• Journal of Sensor Science and Technology
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• v.9 no.4
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• pp.274-280
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• 2000

This paper deals with an experimental study to apply commercial semiconductors to measure radiation dose rate for gamma ray. Since the low cost, small size, high efficiency and ruggedness of silicon photodiodes make them attractive photodetectors, they coulde be effectively used in measuring any radiation such as gamma ray. Most PN photodiodes show that the reverse current increases when the light is increased. Therefore the depletion region of them have influence on the reverse current, so we choose silicon PIN photodiodes with large depletion region. In order to detect radiation dose rate and then, to apply in developing any gamma ray dosimeter, some examinations and experiments were performed to PIN photodiodes in this work. Two kinds of PIN photodiodes, such as NEC's PH302 and SIEMENS's BPW34, were tested in a Co-60 gamma irradiation facility with a semiconductor parameter analyzer. As a result, we found that such PIN photodiodes present good linearity in diode current characteristics with dose rate. Therefore silicon PIN photodiodes could be suitably used in designing gamma ray dosimeters.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.3_1spc
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• pp.518-524
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• 2013

Recently, probabilistic assessments of nuclear power plant components have generated interest in the nuclear industries, either for the efficient inspection and maintenance of older nuclear plants or for improving the safety and cost-effective design of newly constructed nuclear plants. In the present paper, the partial safety factor (PSF) of wall-thinned nuclear piping is evaluated based on a reliability index method, from which the effect of each statistical variable (assessment parameter) on a certain target probability is evaluated. In order to calculate the PSF of a wall-thinned pipe, a limit state function based on the load and resistance factor design (LRFD) concept is first constructed. As for the reliability assessment method, both the advanced first-order second moment (AFOSM) method and second-order reliability method (SORM) are employed to determine the PSF of each probabilistic variable. The present results can be used for developing maintenance strategies considering the priorities of input variables for structural integrity assessments of wall-thinned piping, and this PSF concept can also be applied to the optimal design of the components of newly constructed plants considering the target reliability levels.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.341-341
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• 2012

Recently, oxide semi-conductor materials have been investigated as promising candidates replacing a-Si:H and poly-Si semiconductor because they have some advantages of a room-temperature process, low-cost, high performance and various applications in flexible and transparent electronics. Particularly, amorphous indium-gallium-zinc-oxide (a-IGZO) is an interesting semiconductor material for use in flexible thin film transistor (TFT) fabrication due to the high carrier mobility and low deposition temperatures. In this work, we demonstrated improvement of flexibility in IGZO TFTs, which were fabricated on polyimide (PI) substrate. At first, a thin poly-4vinyl phenol (PVP) layer was spin coated on PI substrate for making a smooth surface up to 0.3 nm, which was required to form high quality active layer. Then, Ni gate electrode of 100 nm was deposited on the bare PVP layer by e-beam evaporator using a shadow mask. The PVP and $Al_2O_3$ layers with different thicknesses were used for organic/inorganic multi gate dielectric, which were formed by spin coater and atomic layer deposition (ALD), respectively, at $200^{\circ}C$. 70 nm IGZO semiconductor layer and 70 nm Al source/drain electrodes were respectively deposited by RF magnetron sputter and thermal evaporator using shadow masks. Then, IGZO layer was annealed on a hotplate at $200^{\circ}C$ for 1 hour. Standard electrical characteristics of transistors were measured by a semiconductor parameter analyzer at room temperature in the dark and performance of devices then was also evaluated under static and dynamic mechanical deformation. The IGZO TFTs incorporating hybrid gate dielectrics showed a high flexibility compared to the device with single structural gate dielectrics. The effects of mechanical deformation on the TFT characteristics will be discussed in detail.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.68-68
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• 2011

