• 자원리싸이클링
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• 제2권4호
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• pp.33-41
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• 1993

본 연구에서는 전로슬래그 중에서 슬래그 부산에 의한 Cu의 회수 및 자산, 체질에 의한 Cu의 조기회수방법을 조사하였으며, 부산공정 시 부산용수로서 폐수사용의 가능성을 검사하였다. 또한 부산 등의 산별과정에 의해 얻어진 산물의 화학분석을 통하여 각 성분별 신화력을 조사하였다. 건식자산의 경우 300 Gauss에서 2시간 영각고화 슬래그에 있어서는 Cu 품위 60.7%, 회수율 39.2%의 정광을 얻고, 10시간 영각 고화 슬래그에 있어서는 Cu품위 54.0%, 회수율 17.9%의 정광을 얻었다. 습식자산의 경우 600 Gauss에서 10시간 영각 고화 슬래그의 경우 Cu품위 64.1%, 회수율 1.8%의 정광을 얻었다. 마광을 행한 영각 고화 10시간 시과에 대해, 사상산물에 대새서는 자산을 행하였고, 사하산물에 대해서는 부산을 행하였다. 이 결과 Cu품위 45.2%의 정광을 얻을 수 있었으며 이때 회수율은 93.5%를 나타냈다. 부산정광에서 Cu품위가 높을수록 As 품위는 상승하였으냐, Zn 및 Fe 품위는 감소하였으며, Pb 품위는 무관하였다. 이 결과 Cu품위 37.74%의 정광을 얻을 수 있었으며 이때 회수율은 94.79%를 나타내었다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• Journal of Nutrition and Health
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• 제32권3호
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• pp.277-286
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• 1999

This study was conducted to assess dietary intake and nutritional status of zinc and copper in Korean college women. Dietary survey was conducted by 24-hour recall method and fasting serum samples were collected from 111 apparently healthy subjects. Intake levels of zinc and copper were calculated using newly developed database for Zn & Cu of Korea food. Serum levels of Zn, Cu and activities of ALP, EC-SOD were measured from fasting serum sample. Mean daily zinc and copper intakes were 6.72mg/day(56.0% RDA) and 1.11mg/day respectively. Mean values of serum ALP activity, zinc and copper concentration were 43.9U/L, 14.8umol/1, 15.5umol/1and these values were mostly within normal range. EC-SOD activitis of the subjects were low and had no correlation with intake or serum levels of Zn, Cu. In conclusion, these results show that zinc and copper intake of Koran college women are lower than those from other counties but higher than those of adults in rural area of Korea. Their serum levels of Zn, Cu, ALP are relatively normal. These results indicate that marginal deficiency of Zn and Cu may be quite prevalent in these subjects but serum indicators measured may not be sensitive enough to detect such marginal deficiency. Further study in needed to develop a biochemical index sensitive enough to evaluate Zn and Cu status.

• 자원리싸이클링
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• 제28권1호
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• pp.62-72
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• 2019

일반적으로, 황산동을 제조하기 위한 원료는 $H_2SO_4$ 및 Cu 금속이 사용된다. 본 연구는 폐산, 폐염화동 폐기물부터 전해 채취법을 이용하여 황산동을 제조하는 방법에 관한 것이다. 황산구리의 용도는 공업용, 도금용, 사료용, 농업용, 전자급 PCB 동도금에 사용된다. 종래의 황산동 제조법은 다량의 폐수 및 에너지 비용이 높은 문제점이 있다. 구리(Cu) 화합물 중에서 가장 사용이 많이 되는 황산동($CuSO_4$)의 제조 방법에 관한 연구로서, 공정 운전비가 적고, 폐수 발생이 적으며, 제조 공정이 간단하다. 양이온 맴브레인을 이용하여 Na, Ca, Mg, Al을 불순물로서 제거하기 쉽다. 또한 동시에 전해 채취 방법으로 고 순도 구리 분말을 회수 할 수 있었다. 회수 된 구리 분말을 사용하여 고 순도 황산동을 제조 할 수 있었다.

