• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.167-168
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• 2006

A hyrdrothermal synthesis has been developd to prepare rod-like crystals of copper oxide using copper nitrate trihydrate as a function of synthesis temperature, stirring speed and solution pH value. The properties of the fabricated crystals were studied using scanning electron microscopy, X-ray diffraction and particle size analysis. The morphology of the synthesized CuO was dependent on both the pH value of the solution and the morphology of the seed materials. Synthesized particles have regular morphologies and a uniform size distribution.

• 한국분말재료학회지
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• 제23권3호
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• pp.228-234
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• 2016

Copper nanoparticles attract much attention as substitutes of noble metals such as silver and can help reduce the manufacturing cost of electronic products due to their lower cost and good conductivity. In the present work, the chemical reduction is examined to optimize the synthesis of nano-sized copper particles from copper sulfate. Sodium borohydride and ascorbic acid are used as reducing and antioxidant agents, respectively. Polyethylene glycol (PEG) is used as a size-control and capping agent. An appropriate dose of PEG inhibits the abnormal growth of copper nanoparticles, maintaining chemical stability. The addition of ascorbic acid prevents the oxidation of nanoparticles during synthesis and storage. Transmission electron microscopy (TEM) and Fourier transform infrared spectroscopy (FTIR) are used to investigate the size of the synthesized nanoparticles and the coordination between copper nanoparticles and PEG. For chemical reduction, copper nanoparticles less than 100 nm in size without oxidized layers are successfully obtained by the present method.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.318-319
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• 2006

The thermal dissipation performance of sintered heat pipes is usually determined by the capillarity and permeability of the Cu powder wicks. Since the capillary provided by the Cu powder is usually large enough to draw water from the condenser end to the evaporator end, the permeability has become the controlling factor. In this study, Cu powders with different particle sizes and shapes were loosely sintered, and their permeabilities were compared. The results show that more complicated shapes, finer particle sizes, lower porosities, and rougher pore surfaces give lower permeability and thermal dissipation.

• 한국결정성장학회지
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• 제29권5호
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• pp.215-221
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• 2019

건축용 내외장재로 사용되는 도자타일은 최근에 오염 방지 기능에 대한 시장의 수요에 따라, $TiO_2$ 코팅을 통한 친수성(hydrophilic property) 표면개발 연구와 더불어 표면에서 물방울의 흐름성을 향상시켜 오염물질을 제거하는 소수성(hydrophobic property) 표면을 갖는 도자타일에 대한 연구가 진행되고 있다. 특히 추가적인 코팅 공정 적용 없이 $1000^{\circ}C$ 이상의 소결 과정을 통해서 소수성을 갖으며, 기존 도자타일의 기계적 물성의 저하가 나타나지 않는 표면유약의 개발이 매우 중요하다. 본 연구에서는 상용화 도자타일의 표면유약에 조성에 구리 분말을 첨가하여 기존 소결 공정을 적용하고, 추가 코팅 공정 없이 소수성 도자타일을 제작하고 표면유약의 두께에 따른 접촉각 특성 변화를 관찰하였다. 구리 분말이 첨가되지 않은 도자타일의 표면 접촉각은 $25^{\circ}$로 친수성을 보이는 반면에 구리 분말이 첨가된 표면유약이 $150{\mu}m$ 두께인 경우에 접촉각이 $109^{\circ}$까지 증가하는 것을 확인하였다. 이와 같은 구리 분말이 첨가된 표면유약의 우수한 소수성 발현은 유약 표면에서 구리 입자의 세포 구조(cellular structure) 분포에 의한 것으로 확인되었다. 또한 개발된 소수성 도자타일의 기계적 물성(꺽임강도, 내화학성, 내마모성, 내동해성)은 기존 도자타일과 거의 동일하고 'KS L 1001 도자타일'의 기준을 만족하는 결과를 얻을 수 있었다.

