• Title/Summary/Keyword: Crystalline epoxy

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Curing Reaction of Noble Liquid Crystalline Epoxy (LCE) with Azomethine/Aliphatic Amine (Azomethine 기를 가지는 신소재 액정 에폭시 (LCE)와 지방족 아민의 경화반응)

  • Kim, Sang-Uk
    • Korean Journal of Materials Research
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    • v.11 no.9
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    • pp.786-791
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    • 2001
  • $\alpha$,$\omega$-Bis(4-glycidyloxybenzylidene-4-aminophenyl)methane (BGBAM) was synthesized from the initial materials, 4-hydroxylbenzaldehyde (HBA), 4,4'-methylenedianiline (MDA) and epichlorohydrin. The DSC trace for BGBAM shows two endotherms associated with the liquid crystalline phase transition around $104.2^{\circ}C$ and the isotropic transition around $171.2^{\circ}C$, and it also has a broad exotherm in the range of $178~300^{\circ}C$ due to the anionic homopolymerization of BGBAM. DSC curve for the curing of BGBAM with hexamethylene diamine (HMD) shows an endothermic peak around $93^{\circ}C$ attributed to the melting of BGBAM. It also has three exothermic peaks around $128.4^{\circ}C$ and $180.2^{\circ}C$ associated with the epoxide-amine reaction and weak peak in the range of $200~263^{\circ}C$ related to the anionic homopolymerization between the unreacted epoxide groups. The activation energy values of cure reaction by Kissinger method are 66.5, 67.3 and 90.6 kJ/mol for $T_{pl},\; T_{p2}\; and \;T_{p3},\; respectively$. The kinetic parameters by isoconverional method are similar value to those from Kissinger method.

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Studies on Molding Conditions and Physical Properties of EMC(Epoxy Molding Compounds) fiiled with Crystalline SiO2 for Microelectronic Encapsulation (결정성 SiO2 충진 EMC(Epoxy Molding Compounds)봉지재의 성형조건 및 물성에 관한 연구)

  • Kim, Wonho;Bae, Jong-Woo;Kang, Ho-young;Lee, Moo-Jung;Choi, II-Dong
    • Applied Chemistry for Engineering
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    • v.8 no.3
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    • pp.533-542
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    • 1997
  • Due to the trends of faster and denser circuit design, dielectric properties of packaging materials for semiconductor will give a greater influence on performance and reliability. Also as chip becomes more densified, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semiconductor packaging materials are low values of dielectric constant, high values of thermal conductivity, relatively low values of thermal expansion coefficient and low cost. Thus, in this study, to achieve increased performance of EMC, crystalline silica was selected as the filler for epoxy matrix. As a result, when the volume percent of crystal silica was 60~70%, good properties as packaging materials for semiconductor were achieved. In addition, overall molding condition of EMC in this experiment was established.

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Viscous Properties of Epoxy Resin Filled with Rubber Complex-Treated Silica (고무상 복합물로 표면처리 된 실리카를 충전한 에폭시수지의 점성에 관한 연구)

  • Hong, Suk-Pyo;Choi, Sang-Goo
    • Elastomers and Composites
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    • v.26 no.4
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    • pp.296-303
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    • 1991
  • Surface of crystalline silica was sequentially reacted with silane(A 187), liquid $rubber(CTBN{\times}8)$, and vinyl monomer(GMA) in existence of TEA(triethylamine) or BPO(benzoyl peroxide). It was mixed with epoxy resin at a ratio $0{\times}60%$ (vol. % ) of total component. For mixtures, viscous properties were investigated experimentally. 1) Coating ratio depended on pH of mixture and quantity of catalyst. 2) Treated silica represented lower viscosity than untreated. 3) Thixotropic index represented best at silica_content $15{\sim}23%$ and showed more large deviation over $120^{\circ}C$. 4) Relative viscosity followed kernel's at $0{\times}10%$ of silica content and get out of Mooney's at more than 15%.

