• 한국진공학회지
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• 제13권2호
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• pp.72-78
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• 2004

TaN막 위에 magnetron sputtering으로 증착 시킨 Cu seed 막을 Cu 전해도금을 하기에 앞서 ECR plasma 장치로 전처리 세정하였다. 이때 Cu 막을 200∼$500^{\circ}C$로 변화시키면서 알곤 또는 질소 분위기에서 RTA(rapid themal annealing) 방법으로 열처리하였다. Cu seed 막 위에 전해도금법으로 형성한 Cu 막을 열처리했을 때 미세구조와 물리적 특성변화를 XRD(x-ray diffraction), EBSD(electron back-scattered diffraction), AFM(atomic force microscopy) 분석을 이용하여 조사하였다. $400^{\circ}C$보다 높은 온도에서 재결정이 일어났으며, 열처리 온도를 증가함에 따라 Cu막의 비저항이 감소하고 (111) 우선배향성이 증가하는 경향을 나타냈다. 최소의 비저항과 부드러운 표면 및 (111) 배향성이 뛰어난 Cu막을 얻기 위한 최적의 열처리 조건은 $400^{\circ}C$의 질소분위기에서 120초간 RTA처리를 하는 것으로 판단된다. 이 조건하에서 전해도금된 Cu막의 비저항(resistivity)과 표면 거칠기(surface roughness)는 각각 1.98$\mu$O-cm 및 17.77nm였다.

• Korean Chemical Engineering Research
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• 제45권6호
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• pp.560-565
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• 2007

화학환원법을 이용하여 폐동분 수용액에 환원제인 hydrazine을 첨가하여 $0.11{\sim}0.64{\mu}m$ 크기의 Cu 미립자를 제조하였으며, 이 과정 중 hydrazine의 첨가량이 얻어진 분말의 물성에 미치는 영향을 살펴보았다. 또한 분말합성 과정 중 분산제인 polyvinyl alcohol(PVA) 또는 polyvinyl pyrrolidone(PVP) 첨가가 분말의 물성에 미치는 영향도 조사하였다. 1 M 농도의 폐동분 수용액에 hydrazine이 0.8 mol, 1.0 mol 첨가된 경우에는 Cu와 $Cu_2O$의 혼합물을 나타내어 순수한 Cu 분말을 생성하지 못했다. 반면 적당량의 hydrazine(1.2 mol)이 첨가된 경우에는 순수한 Cu 분말이 생성되었다. 또한 얻어진 Cu 분말의 평균크기는 hydrazine과 분산제의 첨가량이 증가함에 따라 감소하였다. 한편 분말의 응집을 억제하는 분산제로서 PVA의 사용이 PVP 보다 더욱 효과적이었다.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• Imaging Science in Dentistry
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• 제31권3호
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• pp.129-133
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• 2001

Purpose: To compare the copper equivalent values measured at premolar and molar areas in the copper equivalent images of panoramic and intraoral radiographs and to evaluate the possibility of the copper equivalent images of panorama for the assessment the bone density. Materials and Methods : Intraoral radiograms at mandibular premolar and molar area and panoramas of 6 human dry skulls were taken with copper-step wedge by Heliodent MD (Siemens Co., Germany) and by Planmeca (PM 2002 CC, Planmeca, Helsinki, Finland) were used for experiment. The copper equivalent values measured at premolar and molar areas in the copper equivalent im ages of panorama and intraoral film were compared. Results: The copper equivalent values were ranged 0.20 mmCu-0.44 mmCu at the molar areas, 0.05 mmCu-0.31 mmCu at the premolar areas on panoramic images. There were no significant differences (p>0.5) between the copper equivalent values on intraoral images and those on panoramic images measured at premolar areas and molar areas respectively. The correlation coefficient between the copper equivalent values on intraoral images and those on panoramic images was respectively 0.8495 at molar areas and 0.6184 at premolar areas. Conclusions : The copper equivalent images of panorama for the assessment the bone density appeared to be significant at molar area compared with the one of intraoral radiograph.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1207-1208
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• 2006

We developed the copper core ball electroplated with Sn-Ag-Cu of the eutectic composition which used mostly as Pb free solder ball with high reliability. In order to search for the practicality of this developed copper core ball, the evaluation was executed by measuring the initial joint strength of the sample mounted on the substrate and reflowed and by measuring the joint strength of the sample after the high temperature leaving test and the constant temperature and the humidity leaving test. This evaluation was compered with those of the usual other copper core balls electroplated with (Sn,Sn-Ag,Sn-Cu,Sn-Bi) and the Sn-Ag-Cu solder ball.

