• 한국세라믹학회지
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• 제23권2호
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• pp.43-49
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• 1986

By simple substitution of divalent cobalt nickel copper ion in the calcium-fluorapatite the ability to produce color was explored. To determine the solubility limit of cobalt nickel copper in the calcium-fluorapatite and the absorption spectrum with the addition of each transition elements XRD and visible range Spectroscopy were emp-loyed.

• Journal of Magnetics
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• 제10권3호
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• pp.118-121
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• 2005

We have investigated the magnetic properties of electroplated thin Cu/Co multilayers by using electrolytes made of copper sulphate and cobalt sulphate and by applying alternating plating voltage. While the multilayers plated with pure electrolyte showed superparamagnetism, those plated with organic additives showed ferromagnetic behavior. These changes are attributed to the so-called 'self-annealing' effect and reduction of grain size caused by the organic additives.

• 자원리싸이클링
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• 제14권6호
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• pp.16-20
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• 2005

구리, 니켈 그리고 코발트를 함유한 용액으로부터 구리를 선택적으로 분리하기 위하여 $Na_{2}S$를 첨가하여 구리를 CuS로 침전시키는 연구를 행하였다. 구리의 침전율은 용액의 pH가 높을수록, 첨가한 $Na_{2}S$의 양이 많을수록,농도가 낮을수록, 반응온도와 반응시간이 증가할수록 증가하였다. pH 1, $20\%\;Na_{2}S$ 첨가량이 구리의 3 당량비, 온도 $25^{\circ}C$ 그리고 반응시간 30분에서 구리의 침전율은 $94.1\%$이었으며 니켈과 코발트도 각각 $4.3\%$와 $4.5\%$가 침전되었다. 즉 일부 니켈과 코발트 이온이 같이 공침되기 때문에 정량적으로 구리만을 침전, 분리하는 것은 가능하지 않았다.

• 대한화학회지
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• 제32권2호
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• pp.122-129
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• 1988

$Co(sp)X_2P$(sp=sparteine, $C_{15}H_{26}N_2$, X=Cl, Br)과 Cu(sp)$X_2$의 아쿠오화반응이 메카니즘을 규명하기 위하여 pH~5인 조건에서 속도론적 연구를 실시하였다. Co(sp)$Cl_2$ 및 $Co(sp)Br_2$는 halide 이온들에 의해 촉매 효과를 나타내지 않았으며 $Cu(sp)Cl_2$ 및 $Cu(sp)Br_2$에 비해 매우 빠르게 아쿠오화가 진행되었다. $Cu(sp)Cl_2$ 및 $Cu(sp)Br_2$는 halide cyanide의 존재에 의해 반응속도가 크게 증가하였으며 pH = 2~5인 범위에서 pH가 증가함에 따라 반응속도가 증가하였다. 본 연구에서 얻어진 실험결과, $Co(sp)X_2$의 아쿠오화반응이 D-메카니즘으로 진행되는 반면 $Cu(sp)X_2$의 경우는 $I_d$ 메카니즘으로 진행되는 것으로 믿어진다.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
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• pp.14-20
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• 2006

During the 11 year period of 1995-2005, there was about a 40% increase in the world copper demand mainly because of the Asian economic growth. In the increase, about a half was consumed by China. Most of the China's copper demand increase has been taken place over the final 5-6 years of that period. The growth is expected to continue for several years, and in 10 years or sooner the same situation is expected for India. Copper is the third metal in global demand, but its little abundance in the Earth's crust is not well recognized. From the production rate and the abundance, a copper shortage, or crisis, has a high probability than the other metals. Deep ocean mineral resources such as manganese nodules in the Clarion-Clipperton Fracture Zones, Kuroko-type massive seafloor sulfides (SMS), and cobalt-rich manganese crusts in the EEZ and the high sea areas have big potentials for the future sources. We need to re-evaluate their potentials as copper resources and other metals to realize their developments. The same situation is under progress in the hydro-carbon markets. Methane hydrates that are classified into non-conventional hydro-carbon resources have an important role as the future sources, too.

• Nutrition Research and Practice
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• 제2권4호
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• pp.317-321
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• 2008

Macrophages play a key role in iron metabolism by recycling iron through erythrophagocytosis. Ferroportin-l (FPN1) is a transporter protein that is known to mediate iron export from macrophages. Since divalent metals often interact with iron metabolism, we examined if divalent metals could regulate the expression of FPN1 in macrophages. J774 macrophage cells were treated with copper, manganese, zinc, or cobalt at 10, 50, or $100\;{\mu}M$ for 16 to 24 h. Then, FPN1 mRNA and protein levels were determined by quantitative real-time PCR and Western blot analyses, respectively. In addition, effects of divalent metals on FPN1 promoter activity were examined by luciferase reporter assays. Results showed that copper significantly increased FPN1 mRNA levels in a dose-dependent manner. The copper-induced expression of FPN1 mRNA was associated with a corresponding increase in FPN1 protein levels. Also, copper directly stimulated the activity of FPN1 promoter-driven reporter construct. In contrast, manganese and zinc had no effect on the FPN1 gene expression in J774 cells. Interestingly, cobalt treatment in J774 cells decreased FPN1 protein levels without affecting FPN1 mRNA levels. In conclusion, our study results demonstrate that divalent metals differentially regulate FPN1 expression in macrophages and indicate a potential interaction of divalent metals with the FPN1-mediated iron export in macrophages.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• 대한치과보철학회지
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• 제30권2호
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• pp.155-166
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• 1992

