• Journal of the Korea institute for structural maintenance and inspection
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• v.25 no.4
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• pp.28-36
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• 2021

It is known that buried rebars inside concrete structures are protected from corrosion due to passive layer. It is very important to delay the timing of corrosion or evaluate a detection of corrosion initiation for the purpose of cost-beneficiary service life of a structure. In this study, corrosion monitoring was performed on concrete specimens considering 3 levels of cover depth(60 mm, 45 mm, and 30 mm), W/C(water to cement) ratio(40.0%, 50.0%, and 60.0%) and chloride concentration(0.0%, 3.5%, and 7.0%). OCP(Open Circuit Potential) was measured using agar-based socket type sensors. The OCP measurement showed the consistent behavior where the potential was reduced in wet conditions and it was partially recovered in dry conditions. In the case of 30 mm of cover depth for most W/C ratio cases, the lowest OCP value was measured and rapid OCP recovery was evaluated in increasing cover depth from 30 mm to 45 mm, since cover depth was an effective protection against chloride ion ingress. As the chloride concentration increased, the effect on the cover depth tended to be more dominant than the that of W/C ratio. After additional monitoring and physical evaluation of chloride concentration after specimen dismantling, the proposed system can be improved with increasing reliability of the corrosion monitoring.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.1
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• pp.8-17
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• 2003

Fracture behaviors of pipes with local wall thinning are very important for the integrity of nuclear Power Plant. In Pipes of energy Plants, sometimes, the local wall thinning may result from severe erosion-corrosion (E/C) damage. However, the effects of local wall thinning on strength and fracture behaviors of piping system were not well studied. In this paper, the monotonic bending tests were performed of full-scale carbon steel pipes with local wall thinning. A monotonic bending load was applied to straight pipe specimens by four-point loading at ambient temperature without internal pressure. From the tests, fracture behaviors and fracture strength of locally thinned pipe were manifested systematically. The observed failure modes were divided into four types; ovalization. crack initiation/growth after ovalization, local buckling and crack initiation/growth after local buckling. Also, the strength and the allowable limit of piping system with local wall thinning were evaluated.

• Journal of Power System Engineering
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• v.20 no.6
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• pp.58-63
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• 2016

A stainless steel has high corrosion resistance because of nickel in material, so it is used as materials for transportation and storage of hydrogen. In this study, TIG(tungsten ingot gas) welding was carried out on the stainless steel using the storage vessel of hydrogen. The microscopic structures at each region of TIG welded material such as HAZ, weld and base metals using optical microscope were observed. And the damage behavior of stainless steel that underwent the hydrogen charging using nondestructive evaluation was also studied. Ultrasonic test, which is the most generalized nondestructive technique, was applied to evaluate the relationship between the ultrasonic wave and mechanical properties at each zone of TIG welded stainless steel. The velocity and attenuation coefficients of ultrasonic wave didn't show a remarkable difference at each region of welded stainless steel. However, the attenuation coefficient was the highest at the weld zone when hydrogen charged stainless steel. In addition, acoustic emission test was also used to study the dynamic behavior of stainless steel experienced both hydrogen charging and weld. Lots of AE event at elastic region of stress-strain curve were occurred both the hydrogen charged specimen and the free specimen.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2004.05a
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• pp.337-341
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• 2004

Engineering ceramics have superior heat resistance, corrosion resistance, and wear resistance. Consequently, these art significant candidates for hot-section structural components of heat engine and the inner containment of nuclear fusion reactor. Besides, some of them have the ability to heal cracks and great benefit can be anticipated with great benefit the structural engineering field. Especially, law fracture toughness of ceramics supplement with self-healing ability. In the present study, we have been noticed some practically important points for the healing behavior of silicon nitride, alumina, mullite with SiC particle and whisker. The presence of silicon carbide (SiC) in ceramic compound is very important for crack-healing behavior. However, self-healing of SiC has not been investigated well in detail yet. In this study, commercial SiC was selected as sample, which can be anticipated in the excellent crack healing ability. The specimens were produced three-point bending specimen with a critical semi-circular crack of which size that is about $50-700{\mu}m$. Three-point bending test and static fatigue test were performed cracked and healed SiC specimens. A monotonic bending load was applied to cracked specimens by three-point loading at different temperature. The purpose of this paper is to report Strength Properties and Elastic Waves Characteristics of Silicon Carbide with Crack Healing Ability.

