• Proceedings of the Korea Concrete Institute Conference
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• 2008.04a
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• pp.333-336
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• 2008

CFRP tendons have been attempted in concrete structures as a substitute for steel tendons considering their many advantages such as the corrosion-resistance, light weight etc. However, the elastic behavior up to failure is likely to result in ductility problems. To overcome such problems, prestress concrete beams with partially bonded tendons have been developed and suggested. In this new system, the un-bonded part near the mid-span contributes to the improvement of ductility. And the bonded parts at both ends play a role as a safe anchorage. According to the previous research on the static behavior, the suggested method has demonstrated enough ductility and strength. However it is essential to verify the long-term safety for repetitive fatigue loads under service states. For this purpose, flexural fatigue loading tests were carried out in this research. This paper includes an experimental investigation on the static load-carrying capacities of the beams with or without fatigue tests. The results showed that the beams prestressed with partially bonded CFRP tendons possessed good fatigue capacity under the constant cyclic loads.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.17-22
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• 2007

Low-cycle environmental fatigue tests of cast austenitic stainless steel CF8M at the condition of fatigue strain rate 0.04%/sec were conducted at the pressure and temperature, 15MPa, $315^{\circ}C$ of a operating pressurized water reactor. The used test rig was limited to install an extensometer at the gauge length of the cylindrical fatigue specimen inside the small autoclave. So the magnet type LVDT's were used to measure the fatigue displacement at the specimen shoulders inside the high temperature and high pressure water autoclave. However, the displacement and strain measured at the specimen shoulders is different from the one at the gauge length for the geometry and the cyclic strain hardening effect. FEM calculated the displacement and the strain of the gauge length from the data measured at the shoulders. Tensile test properties in elastic and plastic behavior of CF8M material were used in the FEM analysis. A series of low cycle fatigue tests simulating the cyclic strain hardening effect verified that the FEM calculation was well agreed with the simulated tests. The process and method developed in this study would be so useful to produce reliable environmental fatigue curves of CF8M stainless steel in pressurized water reactors.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.5
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• pp.901-910
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• 1989

Corrosion fatigue crack propagation behavior of duplex stainless steel weldments in substitute ocean water was investigated to evalulate effects of micro-structural change and residual stresses. Fatigue crack propagation rate was found influenced markedly .alpha./.gamma. phase ratio but little by residual stresses. Fatigue crack propagation rate is higher in the corrosive environment than in room atmosphere. The crack propagation rate estimated by the measurement of striation spacing was higher than that, obtained by crack length measurement in low .DELTK.K region. At hight .DELTK.K region, however, both crack propagation rates were found to be identical.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2002.05a
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• pp.155-160
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• 2002

Metal matrix composites had generated a lot of interest in recent times because of significant in specific properties. It was also highlighted as the materials of frontier industry because strength, heat-resistant, corrosion-resistant, wear-resistant were superiored. In this study the strength properties of $Al_{18}B_4O_{33}/AC4CH$ were represented mixing the binder of $Al_2O_3$ and $TiO_2$. It was also fabricated by squeeze casting. $Al_{18}B_4O_{33}/AC4CH$ was fabricated at the melt temperature of $760^{\circ}C$ the perform temperature of $700^{\circ}C$ and mold temperature of $200^{\circ}C$ under the pressure of 83.4MPa and observed SEM. Fatigue crack growth rate tests on compact tension specimen(half-size) of thickness 12.5mm were conducted by using sinusoidal waveform. Compact tension specimens(half-size) were used and fatigue crack growth rate da/dN and stress intensity factor range ${\Delta}K$ were analyzed concerning to the R value of 0.1 and 0.05. In order to find out the value of ${\Delta}K$, load amplitude constant method was applied by the standard fatigue testing method describes in ASTM E647-95a. As the results of this study, Fatigue crack growth rate increased with in creasing the load ratio, Consequently, At equivalent stress intensity factors, the fatigue crack growth rates in MMC were faster than those of AC4CH alloy. then the fatigue life and the fatigue crack growth rate was investigated using scanning election microscopy(SEM)

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.277-279
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• 2006

Due to the numerous environmental factors, cracks and corrosion are frequently occured especially in old steel bridge, which deteriorate the structural integrity; thus bring about the problems of structural safety of the steel bridge. Therefore, repair and reinforcement are required for the damaged structure. the replacement repair welding method is spotlighted for its brilliant features, i.e. it can be achieved without incurring traffic dislocation. the method cuts the damaged parts and replaces them with new steel plate by welding under live loads. However, the mechanical behavior of the welded joints under cyclic loads due to the traffic which passes along bridge is not clarified. In this paper, the fatigue strength of the replacement repair welded joints was investigated in order to improve reliability in the repair welded joints of old steel bridge.

• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.5
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• pp.140-146
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• 2003

Metal matrix composites had generated a lot of interest in recent time because of their high specific strength and stiffness in specific properties. It was also highlighted as the material of frontier industry because strength, heat-resistance, corrosion-resistance and wear-resistance were superiored. In this study, the strength properties of $Al_{18}B_{4}O_{33}$/AC4CH composites were represented mixing the binder of $SiO_2$. It was also fabricated by squeeze casting. $Al_{18}B_{4}O_{33}$/AC4CH was fabricated at the melt temperature of $760^{\circ}C$, the perform temperature of $700^{\circ}C$ and mold temperature of $200^{\circ}C$ under the pressure of 83.4MPa. Consequently, fatigue life was observed roughly in the order of AC4CH> nobiner> $SiO_2$, independently on crack propagation direction and stress ratio.

• Proceedings of the KSR Conference
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• 2009.05a
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• pp.239-246
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• 2009

The Mode I interlaminar fracture toughness of woven fabric carbon/epoxy and glass/epoxy composites for a train carbody was measured and FEM analysis was conducted. The woven fabric epoxy composite manufactured by hand lay-up, has high stiffness and strength, good resistance for impact, fatigue, corrosion and in-plane failure. The DCB(Double Cantilever Beam) specimen made of woven fabric epoxy composite had the size of 180mm $\times$ 25mm $\times$ 5mm and the insert of 65mm. The Mode I interlaminar toughness of specimen was measured according to ASTM 5528-01. The crack propagation behavior of the DCB specimen was simulated using FEA with cohesive elements that model the adhesive layer between woven fabric plies.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Ceramic Society
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• v.41 no.1
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• pp.69-75
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• 2004

The degree of the indentation damage and strength degradation for 3Y-TZP ceramics and (Y,Nb)-TZP/$Al_2O_3$ dental implant composites was investigated under the Hertzian cyclic fatigue. Fatigue tests were conducted at contact loads of 500 to 3000 N and up to $10^6$ cycles in exact in vitro environments. At 500 N, no strength degradation and crack generation was observed up to $5{\times}10^5$ contact cycles. Fatigue properties of 3Y-TZP ceramics was superior to (Y,Nb)-TZP/ㅍ composites due to stress relief caused by the phase transformation from tettagonal to monoclinic phase. As contact load increased, the drastic reduction in strength was found when the damage transition from ring to radial crack occurred. The extent of strength degradation was more pronounced in vitro environments probably due to chemical corrosion of artificial saliva through cracks introduced during large numbers of contacts.