• 한국마린엔지니어링학회:학술대회논문집
• /
• 한국마린엔지니어링학회 2000년도 추계학술대회 논문집(Proceeding of the KOSME 2000 Autumn Annual Meeting)
• /
• pp.61-67
• /
• 2000

Many research works for improving a boundary lubrication performance have been executed by using solid lubricants, and been tried to apply an engine lubrication. However those general lubricants like MoS$_2$ or PTFE have not been applied on engines due to the extreme conditions such as very high temperature and pressure by combustion process in a cylinder. A copper nickel alloy fine particle has been introduced and studied. In this Paper the lubricant using the alloy Particles is applied on a marine diesel engine and assessed by the engine performance test The results showed the increase of cylinder pressure related strongly to the engine efficiency as well as the improving the engine lubrication performance.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2017년도 춘계학술대회 논문집
• /
• pp.97-97
• /
• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.