• Journal of the Korea Concrete Institute
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• v.28 no.5
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• pp.535-544
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• 2016

This paper aims at examining the effects of sustained load and elevated temperature on the time-dependent deformation of a carbon fiber reinforced polymer (CFRP) sheets bonded to concrete as well as the pull-off strength of single-lap shear specimens after the sustained loading period using digital images. Elevated temperature during the sustained loading period resulted in increased slip of the CFRP composites, whereas increased curing time of the polymer resin prior to the sustained loading period resulted in reduced slip. Pull-off tests conducted after sustained loading period showed that the presence of sustained load resulted in increased pull-off strength and interfacial fracture energy. This beneficial effect decreased with increased creep duration. Based on analysis of digital images, results on strain distributions and fracture surfaces indicated that stress relaxation of the epoxy occurred in the 30 mm closest to the loaded end of the CFRP composites during sustained loading, which increased the pull-off strength provided the failure locus remained mostly in the concrete. For longer sustained loading duration, the failure mode of concrete-CFRP bond region can change from a cohesive failure in the concrete to an interfacial failure along the concrete/epoxy interface, which diminished part of the strength increase due to the stress relaxation of the adhesive.

• Journal of the Korea Concrete Institute
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• v.14 no.4
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• pp.521-529
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• 2002

A restraint coefficient for creep and dry shrinkage deformation of concrete in a composite section was derived to calculate the residual stress, and an equation for the loss rate of the pre-compression force was proposed. The derived restraint coefficient was computed by using the transformed section properties for the age-adjusted effective modulus of elasticity. The long-term behavior of complicate composite sections could be analyzed easily with the restraint coefficient. The articles of the current design code was examined for PSC and steel composite sections. The dry shrinkage strains of $150 ~ 200$\times$10^{-6}$ for the computations of the statically indeterminate force and the expansion joint could be under-estimated for less restrained sections such as the reinforced concrete. The dry shrinkage strain of $180$\times$10^{-6}$ for the computation of residual stress in the steel composite section was unreasonably less value. The loss rate of 16.3% of the design code for the PSC composite section in this study was conservative for the long-term deformation of the ACI 205 but could not be used safely for that of the Eurocode 2. For pre-compressed concrete slab in the steel composite section, the loss rate of prestressed force with low strength reinforcement was much larger than that with high strength tendon. The loss rate of concrete pre-compression increased, while that of pre-tension decreased due to the restraint of the steel girder.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Ceramic Society
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• v.45 no.9
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• pp.549-555
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• 2008

The thermal barrier coating must withstand erosion when subjected to flowing gas and should also maintain good stability and mechanical properties while it must also protect the turbine component from high temperature, hot corrosion, creep, and oxidation during operation. In this study we investigated the influence of subsurface layer, $Al_2O_3$ or NiCrCoAIY bond coat layer, on the indentation damage behavior of YSZ thermal barrier coating layers deposited by electron beam physical vapor deposition (EB-PVD). The bond coat is deposited using different process such as air plasma spray (APS) or spray of high velocity oxygen fuel (HVOF) and the thickness is varied. Hertzian indentation technique is used to induce micro damages on the coated layer. The stress-strain behaviors are characterized by results of the indentation tests.

• Journal of Welding and Joining
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• v.33 no.4
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• pp.30-36
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• 2015

Austenite stainless steel(SA213-TP347H) has widely been used for the superheater & reheater tube in USC(ultra-supercritica) coal boiler because of its high creep rupture strength and anti-oxidation. But recently, the short-term failures have happened frequently in heat affected zone for only 4,000~15,000hours of service. Many investigations have been conducted to understand the failure mechanism. The root cause of failure was comfirmed to "strain induce participation hardening crack" or "reheat cracking". This mechanism often occurred due to weld residual stress and precipitation of the Cr, Nb carbides in the stabilized stainless steel such as TP347H. This paper presents an analysis of failure tube and effect of the sample tubes that conducting stabilizing heat treatment in site after 11,380hours & 16,961hours of service. Visual inspection was performed. In addition, microscopic characteristics was identified by O.M, SEM, and hardness test was carried out to find out the heat treatment effects. Failures seem to happen because of being not conducted stabilizing heat treatment in site. And another cause is inadequate weld parameter such as pass, ampere, voltage, inter-pass temperature. Thus, this paper has the purpose to describe that how to prevent similar failures in those weld-joints.

