• Title/Summary/Keyword: Contact Probe

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The Effect of Pretest Speed on Probe Tack in SIS-based Hotmelt PSA and Water-borne Acrylic PSA (핫멜트 점착제 및 아크릴 점착제에 대한 접촉속도(pretest speed)가 택에 미치는 영향)

  • Lim, Dong-Hyuk;Kim, Sung-Eun;Kim, Birm-Jun;Do, Hyun-Sung;Kim, Hyun-Joong
    • Journal of Adhesion and Interface
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    • v.4 no.4
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    • pp.7-14
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    • 2003
  • "Tack" is defined as "the property that enables an adhesive to form a bond with the surface of another material upon brief contact under light pressure". The tack depends on a number of experimental parameters. We can control various experimental factors (contact force, dwell time, pretest speed) using probe tack tester. We are here concerned with pretest speed of experimental factors using SIS-based hotmelt PSA and water-borne acrylic PSA.

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Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch (미세 피치를 갖는 MEMS 프로브 팁의 설계 및 기계적 특성 평가)

  • Ha, Seok-Jae;Kim, Dong-Woo;Shin, Bong-Cheol;Cho, Myeong-Woo;Han, Chung-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.4
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    • pp.1210-1215
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    • 2010
  • The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.

Realization of Non-contact Sheet Resistance Measurement System for LCD using Eddy Current Probe (와전류탐침을 이용한 LCD용 비접촉식 면적저항 측정기의 구현)

  • 강신혁;최재훈황호정
    • Proceedings of the IEEK Conference
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    • 1998.10a
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    • pp.617-620
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    • 1998
  • In this paper we realized non-contact sheet resistance measurement system using eddy current. Proposed system is designed to meet the requirements which is necessary when dealing with conducting thin films on large area LCD panel. With several metals we could get lift-off curves which has the same trend as in principal. Especially in the region of high conductivity this system has more discriminating ability than 4-point probe system.

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Nanomachining on Single Crystal Silicon Wafer by Ultra Short Pulse Electrochemical Oxidation based on Non-contact Scanning Probe Lithography (비접촉 SPL기법을 이용한 단결정 실리콘 웨이퍼 표면의 극초단파 펄스 전기화학 초정밀 나노가공)

  • Lee, Jeong-Min;Kim, Sun-Ho;Kim, Tack-Hyun;Park, Jeong-Woo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.4
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    • pp.395-400
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    • 2011
  • Scanning Probe Lithography is a method to localized oxidation on single crystal silicon wafer surface. This study demonstrates nanometer scale non contact lithography process on (100) silicon (p-type) wafer surface using AFM(Atomic force microscope) apparatuses and pulse controlling methods. AFM-based experimental apparatuses are connected the DC pulse generator that supplies ultra short pulses between conductive tip and single crystal silicon wafer surface maintaining constant humidity during processes. Then ultra short pulse durations are controlled according to various experimental conditions. Non contact lithography of using ultra short pulse induces electrochemical reaction between micro-scale tip and silicon wafer surface. Various growths of oxides can be created by ultra short pulse non contact lithography modification according to various pulse durations and applied constant humidity environment.

Investigation on the Effect of Contact Load on Fine Pattern Fabrication by AFM (AFM을 이용한 미세 패턴 가공 시 접촉 하중에 따른 선폭 변화에 대한 연구)

  • Jo S.B.;Kim D.E.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.502-505
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    • 2005
  • To overcome some of the limitations in the conventional photolithography technique, MC-SPL which has advantages such as flexibility and high speed was developed in the past. To make a fine pattern using MC-SPL, there are many variables to control, for example, applied load, scribing speed, chemical etching condition, and etc. In this work, the effect of contact load on the width of the pattern was investigated. The load not only influences the width of the pattern but it also affects the wear of the probe tip. It was found that it is beneficial to load the tip in two stages. Futhermore, the experimental results showed that the pattern width was more sensitive to the initial contact force.

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Lateral Force Calibration of Colloidal Probe in Liquid Environment Using Reference Cantilever (기준 외팔보를 이용한 액체 환경에서 Colloidal Probe의 수평방향 힘 교정)

  • Je, Youngwan;Chung, Koo-Hyun
    • Tribology and Lubricants
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    • v.29 no.3
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    • pp.160-166
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    • 2013
  • There is an indispensable need for force calibration for quantitative nanoscale force measurement using atomic force microscopy. Calibrating the normal force is relatively straightforward, whereas doing so for the lateral force is often complicated because of the difficulty in determining the optical lever sensitivity. In particular, the lateral force calibration of a colloidal probe in a liquid environment often has a larger uncertainty as a result of the effects of the epoxy, the location of the colloidal particle on the cantilever, and a decrease in the quality factor. In this work, the lateral force of a colloidal probe using a reference cantilever with a known spring constant was calibrated in a liquid environment. By obtaining the spring constant and the lateral sensitivity at the equator of a spherical colloidal particle, the damage to the bottom surface of the colloidal particle could be eliminated. Further, it was shown that the effect of the contact stiffness on the determination of the lateral spring constant of the cantilever could be minimized. It was concluded that this method can be effectively used for the lateral force calibration of a colloidal probe in a liquid environment.

