• 제목/요약/키워드: Connector configuration

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Shear performance and design recommendations of single embedded nut bolted shear connectors in prefabricated steel-UHPC composite beams

  • Zhuangcheng Fang;Jinpeng Wu;Bingxiong Xian;Guifeng Zhao;Shu Fang;Yuhong Ma;Haibo Jiang
    • Steel and Composite Structures
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    • v.50 no.3
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    • pp.319-336
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    • 2024
  • Ultra-high-performance concrete (UHPC) has attracted increasing attention in prefabricated steel-concrete composite beams as achieving the onsite construction time savings and structural performance improvement. The inferior replacement and removal efficiency of conventional prefabricated steel-UHPC composite beams (PSUCBs) has thwarted its sustainable applications because of the widely used welded-connectors. Single embedded nut bolted shear connectors (SENBs) have recently introduced as an attempt to enhance demountability of PSUCBs. An in-depth exploration of the mechanical behavior of SENBs in UHPC is necessary to evidence feasibilities of corresponding PSUCBs. However, existing research has been limited to SENB arrangement impacts and lacked considerations on SENB geometric configuration counterparts. To this end, this paper performed twenty push-out tests and theoretical analyses on the shear performance and design recommendation of SENBs. Key test parameters comprised the diameter and grade of SENBs, degree and sequence of pretension, concrete casting method and connector type. Test results indicated that both diameters and grades of bolts exerted remarkable impacts on the SENB shear performance with respect to the shear and frictional responses. Also, there was limited influence of the bolt preload degrees on the shear capacity and ductility of SENBs, but non-negligible contributions to their corresponding frictional resistance and initial shear stiffness. Moreover, inverse pretension sequences or monolithic cast slabs presented slight improvements in the ultimate shear and slip capacity. Finally, design-oriented models with higher accuracy were introduced for predictions of the ultimate shear resistance and load-slip relationship of SENBs in PSUCBs.

Corrosion Characteristics of Ti alloy for Removable Partial Denture (국소의치용 티타늄 합금의 부식 특성)

  • Kim, Jeong-Jae;Kim, Won-Gi
    • The Journal of the Korea Contents Association
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    • v.14 no.4
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    • pp.237-242
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    • 2014
  • In this study, surface characteristics and corrosion behaviors have been investigated in addition to Zr elements on the low elastic modulus Ti-30Ta alloy. Low elastic modulus Ti-30Ta-xZr(x : 3, 7 and 15 wt %) alloys were prepared by arc melting and then heat treated at $1000^{\circ}C$ for 24 hrs in an argon atmosphere. Microstructures of the alloys were examined by field emission scanning electron microscope(FE-SEM) and X-ray diffractometer(XRD). Electrochemical experiments were performed using a conventional three-electrode configuration with a sample working electrode, a high density carbon counter electrode and a saturated calomel reference electrode. According to the result of polarization behavior in the Ti-30Ta-xZr alloys, the current density of homogenized Ti-30Ta-15Zr in the passive region was lower than the other alloys.

DIMM-in-a-PACKAGE Memory Device Technology for Mobile Applications

  • Crisp, R.
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.4
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    • pp.45-50
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    • 2012
  • A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

Design of a reconfigurable paper antenna using the origami method (종이접기 방식을 사용한 방사패턴 가변형 종이 안테나 설계)

  • Park, Dong-Kook
    • Journal of Advanced Marine Engineering and Technology
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    • v.40 no.7
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    • pp.642-646
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    • 2016
  • A wearable antenna made using conductive tape on paper is presented in this paper. The proposed antenna is composed of a half-wavelength conducting dipole strip and a parasitic conducting strip on the A4 copy paper. The antenna is fed at the center of the dipole strip by an SMA connector. The configuration of the proposed antenna changes according to the origami method. Therefore the radiation patterns of the antenna vary according to whether or not the paper is folded. This approach solves the problem that the reception ratio of the signal decreases because of null points in the antenna radiation pattern. The reflection coefficient and the radiation pattern of the proposed antenna at 900 MHz are evaluated using an EM simulation and measurements. It was shown that the proposed paper antenna has reconfigurable characteristics at 900 MHz when utilizing the origami method.

