• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1485-1487
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• 2000

A variety of target configurations in sputtering process have been proposed to deposit various structures of thin film alloys and compound films. In this study, we presented the comparative experimental results regarding to the characterization of properties of Cu-Ni thin films deposited by using a magnetron co-sputtering method, as a function of target configurations; one is using a single target with varying the area of Ni chips attached on the Cu target and another is using a dual-type target with two targets of Ni and Cu separated each other. Structural(d-spacing, crystal orientation, crystallite size, cross-sectional morphology) and electrical(resistivity) properties of deposited films are characterized and compared as a function of target configurations as well as deposition conditions.

• Journal of Korea Foundry Society
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• v.7 no.4
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• pp.336-341
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• 1987

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.3
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• Journal of the Korean Society for Heat Treatment
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• v.26 no.5
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• pp.225-232
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• 2013

The influence of aging treatment, addition elements and rolling reduction ratio on the microstructure, mechanical, electrical and bendability properties of Cu-Ni-Si-P-x (x = Fe, Sn, Zn) alloys for connector material application was investigated. SEM/EDS analysis exhibited that Ni2-Si precipitates with a size of 20~100 nm were distributed in grains. Fe, Sn, Zn elemnets in Cu-Ni-Si-P alloy imporved the mechanical strength but it was not favor in increasing of electrical conductivity. As higher final rolling reduction ratio, the strength and electrical conductivity is increased after aging treatment, but it indicated excellent bendability. Especially, Cu-2Ni-0.4Si-0.5Sn-0.1Fe-0.03P alloy show the tensile strength value of 700MPa and the electrical conductivity was observed to reach a maximum of 40%IACS. It is optimal for lead frame and connector.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.21-28
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• 2002

Bismuth and Indium added Sn-Cu-Ni solder alloy was investigated for a new lead free solder. The thermal, electrical and mechanical properties were characterized for the Sn-0.7%(Cu+Ni) solder alloy by adding 2~5% Bi and 2~ 10% In. The melting point of solder alloy was in range of 200 to $222^{\circ}C$ and the mushy zone was in range of 20 to $37^{\circ}C$. This alloys could be adapted to middle and high temperature solder materials. A new solder alloy composition. Sn-0.7%(Cu+Ni) -3.5%Bi-2%In is very promising with high performance and effective cost. The melting point was $220^{\circ}C$, the mushy zone range was $25^{\circ}C$, and mechanical, electrical and wetting properties were competitive with those of other lead-free solder except the lower elongation value.

• Korean Journal of Metals and Materials
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• v.48 no.8
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• pp.749-756
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• 2010

Low carbon steels were oxidized isothermally at 1050 and $1180^{\circ}C$ for 4 hr in air in order to determine the effect of alloying elements Si, S, Cu, Sn, and Ni on oxidation. For oxidation resistance of low carbon steels, the beneficial elements were Si, Cu, and Ni, whereas the harmful elements were S and Sn. The most active alloying element, Si, was scattered inside the oxide scale, at the scale-alloy interface, and as an internal oxide precipitate. The relatively noble elements such as Cu and Ni tended to weakly segregate at the scale-alloy interface. Sulfur and Sn were weakly, uniformly distributed inside the oxide scale. Excessively thick, non-adherent scales containing interconnected pores formed at $1180^{\circ}C$.

• Journal of Korea Foundry Society
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• v.22 no.5
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• pp.252-256
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• 2002

Ni-Nb-Ti-Zr amorphous alloys were manufactured using melt-spinning methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties were examined. The value of the reduced glass transition temperature and the supercooled liquid region of $Ni_{62}Nb_{10}Ti_{13}Zr_{15}$ alloy were relatively high and were 0.612 and 76 K respectively. However, amorphous bulk alloy rod was not formed using the Cu-mold die casting. The mechanical properties were in the range of $800{\sim}900DPN$ of hardness and $2.5{\sim}2.8$ GPa of tensile strength in the whole composition range.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.12
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• pp.31-38
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• 1991

The current-voltage characteristics at annealed Be-Cu alloy(1.8-2 wt% Be, 0.2 wt% Co+Ni) interfaces have been studied by means of the cyclic voltammetric method. The specimens were annealed in nitrogen gas($N_{2}$) furnace at 36$0^{\circ}C$ for 1.5 hours. After annealing, the vickers hardness(HV) was increased from 210 to 385. The used solutions were distilled water(H$_{2}$O), 10$^{-3}M\;CsNO_{2},10^{-2}M\;KCl,10^{-2}M\;KOH,10^{-4}M\;H_{2}SO_{4}$ aqueous electrolytes, and ethylalcohol ($C_{2}H_{5}OH$), etc. The cyclic voltammograms showed significant current-voltage characteristics between the annealed and unannealed specimens at the same conditions. The age hardening and the related surface potential barrer and dissolution effects have been observed during the whole experimental process. The dissolution process of annealed Be-Cu alloys was effectively retarded by the age hardening phenomenon. The age hardening effect also raised the surface potential barrier of Be-Cu alloys. The interfacial phenomena of Be-Cu alloys seem to be one of good models for understanding the activation process.

• Transactions of the Korean hydrogen and new energy society
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• v.10 no.4
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• pp.225-232
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• 1999

The $Mg_2Ni$ hydrogen storage alloys which have much higher theoretical discharge capacity than $AB_5$ and $AB_2$ type alloys were synthesized by mechanical alloying with some additives and subjected to the electrochemical measurements. Two different processes were employed to the synthesis of $Mg_2Ni$ alloys with using the high energy ball mill SPEX 8000. One was only ball milling, 12 hrs, the Mg and Ni powders for 12 hrs with additives such as $AB_5$, Ni, Co and Cu powders. In the other process the Mg and Ni powders were ball milled for 1 hr first and then heat treated at $300{\sim}400^{\circ}C$ for 1 hr to get $Mg_2Ni$ alloy, and finally the $Mg_2Ni$ alloy powders were ball milled with the additives for 12 hrs. The alloy powders prepared were compacted at room temperature under $7.64tons/cm^2$ into disk type electrodes for the electrochemical measurements. The experimntal results showed that the electrodes prepared with the heat treated alloy powders had a higher discharge capacities than those without heat treatment. The addition of Ni caused an increase of the discharge capacity and the addition of Co improved the cycling characteristics. The electrode prepared by ball milling of $Mg_2Ni$ and 10wt% Ni powders has showed the highest discharge capacity, 546mAh/g.alloy, which was 55% of the theoretical capacity.