• Title/Summary/Keyword: Cr 박막

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Effects of Sputter Deposition Rate on the Thin Film Property (Sputtering 성막속도가 박막의 특성에 미치는 영향)

  • Lee, Ky-Am
    • Journal of the Korean Vacuum Society
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    • v.2 no.2
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    • pp.152-160
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    • 1993
  • In this study, we have investigated the influence of sputtering conditions (Ar pressure input powers, substrates) on coercivity and microstructures of GdFe, Co, CoCr thin films produced by the method of DC magnetron sputtering. In GdFe films, we have observed that the Gd atomic ratio was decreased with the deposition rate, and deposition rate decreased with the pressure of Ar gas and the increased linearly with input power. It was also observed that the coercivity of thin films was increased with input power. In Co films, we have investigated the deposition was increased and the Co thin film became finer structure with the increase in the input power, was increased and the Co thin film became finer structure with the increase in the input power, and the deposition rate was decreased with the pressure of Ar gas. In CoCr films, we have investigated the effects of substrates on the coercivity $(H_c)$ and the microstructure. We have found that the substrates plays a crucial role in the microstructure and the coercivity $(H_c)$.

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A Study on the YAG Laser Machining of Cr Thin Films (YAG 레이저에 의한 Cr박막가공에 관한 연구)

  • 강형식;홍성준;박홍식;전태옥
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.1053-1057
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    • 1997
  • Laser thin film process with a Q-switch pulsed YAG laser was performed for micro machining. In this research, we performed basic Cr thin film on glass substrates removal machining experiments. Form experiments, it happens not only evaporration of thin film but also spatter and cohesion of melting substance in working region, when machining a Cr thin film by Q-switch YAG laser beam irradiation. Critical energy of surface irradiation type by irradiation direction of laser in a face composing thin film on the glass is higher than that of back irradiation type, but the latter is favorable because of spatter appearance. In case of image formation position when laser beam is irradiated, the defocus is permitted to a certain extent within forcus depth. Ifexceeds focus depth, formation of pattern is vanishing step by step.

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The change of magnetic microstructure with Co-22%Cr film thicknesses (Co-22%Cr 자성합금박막에서 박막두계에 따른 자기미세구조 변화)

  • 송오성
    • Journal of the Korean institute of surface engineering
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    • v.31 no.5
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    • pp.261-265
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    • 1998
  • We investigated compositional separation of Co-23%Cr magnetic alloy thin films with varying film thicknesses. Saturation magnetization and magnetic microstructures were investigated using vibrating sample magnetometer (VSM) and scanning probe microscope (SPM), respectively. Saturation magnetization was as 700 emu/cc for films below 50 nm-thick, and changed to 430 emu/cc for the ones above 2000 nm-thick. This may be due to increment of molar volume of Cr-enriched phase as film thickness increases. The surface grain size in AFM (atomic force microscope) measurement becomes larger as film thickness increases. The MFM (magnetic force microscope) reveals that magnetic microstructure is changed from the fine spherical domains to the maze type domains as film thickness increases. We conclude that employing thickness of Co-22%Cr films below 50 nm is favorable for high density recording in order to enhance perpendicular saturation magnetization and SNR (signal to noise ratio).

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The effects of Cu thin films sputter deposited at 5 and 100 mtorr on the adhesion between Cu/Cr film and polyimide (5, 100 mtorr의 증착압력에서 스퍼터 증착한 구리박막층이 Cu/Cr 박막과 폴리이미드 사이의 접착력에 미치는 영향)

  • 조철호;김영호
    • Journal of the Korean institute of surface engineering
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    • v.29 no.3
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    • pp.157-162
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    • 1996
  • The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

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