As feature size is smaller, new technology are needed in semiconductor factory such as gap-fill technology for sub 100nm, development of ALD equipment for Cu barrier/seed, oxide trench etcher technology for 25 nm and beyond, development of high throughput Cu CMP equipment for 30nm and development of poly etcher for 25 nm and so on. We are focus on gap-fill technology for sub-30nm. There are many problems, which are leaning, over-hang, void, micro-pore, delaminate, thickness limitation, squeeze-in, squeeze-out and thinning phenomenon in sub-30 nm gap fill. New gap-fill processes, which are viscous oxide-SOD (spin on dielectric), O3-TEOS, NF3 Based HDP and Flowable oxide have been attempting to overcome these problems. Some groups investigated SOD process. Because gap-fill performance of SOD is best and process parameter is simple. Nevertheless these advantages, SOD processes have some problems. First, material cost is high. Second, density of SOD is too low. Therefore annealing and curing process certainly necessary to get hard density film. On the other hand, film density by Flowable oxide process is higher than film density by SOD process. Therefore, we are focus on Flowable oxide. In this work, dielectric film were deposited by PECVD with TSA(Trisilylamine - N(SiH3)3) and NH3. To get flow-ability, the effect of plasma treatment was investigated as function of O2 plasma power. QMS (quadruple mass spectrometry) and FTIR was used to analysis mechanism. Gap-filling performance and flow ability was confirmed by various patterns.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.479-479
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• 2011

Flexible inverters based on complementary thin-film transistor (CTFTs) are important because they have low power consumption and other advantages over single type TFT inverters. In addition, integrated CTFTs in flexible electronic circuits on low-cost, large area and mechanically flexible substrates have potentials in various applications such as radio-frequency identification tags (RFIDs), sensors, and backplanes for flexible displays. In this work, we introduce flexible complementary inverters using pentacene and amorphous indium gallium zinc oxide (IGZO) for the p-channel and n-channel, respectively. The CTFTs were fabricated on polyimide (PI) substrate. Firstly, a thin poly-4-vinyl phenol (PVP) layer was spin coated on PI substrate to make a smooth surface with rms surface roughness of 0.3 nm, which was required to grow high quality IGZO layers. Then, Ni gate electrode was deposited on the PVP layer by e-beam evaporator. 400-nm-thick PVP and 20-nm-thick ALD Al2O3 dielectric was deposited in sequence as a double gate dielectric layer for high flexibility and low leakage current. Then, IGZO and pentacene semiconductor layers were deposited by rf sputter and thermal evaporator, respectively, using shadow masks. Finally, Al and Au source/drain electrodes of 70 nm were respectively deposited on each semiconductor layer using shadow masks by thermal evaporator. Basic electrical characteristics of individual transistors and the whole CTFTs were measured by a semiconductor parameter analyzer (HP4145B, Agilent Technologies) at room temperature in the dark. Performance of those devices then was measured under static and dynamic mechanical deformation. Effects of cyclic bending were also examined. The voltage transfer characteristics (Vout- Vin) and voltage gain (-dVout/dVin) of flexible inverter circuit were analyzed and the effects of mechanical bending will be discussed in detail.

• Journal of Biosystems Engineering
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• v.16 no.1
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• pp.60-82
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• 1991

Drying process of red pepper is very important in terms of drying cost and quality of the end product. Recently, many studies on red pepper drying have been performed. Nevertheless, an optimum drying condition is not established yet. Drying characteristics of red pepper is much affected by drying factors such as variety and initial state of red pepper as well as by environmental drying factors such as temperature and relative humidity of drying air. Various varieties of red pepper are being cultivated and the initial state of red pepper at harvest is very ambiguous. For this reason, it is very costly and time-consuming to establish an optimum drying condition of red pepper by experiment. A general drying model to descirbe a drying process has not been developed due to diversity of drying characteristics of red pepper. This study was, therefore, performed to develop a general drying model describing a drying process of red pepper. The results from this study are summarized as follows. 1. A basic model was established to develop an appropriate mositure content model and temperature model describing a drying process of red pepper, and the basic model was validated with experimental data. 2. The bone dry weight of fruit and mositure content were accepted satisfactorily as parameter to define the arbitrary red pepper. 3. The equilibrium moisture content of red pepper was found out to be different according to the variety of red pepper, air temperature and relative humidity. Also, the EMC model was developed using the parameters of air temperature, relative humidity and bone dry weight of fruit. 4. A general drying model for red pepper was developed, parameters of which were expressed as the function of drying factors related with drying phenomena. The developed drying model was found out to describe well the drying process of red pepper.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.5
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• pp.74-81
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• 2013