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Solid-state Chracterization of the HIV Protease Inhibitor

  • Kim, Yong-Ae;Kim, Ae-Ri
    • Bulletin of the Korean Chemical Society
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    • v.23 no.12
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    • pp.1729-1732
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    • 2002
  • The LB71350,(3S, 4R)-Epoxy-(5S)-[[N-(1-methylethoxy)carbonyl]-3-(methylsulfonyl)-L-valinyl]amino]-N-[2-methyl-(1R)-[(phenyl)carbonylpropyl-6-phenylhexanamide, is a novel HIV protease inhibitor. Its equilibrium solubility at room temperature was less than $40{\mu}g/mL.$ It was speculated that the low aqueous solubility might be due to the high crystalline lattice energy resulting from intermolecular hydrogen bonds. The present study was carried out to learn the solid-state characteristics of LB71350 using analytical methods such as NMR, FT-IR and XRD. $^{13}C$ Solid-state NMR, solution NMR, and FT-IR spectra of the various solid forms of LB71350 were used to identify the conformation and structure of the solid forms. The chemical shifts of $^{13}C$ solid-state NMR spectra suggest that the crystalline form might have 3 intermolecular hydrogen bondings between monomers.

Fabrication of a microlens array using a birefringent layer and ferroelectric liquid crystal

  • Lee, Yong-Min;Lee, Kwang-Ho;Choi, Yoon-Seuk;Kim, Jae-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.109-112
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    • 2007
  • A new concept of the microlens array is fabricated using a birefringent layer on the concave microlens array. The stacked layers of liquid crystalline polymer (LCP) and the UV epoxy focus an incident light due to the surface relief structure. The ferroelectric liquid crystal layer was added to control the focusing intensity with a fast switching time.

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The study on the properties of binary mixture(crystalline silica/AIN) filled EMC(Epoxy Molding Compounds) (결정성 실리카/질화 알루미늄 혼합충진에 따른 EMC의 물성 연구)

  • 김원호;홍용우;배종우;황영훈;김부웅
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.41-48
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    • 1999
  • Silica is the most popular materials as a filler of EMC for microelectronic packaging. However, because of its low thermal conductivity, the use of silica is restricted to parts requiring high thermal dissipation. The superior fluidity of EMC can be achieved with a combination of filler size distribution. In this study, physical properties of EMC filled with the crystalline silica(13$\mu\textrm{m}$) which have high fluidity and low cost and the AlN(2 $\mu\textrm{m}$) which have high thermal conductivity and low coefficient of thermal expansion were evaluated by changing the AlN/silica ratios. As a result of the evaluation of physical properties of EMC, the optimum mixing ratio of AlN/crystalline silica was 0.3/0.7. In this condition, binary mixture(AlN/crystalline silica) filled EMC showed superior properties, i.e., in the thermal conductivity, CTE, dielectric constant, flexural strength, and thermal shock resistance without reduction of fluidity.

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Synthesis and Properties of Liquid Crystal Compounds and Epoxy Resin Based Side Chain Liquid Crystal Polymers II. Linear and Crosslinked Epoxy LC Polymers (방향족 액정동족체 및 Epoxy형 측쇄 액정고분자의 합성 및 성질 II. 선형 및 가교형 측쇄 액정고분자)

  • Ahn, Wonsool;Chang, Jin Gyu;Keum, Chang Dae;Park, Lee Soon
    • Applied Chemistry for Engineering
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    • v.9 no.1
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    • pp.71-75
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    • 1998
  • Liquid crystalline compounds with amine terminal group and related linear and cross-linked liquid crystal polymers with epoxy resin structure were synthesized and characterized to develope matrix materials for polymer dispersed liquid display applications. Both linear and crosslinked side chain type liquid crystal polymers made with aromatic amine mesogens and ethylene glycol diglycidyl ether exhibited nematic texture as shown by polarized optical microscope(POM) and their transition temperatures were determined both by DSC and POM. Liquid crystal polymer samples also showed even-odd effect as the spacer length of aromatic amine mesogens were varied, however, the effect was samller than that of low molecular weight mesogens. Changes of nematic-to-isotropic transition($T_{NI}$) of crosslinked type polymer liquid crystals were also disscussed in relation to the concentration change of crosslinking agent 1,10-diaminodecane.

