• Journal of the Korean Institute of Gas
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• v.5 no.4 s.16
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• pp.33-39
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• 2001

This paper was studied on corrosion behavior of absorption refrigeration systems using $LiBr-H_2O$ working fluids. In the various concentration of lithium bromide solution, polarization test of SS 400, Cu(C1220T-OL) and Al-Ni bronze is carried out. And the corrosion behavior of materials forming absorption refrigeration systems is investigated. The main results are as following: 1) As concentration of lithium bromide solution increases, polarization resistance of materials of each kinds is low. And open circuit potential becomes less noble, the corrosion current density is high drained 2) Open circuit potential of SS 400 is less noble than that of Cu and Al-Ni bronze, corrosion current density of SS5 400 is high drained than that of Cu and Al-Ni bronze. 3) Anodic polarization of Cu and Al-Ni bronze in $62\%$ LiBr solution continues the active state. that of Cu and Al-Ni bronze in the natural sea water maintains the active state and the critical current for passivation appears.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2002.05a
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• pp.147-152
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• 2002

This paper was studied on corrosion of heat exchanger tube for absorption refrigeration machine. In the 62 % lithium bromide solution at $60^{\circ}C$, polarization test of Cu, Al-brass, 10 % cupro nickel(90-10 % Cu-Ni) and 30 % cupronickel(70-30 % Cu-Ni) tube was carried out. And polarization behavior, polarization resistance characteristics, open circuit potential, anodic polarization of heat exchanger tube for absorption refrigeration machine were considered. The main results are as following: The open circuit potential of Al-brass tube becomes less noble than that of Cu tube, corrosion current density of that becomes lower than Cu tube. The open circuit potential of cupronickel tube is more noble than that of Cu tube, corrosion current density of that is controlled than Cu tube. The passivation critical current of 30 % Cu-Ni tube is lower than that of 10 % Cu-Ni tube, potential of passive region of that is more wide than 10 % Cu-Ni tube.

• Current Photovoltaic Research
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• v.5 no.4
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• pp.105-108
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• 2017

The reactive ion etching (RIE) technology which enables nano-texturatization of surface is applied on monocrystalline silicon solar cell. The additional RIE process on alkalized textured surface further improves the blue response and short circuit current. Such parameter is characterized by surface reflectance and quantum efficiency measurement. By varying the RIE process time and matching the subsequent processes, the absolute efficiency gain of 0.13% is achieved. However, the result indicates potential efficiency gain could be higher due to process integration. The critical etch process time is discussed which minimizes both front surface reflectance and etching damage, considering the challenges of required system throughput in industry.

• Journal of the Korean Institute of Gas
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• v.6 no.1 s.17
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• pp.92-97
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• 2002

This paper was studied on corrosion characteristics of gas absorption refrigeration & hot water system using $LiBr-H_2O$ working fluids. In the $62\%$ lithium bromide solution at $60^{\circ}C$, polarization test of Cu, $10\%$ cupronickel($90-10\%$ Cu-Ni) and $30\%$ cupronickel($70-30\%$ Cu-Ni) tube was carried out. And polarization behavior, polarization resistance characteristics, open circuit potential, anodic polarization of heat exchanger tube for gas absorption refrigeration & hot water system were considered. The main results are as following: 1) Polarization resistance of heat exchange tubes appears high in order of $30\%$ cupronickel tube > $10\%$ cupronickel tube > Cu tube. B) Open circuit potential of cupronickel tube is more noble than that of Cu tube, and corrosion current density of cupronickel is controlled than Cu tube. 3) Potential of passive region of $30\%$ cupronickel tube is more wide than that of $10\%$ cupronickel tube, and the passivation critical current of $30\%$ cupronickel tube is lower than that of $10\%$ cupronickel tube.

• Corrosion Science and Technology
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• v.23 no.4
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• pp.310-314
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• 2024

The corrosion behavior of high chromium white cast iron was studied in 0.5 mol dm^-3 H₂SO₄ + 0.01 mol dm^-3 HCl solution over time through electrochemical and immersion experiments. Potentiodynamic and potentiostatic polarizations revealed active-passivation transition behavior, with critical current densities observed at -0.27 V_SSE and 0.00 V_SSE, repectively. The former potential showed preferential dissolution of primary γ phases, while the latter one showed preferential dissolution of eutectic γ phases. Immersion tests showed an exponential increase in corrosion rate, with significant acceleration observed around 1000 seconds due to the onset of eutectic γ phase dissolution. Over a 24-hour immersion period, both γ phases exhibited extensive corrosion, leaving carbides largely intact. These findings elucidate distinct corrosion behaviors of high chromium white cast iron in acidic environments, providing critical insights into material performance evaluation. Understanding these mechanisms is essential for predicting the longevity and durability of materials in corrosive conditions, thereby informing better material design and application strategies.

