• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.1
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• pp.1-7
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• 2007

As fiber reinforced composite materials are widely used in aircraft, space structures and robot arms, the study on non-destructive testing methods has become an important research area for improving their reliability and safety. AE (acoustic emission) can evaluate the defects by detecting the emitting strain energy when elastic waves are generated by the initiation and growth of crack, plastic deformation, fiber breakage, matrix cleavage, or delamination. In the paper, AE signals generated under uniaxial tension were measured and analyzed using the $8{\times}8$ matrix piezo electric sensor. The electronic circuit to control the transmitting distance of AE signals was designed and constructed. The optical data storage system was also designed to store the AE signal of 64channels using LED (light emitting diode) elements. From the tests, it was shown that the source location and propagation path of AE signals in composite materials could be detected effectively by the $8{\times}8$ matrix piezo electric sensor.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.