic observation revealed that the fatigue crack initiated at the surface and propagated along the grain boundary. This propagation path was attributed to the presence of PFZ along the grain boundary. The tensile strength increased from 330MPa in 7he Sn-free Al-Cu-Mn cast alloy to 429MPa in the alloy containing 0.10%Sn. But above 0.20%Sn additions, tensile strength was decreased by the segregation of Sn.

Shape Memory Characteristics and Mechanical Properties of Rapidly Solidified $Ti_{50}Ni_{20}Cu_{30}$ Alloy Strips (급냉응고된 $Ti_{50}Ni_{20}Cu_{30}$ 합금 스트립의 형상기억특성과 기계적특성)

  • Kim, Yoen-Wook
    • Journal of Korea Foundry Society
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    • v.29 no.5
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    • pp.187-191
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    • 2009
  • Microstructures and shape memory characteristics of $Ti_{50}Ni_{20}Cu_{30}$ alloy strips fabricated by arc melt overflow have been investigated by means of XRD, optical microscopy and DSC. The microstructure of as-cast strips exhibited columnar grains normal to the strip surface. X-ray diffraction analysis showed that one-step martensitic transformation of B2-B19 occurred in the alloy strips. According to the DSC analysis, it was known that the martensitic transformation temperature ($M_s$) of B2 $\rightarrow$ B19 in $Ti_{50}Ni_{20}Cu_{30}$ strip is $57^{\circ}C$. During thermal cyclic deformation with the applied stress of 60 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $3.7^{\circ}C$ and 1.6%, respectively. The as-cast strip of $Ti_{50}Ni_{20}Cu_{30}$ alloy also showed a superelasticity and its stress hysteresis was as small as 14 MPa. These mechanical properties and shape memory characteristics of the alloy strips were ascribed to B2-B19 transformation and the controlled microstructures produced by rapid solidification of the arc melt overflow process.

The Changes of the Shape and Particle Size Distribution of δ' Phase on Ageing in Al-Li-( Cu, Zr) Alloys (Al-Li-( Cu, Zr) 합금에서 시효에 따른 δ' 상의 형상 및 입자크기분포의 변화)

  • Woo, K.D.;Cho, H.K.
    • Journal of the Korean Society for Heat Treatment
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    • v.7 no.2
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    • pp.96-102
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    • 1994
  • The present work was aimed to examine the changes of the shape and particle size distribution(PSD) of ${\delta}^{\prime}$ particles on ageing in Al-Li-(Cu, Zr) alloys which had low density, high specific strength and stiffness, Increasing ageing time and temperature resulted in particles whose aspect ratio tended toward 1. The aspect ratio of ${\delta}^{\prime}$ particles was not dependent upon the ageing temperature and time in Al-Li-Cu alloy but was dependent upon them in Al-Li-Zr alloy. The PSD of ${\delta}^{\prime}$ particles in Al-Li-Zr alloy skewed to the right hand compared with that in Al-Li-Cu alloy, because $Al_3Zr$ phase in Al-Li-Zr alloy formed before ageing promoted the precipitation and growth of ${\delta}^{\prime}$ phase. Therefore, the PSD of the ${\delta}^{\prime}$ particles was found to be affected by the presence of $Al_3Zr$ particles. The growth rate of ${\delta}^{\prime}$ phase was not affected by the existence of the third transition phase $T_1$ formed by the addition of Cu in Al-Li alloy but was affected by the existence of $Al_3Zr$ formed by the addition of Zr in Al-Li alloy.

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Tribological Properties of Cu-Ni Alloy Nanopowders Synthesized by Pulsed Wire Evaporation (PWE) Method (전기 폭발법에 의해 제조된 Cu-Ni 나노 분말의 윤활성 향상)

  • Oh J.S.;Park J.H.;Kim W.W.;Rhee C.K.
    • Journal of Powder Materials
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    • v.11 no.5
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    • pp.376-382
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    • 2004
  • Nanoscale Cu-Ni alloy nanopowders have been produced by a pulsed wire evaporation method in an inert gas. The effect of Cu-Ni alloy nanopowders as additives to motor oil on the tribological properties was studied at room temperature. The worn surfaces were characterized by Scanning Electron Microscopy (SEM) and Energy-Dispersive X-ray Spectroscopy (EDS). Cu-Ni alloy nanopowders as additives lowered coefficient of friction and wear rate. It was found that a copper containing layer on the worn surface was formed, and deposited layers of the metal cladding acted as lubricant on the worn surface, reducing the friction coefficient. It was clearly demonstrated that Cu-Ni alloy nanopowders as additives are able to restore the worn surface and to preserve the friction surfaces from wear.