• Title/Summary/Keyword: Contact print lithography

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Contact Print Lithography for Precise Transplantation of Three-dimensional Microstructures into a Microsystem (표면접촉 인쇄방식을 이용한 극미세 3차원 형상의 이식공정에 관한 연구)

  • Park, Sang-Hu;Jeong, Jun-Ho;Choi, Dae-Geun;Kim, Ki-Don;Altun, Ali Ozhan;Lee, Eung-Sug;Yang, Dong-Yol;Kong, Hong-Jin;Lee, Kwang-Sup
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.12
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    • pp.136-142
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    • 2007
  • Precise fabrication of three-dimensional (3D) self-standing microstructures on thin glass plates via two-photon induced polymerization (TPP) has been an important issue for innovative 3D nanodevices and microdevices. However, there are still issues remaining to be solved, such as building 3D microstructures on opaque materials via TPP and being able to implant them as functional parts onto practical systems. To settle these issues simply and effectively, we propose a contact print lithography (CPL) method using an ultraviolet (UV)-curable polymer layer. We report some of the possibilities and potential of CPL by presenting our results for transplanting 3D microstructures onto large-area substrates and also our examination of some of the effects of the process parameters on successful transplantation.

$\mu$CP Process Technology for Nanopattern Implementation (나노패턴 구현을 위한 $\mu$CP 공정기술)

  • 조정대;신영재;김광영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.624-627
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    • 2003
  • Microcontact printing (uCP) of alkanethiols on gold was the first representative of soft-lithography processes. This is an attempt to enhance the accuracy of classical to a precision comparable with optical lithography, creating a low-cost, large-area, and high-resolution patterning process. Microcontact printing relies on replication of a pattered PDMS stamp from a master to form an elastic stamp that can be inked with a SAM solution(monolayer -forming ink) using either immersion inking or contact inking. The inked PDMS stamp is then used to print a pattern that selectively protects the gold substrate during the subsequent etch.

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