• 한국진공학회지
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• 제15권5호
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• pp.485-492
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• 2006

새로운 1가 구리 전구체인 $[Cu^I(hfac)]_2(DVTMSO)$ and $[Cu^I(hfac)]_2(HD)$ (hfac=hexa- fluoroacetylacetonate, DVTMSO=1,2-divinyltetramethyldisiloxane, HD=1,5-hexadiene)를 합성하였으며, 또한 유기금속 화학증착법을 사용하여 증착특성을 확인하였다. 새로운 전구체는 기존 구리 1가 전구체와는 다르게 두 개의 Cu(hfac)가 하나의 중성리간드에 결합된 형태를 가지고 있다. 또한 새롭게 합성된 두 종류의 전구체는 기존에 알려진 1가 구리 고체 전구체에 비해 높은 안정성 및 높은 증기압을 가지고 있는 것이 확인하였다. 아울러 기존의 전구체와는 달리 새로운 전구체로 화학증착하면 막 (films)을 형성하지 않고 구리점 (dots)을 형성하는 것을 확인하였으며 이는 새로운 구조로부터 기인된 현상이라고 생각된다. 구리점의 모양은 증착온도에 따라 급격하게 변하는 것도 관찰되었다.

• Journal of Electrochemical Science and Technology
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• 제11권1호
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• 청정기술
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• 제8권3호
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• pp.111-117
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• 2002

동을 담지한 모더나이트를 이용하여 고정층 연속흐름 반응기에서 NO 분해와 CO에 의한 NO 환원을 실시하였다. NO 분해에서는 많은 동함량에서 $Cu^{\circ}/HM$이 CuO/HM보다 높은 분해 활성을 나타내었다. 이것은 $Cu^{\circ}/HM$과 CuO/HM에 존재하는 $Cu^{2+}$이온의 양과 CuO의 환원성 등의 차이에 관련된다고 보인다. NO 환원에서는 적은 동함량에서 Cuo/HM이 CuO/HM보다 높은 환원 활성을 나타내었다. 이것은 $Cu^{\circ}/HM$과 CuO/HM에 존재하는 CuO의 환원성과 입자 크기 등의 차이에 관련된다고 보인다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.176.1-176.1
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• 2014

Graphene has attracted an increasing attention due to its extraordinary electronic, mechanical, and thermal properties. Especially, the two dimensional (2D) sheet of graphene with an extremely high surface to volume ratio has a great potential in the preparation of multifunctional nanomaterials, as 2D supports to host metal nanoparticles (NPs). Copper oxide is widely used in various areas as antifouling paint, p-type semiconductor, dry cell batteries, and catalysts. Although the copper oxide(II) has been well known for efficient catalyst in C-N cross-coupling reaction, copper oxide(I) has not been highlighted. In this research, CuO and Cu2O nanoparticles (NPs) dispersed on the surface of grapehene oxide (GO) have been synthesized by impregnation method and their morphological and electronic structures have been systemically investigated using TEM, XRD, and XAFS. We demonstrate that both CuO and Cu2O on graphene presents efficient catalytic performance toward C-N cross coupling reaction. The detailed structural difference between CuO and Cu2O NPs and their effect on catalytic performance are discussed.

• 대한전자공학회논문지
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• 제25권8호
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• pp.966-971
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• 1988

AES was used to study oxygen adsorption due to the oxygen exposure at 300\ulcorner temperature and segregation of impurities due to annealing on polycrystal copper surface. The intensity of peak of CuM2, 3VV and CuL3 VV increased with annealing time and the peak of CKLL increased after Ar ion bombardment. The effect of oxygen adsorption on copper surface at 300\ulcorner was verified by the decreased of peak of CuM2, 3VV and CuL3 VV as oxygen exposure increase. The binding energy of copper atoms gradualy shifts from 0.7eV to 1.5eV of copper atoms gradually shifts from 0.7eV to 1.5eV after a oxygen exposure. After the oxygen exposure, the width at half the height of CuM2, 3VV is larger 2V*C/S by the effect of chemical liaison of the copper aton with oxygen atom.

• 자원리싸이클링
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• 제5권3호
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• pp.31-36
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• 1996

The metallic copper was recovered from sludge of the copper electro-plating plant by pyrometallurgical process. The reducing agent was Pyrolysized from waste tires and the flux was a mixture $Na_2CO_3$, $NaB_4O_7$, and glass. The green sludge contained 87.5% moisture and 12.5% solid with 56.5% Cu and 1.59% Fe. The sludge dried at $100^{\circ}C$ was analyized to be $Cu_4SO_4(OH)_6{\cdot}2H_2O$ and CuO by XRD analysis. The former was 84% and the latter 16%, However, the calcined sludge at $500^{\circ}C$ was 49% $Cu_2O(SO_4)$ and 51% CuO. The sludge could by smelted at $1100^{\circ}C$ for two hours with 6 to 8 moles carbon with respect to copper to produce metallic copper (>90%) with recovery of 9% above.