• 제목/요약/키워드: Critical materials

검색결과 2,519건 처리시간 0.029초

Flutter Suppression of Cantilevered Plate Wing using Piezoelectric Materials

  • Makihara, Kanjuro;Onoda, Junjiro;Minesugi, Kenji
    • International Journal of Aeronautical and Space Sciences
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    • 제7권2호
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    • pp.70-85
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    • 2006
  • The supersonic flutter suppression of a cantilevered plate wing is studied with the finite element method and the quasi-steady aerodynamic theory. We suppress wing flutter by using piezoelectric materials and electric devices. Two approaches to flutter suppression using piezoelectric materials are presented; an energy-recycling semi-active approach and a negative capacitance approach. To assess their flutter suppression performances, we simulate flutter dynamics of the plate wing to which piezoelectric patches are attached. The critical dynamic pressure drastically increases with our flutter control using a negative capacitor.

Effect of Critical Cooling Rate on the Formation of Intermetallic Phase During Rapid Solidification of FeNbHfBPC Alloy

  • Kim, Song-Yi;Oh, Hye-Ryeong;Lee, A-Young;Jang, Haneul;Lee, Seok-Jae;Kim, Hwi-Jun;Lee, Min-Ha
    • 한국주조공학회지
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    • 제41권3호
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    • pp.235-240
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    • 2021
  • 진공 가스분사법으로 제조된 Fe75B13P5Nb2Hf1C4 합금의 응고중 액상의 크기와 이에 따른 냉각속도의 변화가 정출상의 형성에 미치는 영향에 대한 고찰을 하였다. 고온 액상에서 동일한 조건으로 응고된 서로 다른 크기의 액상이 구형의 분말형태로 응고될 때 크기에 따른 임계냉각속도의 차이를 계산하였으며, 액상의 평균 반지름이 3배정도 크기 차이가 날 경우 고상으로 변태할 때 임계냉각속도가 13.5배까지 차이가 나는 것을 알 수 있었다. 이러한 임계냉각 속도의 차이에 따른 정출상의 형성과 정출상의 형태와 크기에 따른 탄화물의 형성 거동을 조사하여 열역학 계산으로 예측된 결과와 비교 분석하였으며, 분말입자의 크기가 20~45 마이크론일 경우 Hf과 Nb이 포함된 MC타입의 탄화물이 초정으로 형성 되는 것을 알 수 있었으며 이때 Hf과 Nb의 비율은 합금의 조성 및 냉각속도에 따라 변화됨을 관찰 할 수 있었다.

중성자 조사용 전기도체의 첨가물 효과 (Effect of Metal Oxide of Ceramic Superconductor for Neutron beam Irradiation)

  • 이상헌;최용
    • 전기학회논문지
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    • 제57권3호
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    • pp.429-432
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    • 2008
  • Much studies have been concentrated to develop the fabrication technique for high critical current density but still there are a lot of gap which should be overcome for large scale application of superconducting materials at liquid nitrogen temperature. The improvement of the critical current can be achieved by forming the nano size defect working as a flux pinning center inside the superconductor. In this paper, the establishment of fabrication condition and additive effects of second elements were examined so as to improve the related properties to the practical use of superconductor.

Fabrication of Oxide Thick Film for Renewable Electrical Energy Storage Technology

  • Lee, Sang-Heon
    • Transactions on Electrical and Electronic Materials
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    • 제6권4호
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    • pp.186-189
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    • 2005
  • We have fabricated superconducting HTSC ceramic thick films by chemical process. c-axis oriented HTSC thick films have been attempted bi-axially textured Ni tapes. The x-ray diffraction pattern of the HTSC thick films contained superconducting phase crystal. The critical temperature and critical current density was 110K.

동적 재결정에 의한 연화를 고려한 열간성험공정 해석 (Analysis of Hot Forming Process with Flow Softening by Dynamic Recrystallization)

  • 방원규;이종수;장영원
    • 소성∙가공
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    • 제10권2호
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    • pp.137-143
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    • 2001
  • The change of flow stress due to dynamic recrystallization during hot forming process is investigated. A series of mechanical tests has been conducted at various temperatures, and constitutive relations and recrystallization kinetics were formulated from the test results. The effect of dynamic recrystallization to the flow stress was implemented to a commercial FEM code by conditioned remapping of state variables. The datum strain of stress compensation was optimized to minimize the overestimation of forming loads. Suggested datum was formulated as an exclusive function of critical strain for recrystallizalion and validated by mechanical tests and microstructural observations.

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Bi-2223테이프의 과임계전류 특성 (Over-critical current characteristics of a Bi-2223 tape)

  • 박권배;이성수;류경우;이지광;차귀수
    • 한국초전도저온공학회:학술대회논문집
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    • 한국초전도저온공학회 2000년도 KIASC Conference 2000 / 2000년도 학술대회 논문집
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    • pp.128-129
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    • 2000
  • The over-critical current behaviors for bare or insulated Bi-222 tapes with different matrix materials have been examined. The result shows that static resistances of the two bare tapes becomes similar for currents above 150 A but different for currents below. In the insulated A tape the first rapid temperature rise occurred around 180 A and eventually burned out about 190A.

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Design Study of Adhesively Bonded Structures

  • Chung, Jae-Ung
    • 한국CDE학회논문집
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    • 제14권2호
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    • pp.122-128
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    • 2009
  • The failure responses of adhesively bonded, hat stiffened structures are studied through numerical analysis using the finite element method. The responses are evaluated numerically for the bonded hat section/substrate structures containing different combinations of materials. It is studied what kind of material combinations causes the easier crack initiation in the structure. This study is conducted under plane strain conditions and J-integral via a commercial code ABAQUS as a total critical energy release criterion was used for observation on crack initiation. Also, the influence of adhesive on the structure is studied.