• 제목/요약/키워드: Contact Heat Conductance

검색결과 9건 처리시간 0.024초

최적 핵연료 접촉 열전도도 모델 개발을 위한 예비 연구 (Preliminary Study for the Development of Optimum Fuel Contact Conductance Model)

  • 양용식;신창환
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2488-2493
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    • 2007
  • A gap conductance is very important factor which can affect nuclear fuel temperature. Especially, in case of an annular fuel, a gap conductance effect can lead an unexpected heat split phenomena which is caused by a large difference of an inner and outer gap conductance. The gap conductance mechanism is very complicated behavior due to the its strong dependency on microscopic factors such as a contact surface roughness, local contact pressure and local temperature. In this paper, for the decision of test temperature and pressure range, a procedure and calculation results of in-reactor fuel temperature and pressure analysis are summarized which can be applied to test equipment design and determination of test matrix. Based upon analysis results, it is concluded that the minimum and maximum test temperature are $300^{\circ}C$ and $530^{\circ}C$ respectively, and the maximum pellet/cladding interfacial contact pressure should be observed up to 45MPa.

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Determination of Thermal Contact Conductance of an Injection Mold Assembly for the Prediction of Mold Surface Temperature

  • Lee, Ki-Yeon;Kim, Kyeong-Min;Park, Keun
    • 한국생산제조학회지
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    • 제21권6호
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    • pp.1008-1012
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    • 2012
  • Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

원통결합부의 열특성 해석 (제1보) -주축베어링 내륜계의 수치해석을 중심으로- (Analysis of the thermoelastic begavior on the contact joint of compound cylinder)

  • 김선민;박기환;이선규
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 춘계학술대회 논문집
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    • pp.629-634
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    • 1996
  • Heat generation in machine operating condition makes thermal deformation and thermalstress in the structure, which results in the change the contact characteristics of machine joint such s change of shrinkage fit, contact heat conductance and contact pressure. As the change of contact pressure is related to variation of static, dynamic and thermalcharacteristics, the prediction of transient contact perssure is strongly required. This paper presents some analytical results which will be effective to predict static and dynamic characteristics of the compound cylindrical structure.

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접촉전도와 반투명 복사가 반도체 웨이퍼의 CVD 공정 중 열전달에 미치는 영향 (Effect of Contact Conductance and Semitransparent Radiation on Heat Transfer During CVD Process of Semiconductor Wafer)

  • 윤용석;홍혜정;송명호
    • 대한기계학회논문집B
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    • 제32권2호
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    • pp.149-157
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    • 2008
  • During CVD process of semiconductor wafer fabrication, maintaining the uniformity of temperature distribution at wafer top surface is one of the key factors affecting the quality of final products. Effect of contact conductance between wafer and hot plate on predicted temperature of wafer was investigated. The validity of opaque wafer assumption was also examined by comparing the predicted results with Discrete Ordinate solutions accounting for semitransparent radiative characteristics of silicon. As the contact conductance increases predicted wafer temperature increases and the differences between maximum and minimum temperatures within wafer and between wafer and hot plate top surface temperatures decrease. The opaque assumption always overpredicted the wafer temperature compared to semitransparent calculation. The influences of surrounding reactor inner wall temperature and hot plate configuration are then discussed.

Temperature Dependent Behavior of Thermal and Electrical Contacts during Resistance Spot Welding

  • Kim, E.
    • International Journal of Korean Welding Society
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    • 제2권1호
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    • pp.1-10
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    • 2002
  • The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

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CIC 초전도 도체의 안정성 (Stability of the Cable-in-Conduit Conductors)

  • 류경우
    • E2M - 전기 전자와 첨단 소재
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    • 제10권9호
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    • pp.895-900
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    • 1997
  • A Quench in cable-in-conduit (CIC) conductors is often initiated by a disturbance such as strand motion that generates a highly localized normal zone in a strand or a few strands of the CIC conductors. The localized normal zone causes current and heat transfer between a disturbed strand and neighboring strands. Electrical and thermal contact characteristics between strands thus have an effect on the transient stability of the CIC conductors. In this paper the effect of contact characteristics between strands on the CIC conductor stability is presented based on the measured heat transfer characteristics of supercritical helium (SHe) for the local heating. The quench and recovery processes of the strands for the abrupt and highly localized disturbance are analyzed at the boundary between quench and recovery.