Non-destructive estimation of soluble solids in the intact melon fruits from cross progeny by non-contact mode with a fiber optic probe

  • Ito, Hidekazu;Fukino, Nobuko
    • Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
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    • 2001.06a
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    • pp.1524-1524
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    • 2001
  • A previous paper(Ito et al., 2000) has described the improvement of the standard error(SEC and SEP) of the predicted soluble solids(Brix) in a melon cultivar by non-contact mode with a fiber optic probe. Then we examined the immature and mature fruits. The objective of this study was to determine if non-contact mode could improve the standard error of the predicted Brix of matured melon fruits from cross progeny as well as the contact mode(usual method). The optical absorption spectrum was measured using a NIR Systems model 6500 spectrophotometer. A commercial spectral program(NSAS ver. 3.27) was used for multiple linear regression analysis. Absorbances of 902 and in the vicinity of 877 nm were included as the independent variables in both multiple regression equations. These wavelengths are key wavelengths for non-destructive Brix determination. When the results for the contact mode and non-contact mode are compared, the latter mode improved the former standard error(SEP and RMS).

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Molecular Dynamics Simulation of Contact Process in AFM/FFM Surface Observation

  • Shimizu, J.;Zhou, L.;Eda, H.
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.61-62
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    • 2002
  • In order to clarify the contact mechanism between specimen surface and probe tip in the surface observation by the AFM (atomic force microscope) or the FFM (friction force microscope), several molecular dynamics simulations have been performed. In the simulation, a 3-dimensional simulation model is proposed where the specimen and the probe are assumed to consist of mono-crystal line copper and a carbon atom respectively and the effect of cantilever stiffness is also taken into considered. The surface observation process on a well-defined Cu{100} is simulated. The influences of cantilever stiffness on the reactive force images and the behavior of probe tip were evaluated. As a resuIt, several phenomena similar to those observed by the actual surface observation experiment, such as double-slip behavior and dispersion in the stick-slip wave period were observed.

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Study of Refining Effects on Pulp Fibre by Scanning Probe Microscopy(SPM) (Scanning Probe Microscopy를 이용한 고해 효과 연구)

  • ;Keity Roy Wadhams
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.30 no.4
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    • pp.49-58
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    • 1998
  • The SPM could image the most detailed microstructure of a sample in a wet and dry state by measuring the interaction between the atoms on the sample surface and the extremely sharp probe tip. The refined fibre exhibited large wrinkles formed by fibrillar bundles, the disintegrated fibres extensively showed “scale-like features”. By using the Non-Contact Atomic Force Microscopy (NC-AFM) and Contact Atomic Force Microscopy (C-AFM) including Phase Detection Microscopy (PDM) and Force Modulation Microscopy (FMM), it was possible to investigate surface topography, surface roughness and mechanical property (hardness or visco-elasticity) of fibre surface in detail. The PDM and FMM images showed that the disintegrated only fibre displayed uniform mechanical properties, whereas the refined one did not. The surface roughness of pulp fibres was higher in refined fibres than in disintegrated fibres due to the presence of external fibrils. These SPM images would be used to provide visual evidence of morphological change of a single fibre created during mechanical treatments such as refining, drying, calendering and so on.

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Gas Flow Rate Dependency of Etching Result: Use of VI Probe for Process Monitoring (가스 유량 변화에 따른 식각 공정 결과: VI Probe 활용 가능성 제안)

  • Song, Wan Soo;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.3
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    • pp.27-31
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    • 2021
  • VI probe, which is one of various in-situ plasma monitoring sensor, is frequently used for in-situ process monitoring in mass production environment. In this paper, we correlated the plasma etch results with VI probe data with the small amount of gas flow rate changes to propose usefulness of the VI probe in real-time process monitoring. Several different sized contact holes were employed for the etch experiment, and the etched profiles were measured by scanning electron microscope (SEM). Although the shape of etched hole did not show satisfactory relationship with VI probe data, the chamber status changed along the incremental/decremental modification of the amount of gas flow was successfully observed in terms of impedance monitoring.