• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Speleological Society of Korea
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• no.76
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• pp.49-55
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• 2006

The submicron $YBa_2Cu_3O_x$ powder was prepared by the sol-gel method. The particle size is distributed from 0.2 to 1.0 ${\mu}m$, which benefits to eliminate the micro-cracks formed in the $YBa_2Cu_3O_x$ films deposited by electrophoresis. The powder was single phase of $YBa_2Cu_3O_x$ examined by X-ray diffraction. In the sol-gel process the citrate gel was formed from citric acid and nitrate solution of $Y_2O_3$, $Ba(NO_3)_2$ and CuO. When pH values were adjusted to 6.4-6.7, $Ba(NO_3)_2$ could be dissolved in the citrate solution completely. Appropriate evaporative temperature of the sol-gel formation is discussed. Acetone is used as electrophoreticsolution, in which some water and iodine (0.2 g/1) and polyethylene glycol (2 vol. %) are added. The concentrations of $YBa_2Cu_3O_x$ powders is 20g/l. The thickness of deposited film could be more than 50 ${\mu}m$ in 3 minutes of depositing time. The most EPD films could be 90K zero resistance and the Jc values were over 1000A/cm2 (0 H, 77 K).

• The Journal of Advanced Prosthodontics
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• v.7 no.1
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• pp.56-61
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• 2015

PURPOSE. The purpose of this study was to evaluate the effects of the surface treatment and shape of the dental alloy on the composition of the prosthetic work and its metallic ion release in a corrosive medium after casting. MATERIALS AND METHODS. Orion Argos (Pd-Ag) and Orion Vesta (Pd-Cu) were used to cast two crowns and two disks. One of each was polished while the other was not. Two as-received alloys were also studied making a total of 5 specimens per alloy type. The specimens were submersed for 7 days in a lactic acid/sodium chloride solution (ISO standard 10271) and evaluated for surface structure characterization using SEM/EDAX. The solutions were quantitatively analysed for the presence of metal ions using ICP-MS and the results were statistically analysed with one-way ANOVA and a Tukey post-hoc test. RESULTS. Palladium is released from all specimens studied (range $0.06-7.08{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$), with the Pd-Cu alloy releasing the highest amounts. For both types of alloys, ion release of both disk and crown pairs were statistically different from the as-received alloy except for the Pd-Ag polished crown (P>.05). For both alloy type, disk-shaped pairs and unpolished specimens released the highest amounts of Pd ions (range $0.34-7.08{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$). Interestingly, in solutions submerged with cast alloys trace amounts of unexpected elements were measured. CONCLUSION. Shape and surface treatment influence ion release from dental alloys; polishing is a determinant factor. The release rate of cast and polished Pd alloys is between $0.06-0.69{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$, which is close to or exceeding the EU Nickel Directive 94/27/EC compensated for the molecular mass of Pd ($0.4{\mu}g{\cdot}cm^{-2}{\cdot}week^{-1}$). The composition of the alloy does not represent the element release, therefore we recommend manufacturers to report element release after ISO standard corrosion tests beside the original composition.

• Resources Recycling
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• v.10 no.1
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• pp.49-55
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• 2001

The strategy of recovering metals from scrap is in general much different from primary sources. One of the main differences between the treatment of scrap and that of primary sources lies with the fact that metals are frequently associated with other met-als to form alloys in scrap, while metals occur in primary sources as oxides or sulfides. In this paper, factors affecting the dis-solution behavior of metals from various alloy systems have been reviewed and discussed. Specific examples have been drawn from Au/Ag, Au/cu and Ag/cu systems. Results of the dissolution behavior of various metals from these alloys have been reviewed and compared to the dissolution behavior of single metal systems in various lixiviants such as acids, cyanide and ammonia. It has been observed that the presence of other metals in alloys would significantly affect the dissolution rate of the metal in question. The leaching behavior of metals from homogeneous alloys relies on the chemical interaction between atoms in the lattice of the alloys, while that from heterogeneous alloys is affected by galvanic interaction established in the solution The manner in which the dissolution of a certain metal is influenced by surrounding metals has been discussed in terms of pas-sive and noble nature of the metal in relation to the neighboring metals. The role of the standard electrochemical Potential of these metals on the selective dissolution for a given lixiviant has also been discussed.

• Tribology and Lubricants
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• v.24 no.1
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• pp.27-33
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• 2008

A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${\mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760\;{\mu}m$ was investigated in the stress range of $8{\sim}60\;MPa$ and at $303\;K{\sim}393\;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.

• Journal of Powder Materials
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• v.24 no.5
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.327-332
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• 2019

Recently, inverter control systems have attracted immense attention to increase the energy efficiency. However, such systems use repeated on/off high currents for linear operation control, instead of the prevalent step variable current control method. Hence, there arise concerns of personal and property damage, especially due to the durability, explosive characteristics, and operating speed of the fuse, which is responsible for safety and is one of the internal components using current control. Therefore, in this paper, we propose an IEC60127-4 SMD sub-miniature fuse, consisting of Ag-Cu alloys and ceramic powder for arc soothing. The IEC60127-4 SMD sub-miniature fuse has high durability and cut-off capacity, and operates safely in dangerous circumstances caused by the inverter control system.

• Journal of Conservation Science
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• v.27 no.1
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• pp.1-11
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• 2011

For the silver artifacts in the Koryo Dynasty excavated from Neungnae-ri Ganghwa island, the metallographic section analysis and hardness and chemical analysis were conducted. After making samples in the similar ratio of the composition concentration, the changes of the microstructure were checked according to the working method and temperature. The results show that those silver artifacts are Au-Cu alloys with 2 to 6 % of Cu. From the results it is judged that Cu was artificially alloyed with them to keep the proper hardness and identified that they were gilded by the amalgamation process seeing that mercury was included at the guilt layer. Also the porous texture on the surface of them could be formed at over $400^{\circ}C$, therefore, it is assumed the hot working or heat treatment at over $400^{\circ}C$ were performed. In silver artifacts made by the relief and repousse, they have the similar composition analysis to other 7 artifacts but the hardness is lower than pure silver. Consequently from differences in the hardness, it can be inferred that the low hardness of silver artifacts is concerned with manufacturing techniques.

• Transactions on Electrical and Electronic Materials
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• v.1 no.2
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• pp.32-37
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• 2000

Effect of alloying element additions to Ag on thermal conductivity and electrical conductivity of sheath materials for Bi-Pb-Sr-Ca-Cu-O(BSCCO) tapes has been characterized. The thermal conductivity at low temperature range (10~300K) of Ag and Ag alloys were evaluated by both direct and indirect measurement techniqueas and compared with each other, It was observed that the thermal conductivity decreases with increasing the content of alloying element such as Au, Pd and Mg. Thermal conductivity of pure Ag at 3 0K was measured to be 994.0 W(m.K) on the other hand, the corresponding values of $Ag_{0.9995}Mg_{0.0005}$, $Ag_{0.974}$, $Au_{0.025}$, $Mg_{0.001}$, $Ab_{0.973}$, $Au_{0.025}$, $Mg_{0.002}$ and $Ag_{0.92}$, $Pb_{0.06}$, $Mg_{0.02}$ were 342.6, 62.1, 59.2 and 28.9 W(m.K), respectively, indicating 3 to 30 times lower than that of pure Ag. In addition, the thermal conductivity of pure Ag measured by direct and indirect measurement techniques was 303.2 and 363.8 W(m.K) The difference in this study is considered to be within an acceptable error range compared to the reference data.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.