• Tribology and Lubricants
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• v.31 no.3
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• pp.79-85
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• 2015

RC delay is a critical issue for achieving high performance of ULSI devices. In order to minimize the RC delay time, we uses the CMP process to introduce high-conductivity Cu and low-k materials on the damascene. The low-k materials are generally soft and fragile, resulting in structure collapse during the conventional high-pressure CMP process. One troubleshooting method is electrochemical mechanical polishing (ECMP) which has the advantages of high removal rate, and low polishing pressure, resulting in a well-polished surface because of high removal rate, low polishing pressure, and well-polished surface, due to the electrochemical acceleration of the copper dissolution. This study analyzes an electrochemical state (active, passive, transpassive state) on a potentiodynamic curve using a three-electrode cell consisting of a working electrode (WE), counter electrode (CE), and reference electrode (RE) in a potentiostat to verify an electrochemical removal mechanism. This study also tries to find optimum conditions for ECMP through experimentation. Furthermore, during the low-pressure ECMP process, we investigate the effect of current density on surface roughness and removal rate through anodic oxidation, dissolution, and reaction with a chelating agent. In addition, according to the Faraday’s law, as the current density increases, the amount of oxidized and dissolved copper increases. Finally, we confirm that the surface roughness improves with polishing time, and the current decreases in this process.

• Journal of Advanced Marine Engineering and Technology
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• v.21 no.5
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• pp.535-541
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• 1997

The effect of concentration of each solution( HCI, $H_2SO_4$ and $HNO_3$), scan rate and polished surface condition on the corrosion of AISI 304 Stainless Steel were investigated, utilizing the Method ASTM G5 - 87. It can be concluded that: 1) For the same concentration(i.e. 1N) of each solution the corrosion rate is the highest in HCI and lowest in $HNO_3$. Also, the difference of values of $i_{cirt}$ generated for each solution is significant. 2) As the concentration of the solution $H_2SO_4$ is increased (O.5N, 1N, 2N) the values of $E_{cor}$ $i_{crit}$ and $i_{p}$ are increased. 3) In case of existence of SCN ion of O.OlN, the values of iCTIt and ip generated are approximately 100 times and 1.4 times higher respectively, than in the case of non - existence of $SCN^{-}$. However the existence of $SCN^{-}$ doesn't affect the value of $E_{cor}$ and $E_{p}$. 4) The values of $i_{crit}$ and $i_{p}$ are increased due to the increase of scan rate. But the values of $E_{cor}$ and $E_{p}$ do not depend on the scan rate. 5) The $i_{p}$ value depends greatly on oxygen in the solution, but the changes in values of $E_{cor}$ $i_{crit}$ and $E_{b}$ due to the oxygen are insignificant. 6) If a component is polished using #400, #600 and #800 wet polish paper, the effect of surface condition on variations of values of $i_{crit}$ and $i_{p}$ is slightly significant.

• Journal of the Korean Vacuum Society
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• v.15 no.1
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• pp.89-96
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• 2006

Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to less than $0.25{\mu}m$, which results in high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in Ag, Cu, Au, and Al thin films, etc. EM resistance characteristics of Ag, Cu, Au, and Al thin films with high electrical conductivities were investigated by measuring the activation energies from the TTF (Time-to-Failure) analysis. Optical microscope and XPS (X-ray photoelectron spectroscopy) analysis were used for the failure analysis in thin films. Cu thin films showed relatively high activation energy for the electromigration. Thus Cu thin films may be potentially good candidate for the next choice of advanced thin film interconnection materials where high current density and good EM resitance are required. Passivated Al thin films showed the increased MTF(Mean-time-to-Failure) values, that is, the increased EM resistance characteristics due to the dielectric passivation effects at the interface between the dielectric overlayer and the thin film interconnection materials.