• Journal of Welding and Joining
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• 제13권3호
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1994년도 특별강연 및 추계학술발표 개요집
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• pp.183-186
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• 1994

• Journal of Advanced Marine Engineering and Technology
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• 제19권3호
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• pp.50-61
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• 1995

In recent years, many ceramic researchers have discoved various methods of joining ceramic to metal. However, most of these joining methods are perfomed under vacuum and pressured circumstances. So, when we join ceramic to metal,the proceedings are very complicated and require a very high cost. The purpose of this study is to develop a new joining method of an alumina ceramic to an aluminum metal in air atmosphere. The joining condition, such as copper metallizing, nickel plating, brazing, etc. was investigated through the shear strength test of the trial joint. The results obtained from the above experimenta are summarized as follows : 1) In the case of the $Al_2O_3$/$Al_2O_3$joint, the shear strength of the joint was affected by the various foctor such as kaolin content, copper metallizing thickness, firing temperature, firing time. 2) The better shear strength of the $Al_2O_3$/Al joint was obtained when Ni plating was conducted under higher current density than existing plating condition. 3) The shear strength of the $Al_2O_3$/Al joint increases with the Ni plating thickness is confined to the range of this paper. 4) The shear strength of the thermal-shocked specimen($Al_2O_3$/Al joint) was far more deteriorated than that of the as-bonded specimen.