• Journal of the Korean Ceramic Society
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• v.45 no.9
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• pp.549-555
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• 2008

The thermal barrier coating must withstand erosion when subjected to flowing gas and should also maintain good stability and mechanical properties while it must also protect the turbine component from high temperature, hot corrosion, creep, and oxidation during operation. In this study we investigated the influence of subsurface layer, $Al_2O_3$ or NiCrCoAIY bond coat layer, on the indentation damage behavior of YSZ thermal barrier coating layers deposited by electron beam physical vapor deposition (EB-PVD). The bond coat is deposited using different process such as air plasma spray (APS) or spray of high velocity oxygen fuel (HVOF) and the thickness is varied. Hertzian indentation technique is used to induce micro damages on the coated layer. The stress-strain behaviors are characterized by results of the indentation tests.

• Journal of the Korea institute for structural maintenance and inspection
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• v.13 no.1 s.53
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• pp.69-77
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• 2009

An underwater structure is made to put with serious damage state by special environmental factors. If this damage phenomena persist, as for the structure, it is generated a structural serious problem because of the corrosion of a reinforcing bar and the loss of the concrete cut end. Repair work of an underwater structure is very harder than repair work in land, and it is actual that certification about a maintenance effect is uncertain. And the existing repair method is applied to a structure damaged with you without verification of a repair effect by a foreign reward and experience. In this study, a repair method about an underwater structure was proposed and observed a behavior characteristic and interface failure of an specimens. and comparison analyzed an effect of a proposed maintenance method.

• Tribology and Lubricants
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• v.39 no.5
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• pp.167-172
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• 2023

Titanium alloys are widely recognized among engineering materials owing to their impressive mechanical properties, including high strength-to-weight ratios, fracture toughness, resistance to fatigue, and corrosion resistance. Consequently, applications involving titanium alloys are more susceptible to damage from unforeseen events, such as scratches. Nevertheless, the impact of microscopic damage remains an area that requires further investigation. This study delves into the microscopic wear behavior of α-titanium crystal structures when subjected to linear scratch-induced damage conditions, utilizing molecular dynamics simulations as the primary methodology. The configuration of crystal lattice structures plays a crucial role in influencing material properties such as slip, which pertains to the movement of dislocations within the crystal structure. The molecular dynamics technique surpasses the constraints of observing microscopic phenomena over brief intervals, such as sub-nano- or pico-second intervals. First, we demonstrate the localized transformation of lattice structures at the end of initialization, indentation, and wear processes. In addition, we obtain the exerted force on a rigid sphere during scratching under linear movement. Furthermore, we investigate the effect of the relaxation period between indentation and scratch deformation. Finally, we conduct a comparison study of nanoindentation between crystal and amorphous Ti substrates. Thus, this study reveals the underlying physics of the microscopic transformation of the α-titanium crystal structure under wear-like accidental events.

• Journal of the Korea institute for structural maintenance and inspection
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• v.26 no.6
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• pp.204-211
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• 2022

In this study, Hollow Concrete Filled FRP Tube Pile(HCFFT Pile) was proposed as a model to utilize the advantages of composite piles and solve the problem of corrosion, which is a disadvantage of CFT piles, and a numerical analysis model was developed to analyze their behavior. The strain compatibility method was applied considering the damage plastic behavior of concrete, the yield plastic behavior of steel, and the elastic behavior of FRP. The flexural strength calculation equation of HCFFT piles was proposed considering the change of the FRP tube section according to the distance from the neutral axis. The flexural strength calculation equation, numerical analysis results, and experimental results were compared and analyzed to verify their adequacy. The results of this study can be used as basic data for the optimal design of various HCFFT piles using FRP.