• Corrosion Science and Technology
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• 제6권4호
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• pp.198-205
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• 2007

The initial stages of electrochemical oxidative CuI film formation on Cu(111), as studied by means of Cyclic Voltammetry (CV), in-situ Scanning Tunneling Microscopy (STM) and ex-situ Synchrotron X-ray Photoemission Spectroscopy (SXPS), indicate a significant acceleration of copper oxidation in the presence of iodide anions in the electrolyte. A surface confined supersaturation with mobile CuI monomers first leads to the formation of a 2D-CuI film via nucleation and growth of a Cu/I-bilayer on-top of a pre-adsorbed iodide monolayer. Structurally, this 2D-CuI film is closely related to the (111) plane of crystalline CuI (zinc blende type). Interestingly, this film causes no significant passivation of the copper surface. In an advanced stage of copper dissolution a transition from the 2D- to a 3D-CuI growth mode can be observed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.245-245
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• 2009

l-D nanostructured materials have much more attention because of their outstanding properties and wide applicability in device fabrication. Copper oxide(CuO) has been realized as a p-type metal oxide semiconductor with narrow band gap of 1.2 -1.5eV. Copper oxide nanostructures can be synthesized by various growth method such as oxidation reaction, thermal evaporation thermal decomposition, sol-gel. and Mostly CuO nanowire prepared on the Cu substrate such as Copper foil, grid, plate. In this study, CuO NWs were grown by thermal oxidation (at various temperatures in air (1 atm)) of Cu metal deposited on CuO (20nm)/$SiO_2$(250nm)/Si. A 20nm-thick CuO layer was used as an adhesion layer between Cu metal and $SiO_2$

• 한국표면공학회지
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• 제43권6호
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• pp.266-271
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• 2010

Ternary Mo-Cu-N films were deposited on Si wafer substrates with various copper contents by magnetron sputtering method using Mo target and Cu target in $Ar/N_2$ gaseous atmosphere. As increasing $N_2$ pressure, the microstructure of Mo-N films changed from ${\gamma}-Mo_2N$ of (111) having face-centered-cubic (FCC) structure to $\delta$-MoN of (200) having hexagonal structure. Detailed the microstructures of the Mo-Cu-N coatings were studied by X-ray diffraction, scanning electron microscopy and field emission transmission electron microscope. The results indicated that the incorporation of copper into the growing Mo-N coating led to the $Mo_2N$ and MoN crystallites were more well-distributed and refined and the copper existed in grain boundary. Ternary Mo-Cu-N films had a composite microstructure of the nanosized crystal crystalline ${\gamma}-Mo_2N$ and $\delta$-MoN surrounded by amorphous $Cu_3N$ phase.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.69-72
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• 1999

A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

• 한국식품영양과학회지
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• 제16권2호
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• pp.63-68
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• 1987

The effects of various levels of copper(Cu) intake on the concentrations of copper, iron (Fe) and 3inc(Zn) in rat tissues were studied in growing rats. For different groups the drinking water was supplemented with 0(control), 25, 50, 100 and 200ppm Cu(as copper sulphate) for 1 day respectively. All animal groups were fed with the control diet (Cu contents, 12.8%mg/kg diet) during the experiment. At the end of the 4 week experiment, body weight gain was slightly lower in the Cu supply groups than in control group. Liver and serum Cu were significantly higher in 50, 100 and 200ppm Cu of male and in 200ppm Cu of female than in control groups. Spleen Cu was significantly increased by the supplementation of Cu. Liver and heart Fe of male and heart Fe of female were increased by incresing supplementary Cu levels. In 50ppm Cu group, liver, spleen and kidney Fe of female increased but the others did not. Fe of tissues was different in male and female rats according to Cu levels supplied. Serum Zn of male and female was significantly lower in 50, 100 and 200ppm Cu groups than in control and 25ppm Cu groups. When supplemented with Cu levels there were no significant differences among groups for liver, kidney, spleen and heart Zn as well as heart and kidney Cu.