• 한국분말재료학회지
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• 제14권5호
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• pp.292-297
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• 2007

The present study was focused on the synthesis of a $TiB_2$ dispersed copper matrix composite material by the combination of the mechanical milling and plasma activated sintering processes. The $Cu/TiB_2$ mixed powder was prepared by the combination of the mechanical milling and reduction processes using the copper oxide and titanium diboride powder as the raw material. The synthesized $Cu/TiB_2$ mixed powder was sintered by the plasma activated sintering process. The hardness and electric conductivity of the sintered bodies were measured using micro vickers hardness and four probe method, respectively. The relative density of $Cu/TiB_2$ composite material sintered at $800^{\circ}C$ showed about 98% of theoretical density. The $Cu-1vol%TiB_2$ composite material has a hardness of about 130Hv and an electric conductivity of about 85% IACS. The hardness and electric conductivity of $Cu-3vol%TiB_2$ composite material were about 140 Hv and about 45% IACS, respectively.

• 한국분말재료학회지
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• 제12권3호
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• pp.192-200
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• 2005

Ultrafine copper powder was prepared from $CuO-H_2O$ slurry with hydrazine, a reductant, under $70^{\circ}C$. The influence of various reaction parameters such as temperature, reaction time, molar ratio of $N_2H_4$, PvP and NaOH to Cu in aqueous solution had been studied on the morphology and powder phase of Cu powders obtained. The production ratio of Cu from CuO was increased with the ratio of $N_2H_4/Cu$ and the temperature. When the ratio of $N_2H_4/Cu$ was higher than 2.5 and the temperature was higher than $60^{\circ}C$, CuO was completely reduced into Cu within 40 min. The crystalline size of Cu obtained became fine as the temperature increase, whereas the aggregation degree of particles was increased with the reaction time. The morphology of Cu powder depended on that of the precursor of CuO and processing conditions. The average particle size was about $0.5{\mu}m$.

• 한국산학기술학회논문지
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• 제16권5호
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• pp.2979-2984
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• 2015

본 연구에서는 발포제를 이용하여 형성된 기공을 확대하는 방식의 공정으로써, 선택적 하이브리드 구조의 폴리머 필름의 제작을 위한 새로운 발포기술을 제시하였다. 기존의 발포제만을 이용한 폐쇄형 기공보다 큰 기공을 형성하기 위해서 PP에 발포제와 구리분말(Copper powder)을 혼합하여 만든 필름 내부에 355nm파장의 UV 펄스레이저를 이용하여 LAMO(Laser Aided Micro pore Opening) 공정 방식을 통한 기공의 크기를 확장하는 실험을 진행하였다. 그 결과 발포공정만 수행된 기공의 크기보다 추가적인 LAMO 공정을 통해 형성된 기공의 크기가 훨씬 더 크게 관찰되었다. 본 실험의 결과를 통해 LAMO 공정에 의한 기공의 특성과의 상관관계를 파악할 수 있었으며, 기존의 UV laser를 이용하여 원하는 부위에 선택적으로 폐쇄형 기공을 형성하는 것 이상으로 기공의 크기를 제어하는 방안을 제시하고자 한다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2001년도 추계학술강연 및 발표대회
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• pp.17-18
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• 2001

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.767-768
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• 2006

In this study, copper vapor chambers with built-in cooling fins, which eliminated the soldered or brazed joints in the conventional vapor chamber, were fabricated using the metal injection molding process. The results show that with optimized molding parameters, fins with an aspect ratio up to 18 could be produced. After sintering, the densities of the fin and chamber reached 96%. With only 32 cooling fins and a small fan installed, the thermal resistance of the heat sink was $1.156^{\circ}C/W$, and the power dissipation was 40W when the junction temperature was $70^{\circ}C$. When copper powder was sintered onto the chamber to make a vapor chamber, the thermal resistance decreased to $1.046^{\circ}C/W$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.65-68
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• 1999

A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.