• Smart Structures and Systems
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• v.13 no.3
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• pp.353-374
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• 2014

Recent studies were dedicated to the realization of measurements on stay-cable samples of different geometry and static conditions as available at several facilities. The elaboration of the acquired data showed a a satisfactory efficacy of the dampers made of NiTi wires in smoothing the cable oscillations. A further attempt to investigate the applicability of the achieved results beyond the specific case-studies represented by the tested cable-stayed samples is herein pursued. Comparative studies are carried out by varying the diameter of the NiTi wire so that similar measurements can be taken also from laboratory steel cables of reduced size. Details of the preparation of the Ni-Ti wires are discussed with particular attention being paid to the suppression of the creep phenomenon. The resulting shape of the hysteretic cycle differs according to the wire diameter, which affects the order of the fitting polynomial to be used when trying to retrieve the experimental results by numerical analyses. For a NiTi wire of given diameter, an estimate of the amount of dissipated energy per cycle is given at low levels of maximum strain, which correspond to a fatigue fracture life of the order of millions of cycles. The dissipative capability is affected by both the temperature and the cycling frequency at which the tests are performed. Such effects are quantified and an ageing process is proposed in order to extend the working temperature range of the damper to cold weathers typical of the winter season in Northern Europe and Canada. A procedure for the simulation of the shape memory alloy behavior in lengthy cables by finite element analysis is eventually outlined.

• Geotechnical Engineering
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• v.12 no.2
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• pp.59-70
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• 1996

The EPS has the unit weight of only 20~30kg/m3 and is used as one of the methods of reducing road embankment loads. Parts of it's applications are for backfill materials of structures like abutment, retaining wall, etc., to reduce horizontal earth pressure and for banking materials to secure the safety of settlement and bearing capacity by minimizing the stress Increment. However, the Korean Standards (KS) has not yet proposed any testing method for use of EPS as a engineering banking material. Only its testing and quality ordinance as a heat insulation material has been standardized. Therefore, in Korea, EPS is used as banking material without any systematic testing data as a civil engineering material. In this point of view, this paper deals with the engineering characteristics of EPS through many laboratory tests on strength, strain, absorption, and creep. from the results achived through tests, this paper proposes the enactment of a suitable quality testing ordinance and the criteria of unconfined design strength of EPS for use as engineering material.

• Journal of the Korea institute for structural maintenance and inspection
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• v.14 no.4
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• pp.119-125
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• 2010

The performance deformation of concrete can be caused by many factors such as load, thermal strain and creep at high temperature. Japan, Europe and America have been doing various experimental studies to solve these problems about thermal properties of concrete at high temperature, each study has generated different results due to a heating methods, heating hours, size of specimens and performance of a the loading, heating method, size of specimen and heating machine. There has been no unified experimental method so far. Therefore, this study reviewed experimental studies on the strength performance of concrete subject to heating and loading method. As a result, compressive strength of specimen prestressed increase in the temperature range of between $100^{\circ}C$ and about $400^{\circ}C$. Also, results can be analyzed as compare equation of compressive strength at elevated temperature with CEN and CEB code.

• Magazine of the Korean Society of Agricultural Engineers
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• v.39 no.3
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• pp.72-82
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• 1997

In all inelastic deformations time rate effects are always present to some degree. Whether or not their exclusion has a significant influence on the prediction of the material behaviour depends upon several factors. In the study of structural components under static loading conditions at normal temperature it is accepted that time rate effects are generally not important. However metals, especially under high temperatures, exhibit simultaneously the phenomena of creep and viscoplasticity. In this study, elastoplastic and elasto-viscoplastic models include nonlinear geometrical effects were developed and several numerical examples are also included to verify the computer programming work developed here in this work. Comparisons of the calculated results, for the elasto-viscoplastic analysis of an internally pressurised thick cylinder under plane strain condition, have shown that the model yields excellent results. The results obtained from the numerical examples for an elasto-viscoplastic analysis of the Nuclear Reinforced Concrete Containment Structure(NRCCS) subjected to an incrementally applied internal pressure were summarized as follows : 1. The steady state hoop stress distribution along the shell layer of dome and dome wall junction part of NRCCS were linearly behave and the stress in interior surfaces was larger than that in exterior. 2.However in the upper part of the wall of NRCCS the steady state hoop stress in creased linearly from its inner to outer surfaces, being the exact reverse to the previous case of dome/dome-wall junction part. 3.At the lower part of wall of NRCCS, the linear change of steady state hoop stress along its wall layer began to disturb above a certain level of load increase.