The high-speed machining in the manufacturing industry field has been widely applied for parts of vehicles, aircraft, ships, electronics, etc., recently, because the effect of cost savings for shortening processing time and improving productivity is great. The purpose in this study is to investigate the effect of cutting depth on the surface roughness of workpiece with the spindle rotational speed and feed rate of high-speed machines as a parameter to find the optimal depth in the finishing for ball end mill of the aluminum alloy 7075 which is used much in aircraft parts. When the cutting depth for the respective feed rate and spindle rotational speed is varied from 0.1 mm to 0.7 mm at intervals of 0.2 mm in the wet finishing of the aluminum alloy 7075 by the insoluble cutting oils and high-speed machining used in the rough machining of previous study, the surface roughness values and the cutting temperature are measured. In addition, the cutting surface shapes of test specimens are observed by optical microscope and compared with respectively. It is found that the surface roughness values and the temperature generated during machining are increased as the feed rate and cutting depth are raised, but those are decreased as the spindle rotational speed is increased.

• Applied Chemistry for Engineering
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• v.7 no.4
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• pp.653-660
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• 1996

For oxygen PSA process development, adsorbed amount of oxygen and nitrogen on various adsorbents were measured corresponding Langmuir isotherm parameters were measured. A reasonable adsorbent for oxygen process was selected based on the effective adsorbed amount. The PSA process consists of adsorption, desorption, pressurization, purging and pressure equilization steps. Adsorption pressure was about 2 atm and desorption pressure was between 120 torr to 400torr. Cycle time of 2-bed PSA process was 80 seconds and that of 3-bed oxygen PSA process was 180 seconds. In order to compare and analyze operation characteristics and economic feasibilities of 2-bed and 3-bed oxygen PSA processes, productivity, oxygen concentration and recovery were compared and the effect of purge and pressurization steps on the performance of PSA processes were analyzed. For the commercial scale oxygen PSA process, capital and electricity cost were estimated. In the range of $O_2$ production less than $700Nm^3/hr$, the 2-bed process is conformed more feasible in economic view point.

• Journal of Internet Computing and Services
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• v.21 no.5
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• pp.75-85
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• 2020

The application of Internet technology has created enormous impact on banking sector with the implementation of many techno-oriented services like Internet banking, EFT, branchless banking, Automated Clearing House (ACH) transactions etc. Study of customer's attitude in terms of trust, perceived risk and ease of use of a particular technology is as an important parameter for acceptance or rejection of a technology. To explore the customers'attitude for Internet banking this research is undertaken. The research is carried out in Pokhara valley which is the second largest city and tourism capital of Nepal. The study employs descriptive research design with stratified sampling procedure for eight top commercial banks. A set of 25 customers is taken from each selected 8 banks making a sample size of 200 respondents. A fixed set of question related to demographic factors is provided personally or by visiting the location of the customers of Internet banking service and collected accordingly. Reliability test is performed using Cronbach's alpha and data is analyzed using inferential statistics to present the results of the study. This study provides knowledge on the current scenario of Internet banking and helps banks in cost saving, mass customization, product innovation, improved marketing and communication. This study is very important for financial institutions like banks, government agencies and business houses to understand the perception of customers towards Internet banking and technology as a whole. The study also supplements the gap in literature on technology and banking in Nepal and serves as an important knowledge base.

• Journal of ILASS-Korea
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• v.25 no.1
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• pp.8-14
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• 2020

Recently, 1-D model-based engine development using virtual engine system is getting more attention than experimental-based engine development due to the advantages in time and cost. Injection rate profile is the one of the main parameters that determine the start and end of combustion. Therefore, it is essential to set up a sophisticated model to accurately predict the injection rate as starting point of virtual engine system. In this research, procedure of 1-D model setup based on AMESim is introduced to predict the dynamic behavior and injection rate of diesel injector. As a first step, detailed 3D cross-sectional drawing of the injector was achieved, which can be done with help of precision measurement system. Then an approximate AMESim model was provided based on the 3D drawing, which is composed of three part such as solenoid part, control chamber part and needle and nozzle orifice part. However, validation results in terms of total injection quantity showed some errors over the acceptable level. Therefore, experimental work including needle movement visualization, solenoid part analysis and flow characteristics of injector part was performed together to provide more accuracy of 1-D model. Finally, 1-D model with the accuracy of less than 10% of error compared with experimental result in terms of injection quantity and injection rate shape under normal temperature and single injection condition was established. Further work considering fuel temperature and multiple injection will be performed.