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Microstructural Morphology and Bending Performance Evaluation of Molded Microcomposites of Thermotropic LCP and PA6 (액정폴리머/폴리아미드6 미시복합재료의 내부구조 및 기계적 굽힘성능 평가)

  • ;Kiyoshi Takahashi
    • Composites Research
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    • v.12 no.6
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    • pp.53-64
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    • 1999
  • Microstructural morphology and bending strengths of moulded composites of thermotropic liquid crystalline polymer(LCP) and polyamide 6 (PA6) have been studied as a function of epoxy fraction. Injection-moulding of a composite plaque at a temperature below the melting point of the LCP fibrils generated a multi-layered structure: the surface skin layer with thickness of $65\;-\;120{\mu\textrm{m}}$ exhibiting a transverse orientation; the sub-skin layer with an orientation in the flow direction; the core layer with arc-curved flow patterns. The plaques containing epoxy 4.8vol% exhibited superior bending strength and large fracture strain. With an increase of epoxy fraction equal to and beyond 4.8vol%, geometry of LCP domains was changed from fibrillar shape to lamella-like one, which caused a shear-mode fracture. An analysis of the bending strength of the composite plaques by using a symmetric layered model beam suggested that addition of epoxy component altered not only the microstructural geometry but also the elastic moduli and strengths of the respective layers.

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Synthesis and Properties of Liquid Crystal Compounds and Epoxy Resin Based Side Chain Liquid Crystal Polymers I. Low Molecular Weight Liquid Crystal Compounds (방향족 액정동족체 및 Epoxy형 측쇄 액정고분자의 합성 및 성질 I. 저분자 액정 동족체)

  • Park, Se Kwang;Ahn, Wonsool;Keum, Chang Dae;Park, Lee Soon
    • Applied Chemistry for Engineering
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    • v.9 no.1
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    • pp.66-70
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    • 1998
  • Several liquid crystalline monomers were synthesized and characterized to utilize as new matrix materials of liquid crystal/polymer composite films for display application. Liquid crystalline compounds which have azo group as center link, cyano group at one of the terminal position in common and bromoalkyl(azo(n)), azidoalkyl(AZI(n)), aminoalkyl(ALC(n)) as the terminal group were synthesized and identified respectively by FT-lR, $^1H-NMR$ spectrometer and elemental analysis. All these compounds exhibited nematic liquid crystalline region in the certain temperature range as determined by DSC and polarized optical microscope. These liquid crystalline compounds also showed a typical even-odd effect in both $T_{KN}$ and $T_{NI}$ due to conformational change as the length of terminal alkyl chain, $-(CH_2)n-$. was varied.

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Thermal Properties of Diglycidyl Ether of Terephthalylidene-bis-(4-amino-3-methylphenol) (Diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol)의 열적 성질에 대한 연구)

  • Hyun, Ha-Neul;Choi, Ji-Woo;Cho, Seung-Hyun
    • Composites Research
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    • v.35 no.2
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    • pp.53-60
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    • 2022
  • This study uses Diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol) (DGETAM), an amine hardener 4,4'-diaminodiphenylethane (DDE) and cationic catalyst N-benzylpyrazinium hexafluoroantimonate (BPH) to make epoxy film. For analysis, 1H_NMR and FT-IR were used to verify proper synthesis, and the liquid crystallinity of DGETAM was checked using Differntial Scanning Calorimetry and Polarized Optical Microscopy. Thermal conductivity of the sample was measured using Laser Flash Apparatus. Thermal stability as well as thermal conductivity is important when used as a packaging material. Activated energy is the energy needed to generate a response, which can be used to estimate the energy required to maintain physical properties. It was obtained using the Arrhenius equation based on the data measured by isothermal decomposition using Thermogravimetric Analysis. Measurement of the thermal conductivity of epoxy films showed higher thermal conductivity when DDE was used, and it was found that thermal conductivity had an effect on thermal stability, given that it represented an activation energy similar to a film with BPH upon 5% decomposition.