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현시적 유한차분법을 이용한 볼나사 시스템의 열해석 (Thermal Analysis of Ballscrew Systems by Explicit Finite Difference Method)

  • 민복기;박천홍;정성종
    • 대한기계학회논문집A
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    • 제40권1호
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    • pp.41-51
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    • 2016
  • 볼나사 시스템은 볼과 그루브 사이에서 발생하는 마찰에 의해 온도가 상승하며, 이에 따른 열변형이 이송계의 위치결정 정도를 저하시킨다. 이를 보상하기 위해서는 볼나사 온도분포의 우선적 예측이 필요하다. 본 논문에서는 나사축 회전속도에 따른 온도분포를 해석하기 위해 볼나사 축과 너트를 각각 실린더와 중공 실린더로 가정한다. 경계조건인 대류 열전달계수, 볼과 그루브에서 발생하는 마찰토크와 접촉열전도를 볼나사 운전 및 조립 조건에 대하여 정식화 한다. 그리고, 현시적 유한차분법을 적용한 온도 분포 예측 시뮬레이터를 개발하고 그 유용성을 검증한다.

Al6061 열간단조시 계면열전달계수에 관한 연구 (A study on interface heat transfer coefficient in hot forging of Al6061 by experiments and FE analysis)

  • 권진욱;이영선;권용남;이정환
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 춘계학술대회 논문집
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    • pp.219-222
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    • 2005
  • The temperature difference between die and workpiece has frequently caused various surface defects. The non-homogeneous temperature distribution of forged part should be analyzed to prevent the generation of various defects related with the temperature. The surface temperatures were mainly affected by the coefficient of thermal contact conductance. The precise coefficient is necessary to predict accurately the temperature changes of die and workpiece. The experiment is preformed to measure the temperature distribution of die and workpiece in closed die upsetting. And then, the coefficient is classified into function of pressure and confirmed by the comparison between experiments and FE analyses using the other model. The FE analysis to predict the temperature distribution is performed by commercial software $DEFORM-3D^{TM}$. However, it might be impossible to measure directly the temperature distribution of forged part. Therefore, the comparisons between measured temperature and predicted values are performed with the hardness of Al6061-forged part.

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TV 유리의 반복 성형공정에서 금형 열사이클 해석을 위한 효과적 방법 (An Efficient Method for Mold Thermal Cycle Analysis in Repeated Forming Process of TV Glass)

  • 최주호;김준범;황정해;하덕식
    • 대한기계학회논문집B
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    • 제24권9호
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    • pp.1219-1226
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    • 2000
  • An efficient method is developed for plunger thermal cycle analysis in repeated forming process of the TV glass. The plunger undergoes temperature fluctuation during a cycle due to the repeated contact and separation from the glass, which attains a cyclic steady state having same temperature history at every cycle. Straightforward analysis of this problem brings about more than 80 cycles to get reasonable solution, and yet hard to setup stopping criteria due to extremely slow convergence. An exponential fitting method is proposed to overcome the difficulty, which finds exponential function to best approximate temperature values of 3 consecutive cycles, and new cycle is restarted with the fitted value at infinite time. Numerical implementation shows that it reduces the number of cycles dramatically to only 6-18 cycles to reach convergence within 10 accuracy. A system for the analysis is constructed, in which the thermal analysis is performed by commercial software ANSYS, and the fitting of the result is done by IMSL library. From the parametric studies, one reveals some important facts that although the plunger cooling or the glass thickness is increased, its counter part in contact is not much affected, duo to the low thermal conductance of the glass.