• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.11
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• pp.88-96
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• 1996

Periodically slotted dielectricalloy filled parallel-plate waveguide as a leaky wave antenna is designed and fabricated at the center frequency of 10.0GHz. The antenna was fed by use of a hog-horn structure. The hog-horn and the two side walls and the lower plate of parallel-plate waveguide were fabricated form duralumin. The upper plate of parallel-plate waveguide with 48 periodic slots was made of copper plate of 1mm thickness. The dielectric material inside the parallel-plate waveguide was chosen to be paraffin. The experimental radiation pattern for the fbricated antenna was compared with the theoretical results for the finite periodic structure.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1864-1869
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• 2007

In this study, we compare thermal performance between four different types of cold plates for humanoid robot cooling. Two commercially available cold plates made of copper have different dimensions and internal flow paths: One has $20{\times}20$ $mm^2$ base area with micro-channels and the other has $62.5{\times}62.5$ $mm^2$ base area with 85 round pin-fins. And two different types of cold plates of $20{\times}20$ $mm^2$ base area with 7 mm high are made of PC (polycarbonate), which aims to reduce the weight of cooling system. All cold plates are mounted on a $20{\times}20$ $mm^2$ copper block with two cartridge heaters of 30 $W/cm^2$. The overall heat transfer coefficient and thermal resistances for the liquid-cooled cold plates are obtained. The copper cold plate with micro-channels showed the best performance. Polycarbonate cold plates display fairly good thermal performance with more reduced system weight.

• Journal of Surface Science and Engineering
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• v.19 no.3
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• pp.92-108
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• 1986

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.39-42
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• 2004

Carbon nanofiber/Cu composite powder has been fabricated by electroless plating process. Microstructural evolution of the composite powder after heat treatment under vacuum, hydrogen and air environment was investigated. A dispersed carbon nanofiber coated by copper was produced at the as-plated condition. Carbon nanofiber is coated uniformly and densely with the plate shaped copper particles. The copper plates on the carbon nanofiber aggregate during the thermal exposure at elevated temperature in vacuum and hydrogen in order to reduce surface energy. The thermal exposure of the composite powder in air at $400^{\circ}C$ for 3 hours leads to the spherodization of the composite powder owing to oxidation of copper.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.78-81
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• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• Journal of Surface Science and Engineering
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• v.18 no.3
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• pp.95-104
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• 1985

A study has been made of preferred orientation, crose sectional microstructure, surface morphology and mechanical properties of copper foils fabricated by electrodeposition on 304 stainless steel plate from copper sulfate baths for high speed plating. The preferred orientation of the copper foils changed from the [110] to the [111] to ture with decreasing bath temperature and increasing cathode current density. The foils with the [110] texture had the field oriented texture type structure and the surface of many asperities grooved approximately perpendicular to the subtrate. A specimen with the [111]+[311] texture had the lower strength than one with the [10] texture, if they were obtained under similar electrolysis conditions.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 1999.02a
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• pp.22-25
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• 1999

A well oriented Bi-2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-Cu-O powder on a copper plate and heat-treating at 820- $880^{\circ}C$for several minute in low oxygen pressure or are. At minute in low oxygen pressure of air. At , the printing layer partially melted by reaction between the Cu-free precursor by reaction between the Cu-free$870^{\circ}C$ precursor and CuO of the oxidizing copper plate. It is believed that the solid phase is Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. It is likely that the Bi-2212 superconducting phase is formed at Bi-2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows.

• Air Cleaning Technology
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• v.22 no.2
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• pp.40-49
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• 2009

Aluminum thin plate coated with epoxy resin containing about 20wt% brass powder, was applied to fins of heat exchanger. We carried out a series of detailed examinations to evaluate the anti-bacterial performance of the plate and heat exchanger (fan coil unit). In the presence of water or moisture, copper ions which have an anti-bacterial ability eluted from brass powder and showed sufficient effects on many kinds of bacteria. We also evaluated the anti-bacterial performance quantitatively by use of the index API (Anti-bacterial Performance Index) which has already been proposed by authors.

• Progress in Superconductivity and Cryogenics
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• v.10 no.2
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• pp.38-41
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• 2008

The relation between surface emissivity and temperature distribution is experimentally and analytically investigated for a conduction-cooled metal plate in vacuum. Experimental set-up consists of a rectangular metal plate placed vertically in a cryostat and thermally anchored to the coldhead of a GM cryocooler at the top. Temperature is measured at a number of locations over the plate with platinum resistors mounted on the plate. A parallel analysis on the balance of heat conduction through the plate and thermal radiation on its surface is performed to numerically calculate the temperature distribution having the same boundary conditions as experiment. By comparing the two results, an average emissivity of the plate is roughly estimated for different metal plates and different surface conditions. The estimated emissivity in present study is less than the listed values for highly polished stainless steel, and meets a fairly good agreement for oxidized copper surface.