In dentistry, precious metal alloys are, mainly due to economic factors, increasingly displaced by alternatives containing Ni-Cr-Co. There are some reports where hypersensitive reactions to Ni-Cr-Co alloys are presented and discussed. The reactions reported vary from mucosa contact stomatitis to generalized dermatitis without any oral mucosal reaction. The purpose of this study was to investigate the incidence of nickel, chrome, cobalt and copper, and to know whether subjects with positive skin reaction to nickel would also demonstrate adverse intraoral reaction to a non-precious metal nickel. The patch tests were performed in 81 subjects(male 39, female 42) and nickel sulfate 5% aq., potassium bichromate 0.5% at., cobalt chloride 2% aq., & copper sulfate 1% aq., were used for test allergens. And then the intraoral tests were performed in 16 subjects, 8 subjects with positive allergic skin reaction to nickel and 8 subjects with negative allergic skin reaction. A pure metallic nickel plate was attached to the buccal side of the upper second premolar. The results are as follows : 1. The frequency of nickel sensitivity was 9.9% (2 men, 6 women), cobalt was 4.9% (1 man, 3 women), and chrome was 2.5% (2 men) respectively and there was no positive reaction to copper 2. The positive reactions were 8 of 23 (34.8%) with a history of jewelry allergic reactions and 3 of 58 (5.1%) without a history of jewelry allergic reactions. 3. Three of 8 subjects with positive skin reaction. gave reactions to the metal plates.

• 대한치과보철학회지
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• 제27권1호
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• pp.143-179
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• 1989

To observe the bonding behavior of palladium-based alloys to porcelain; 1. Pd-Co binary alloy with the higher cobalt content, 2. Pd-Co binary alloy with the lower cobalt content, 3. Pd-Ag-Sn ternary alloy, 4. Pd-Ag binary alloy, 5. Pd-Cu-Au ternary alloy and 6. Pd-Cu binary alloy were made as 6 groups of experimental alloys. Each group of alloy was divided into 4 sub-groups such as one sub-group that was not degassed and three sub-groups that degassed for 5 minutes, 10 minutes and 15 minutes. On each specimen, weight changes after degassing, morphological changes of oxide layer by changing the degassing time, compositional changes at metal-ceramic interface and bond strength of metal-ceramic measured with planar shear test were observed and compared. The results of the present study allow the following conclusions to be drawn: 1. The alloy showing the greatest bond strength was Pd-Cu alloy without gold and bond strength was decreased by alloying gold to them. 2. Although Pd-Co alloy showed the most prominent oxidation behavior, bond strength of them to porcelain was not greatly high by the formation of porosities at metal-ceramic interfaces. 3. Likewise tin, cobalt formed the peaks on line profiles at metal-ceramic interface, however copper did not exhibit such peaks on line profiles. 4. Mainly, oxide layer on Pd-Co alloy was composed with cobalt, and for Pd-Co alloy with higher cobalt content the rise of bond strength was not significant by increased degassing time. 5. On Pd-Ag alloy not containing tin, during degassing for 15 minutes silver content was increased at metal-ceramic interface. 6. As an oxidized element, tin formed the oxide layers that widen their area by increasing the degassing time, while cobalt and copper showed the morphological changes of particle or crystal on oxide layer.

• 자원리싸이클링
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• 제30권2호
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• pp.53-60
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• 2021

폐리튬이온배터리에 함유된 코발트, 니켈 및 구리를 회수하기 위한 공정 개발의 일환으로 단일금속과 금속혼합물의 침출을 조사했다. 이를 위해 산화제를 첨가하지 않은 무기산과 유기산을 침출제로 사용했다. 본 논문의 실험조건에서 산화제가 없는 무기산과 유기산에서 구리는 전혀 침출되지 않았다. 염산과 황산용액에서 산의 농도, 반응온도, 반응시간 및 광액농도를 변화시켜 단일 금속를 모두 용해시킬 수 있는 조건을 구했다. 또한 염산과 황산용액에서 금속혼합물로부터 니켈과 코발트를 99% 이상 침출시킬 수 있는 조건을 조사했다. 메탄술폰산으로 코발트와 니켈 금속혼합물을 침출시 낮은 반응온도에서 코발트가 선택적으로 침출됐다.