Development of an Object-Oriented Simulator for Evaluating Object-Oriented CIM S/W (객체지향 제조관리 시스템 평가를 위한 객체지향 시뮬레이터 개발)

  • 백준걸
    • Journal of the Korea Society for Simulation
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    • v.8 no.1
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    • pp.1-18
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    • 1999
  • Current CIM systems need to correspond flexibly to the frequent change of demands of the customers and the fast changing informations about the production environment. The demands have brought forth CIM systems developed using object-oriented technology, with reusability, expansibility, and flexibility for the system components. Due to the fact that the OO-CIM system has been developed based on an incomplete data, the constructed system must be implemented to the actual surroundings to see how pertinent it is. Hence, this paper presents an OO-simulator as a means to evaluate the pertinency and the efficiency of the developed CIM system. The OO-simulator can determine the problems likely to occur when a developed CIM system is implemented to the actual site and evaluate the efficiency beforehand. Such properties will decrease the cost of CIM system development and increase the reliability of the system. This paper presents a framework for an OO-simulator composed of a virtual factory component embodying the characteristics of a virtual factory, a connector component for the interface between the CIM system and the simulator, a configuration component for modeling the constituent structure of the CIM system, and a timer component in charge of the time advance for the simulation.

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Dielectric Loss Tangent Measurement Using the $Al_{2}O_{3}$ Crystal Capacitor ($Al_{2}O_{3}$ Crystal Capacitor를 이용한 유전손실 측정)

  • Kim, Kwang-Soo;Her, In-Sung;Lee, Chong-Chan;Park, Dea-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.08a
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    • pp.109-122
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    • 2002
  • The standard capacitor must have not only precise value of the capacitance but also the basic properties of low dielectric loss tangent. In the reforming process of capacitors, the dielectric loss tangent must be also reformed. In this paper, the development of standard capacitors of 10 and 100pF for the dielectric loss tangent standard using $Al_{2}O_{3}$ Crystal and the measurement of dielectric loss tangent are discussed. The dielectric loss tangent depends upon the surface between electrode and dielectric in capacitor. With using the Electric Field Simulator, precise design values of electrode are simulated. For the purpose of measuring capacitance effect just in the dielectric, 3-Terminal and 4-Terminal Pair configuration are applied respectively at the electrode and the connector for the measuring equipment. As stated above method, the standard capacitors of 10 and l00pF for the establishment of the dielectric loss tangent standard using the $Al_{2}O_{3}$ Crystal are made with low dielectric loss tangent less than 10-4.

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A Reliable Low-Loss Field-Installable Optical Connector Design by Splicing Angle Adjustment (접속 각도 조정을 통한 신뢰성 있는 저 손실 현장조립 광커넥터 설계)

  • Park, Byung-Chul;Rim, Chong-Suck;Jung, Jun-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.9
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    • pp.6-12
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    • 2011
  • In this paper, we propose a design method for a reliable and improved field-installable optical connectors(FIOC) which are needed for long-distance and low loss FTTH configuration. To this end, we optimize the angle of splicing between the inner fiber and the field fiber of the FIOC, so that the low loss connection of optical fibers is possible without using any angle alignment tools as well as angled cleavers. More precisely, we set the cutting angle of the inner filber and the field fiber to be $2^{\circ}$ by using an angled cleaver and $0^{\circ}{\sim}1^{\circ}$ by using a general fiber cutter, respectively. Splicing these two optical fibers without any further adjustment, we can keep the insertion loss within 0.3dB and the reflection loss within -60dB.

A Numerical Analysis on the Thermal Protection System Applied Phase Change Material (상변화물질을 이용한 열방어체계의 수치해석 연구)

  • Oh, Chang-Mook;Yoo, Yung-Joon;Min, Seong-Ki
    • Journal of the Korean Society of Propulsion Engineers
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    • v.16 no.4
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    • pp.80-86
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    • 2012
  • This study is for figuring out a possibility of realization of the thermal protection system(TPS) for temporary use under high temperature condition and improving a design of the future TPS. On this purpose, environmental condition of the system has been simplified: the boundary conditions consist of a internally heating surface and a externally heated surface which is simulating the external high temperature condition. Configuration of the system is simplified as a hexahedon. Melting characteristics of the phase change material(PCM) and air temperature variation of TPS with or without connector have been numerically analyzed and compared. As a result of numerical analysis, the heat from the internally heated surface could not be effectively transferred. Therefore, temperature of inner space has been increased.

Research on Vehicle Diagnostic and Monitoring technology Using WiBro Portable Device (와이브로 휴대기기를 사용한 차량진단 및 모니터링 기술에 관한 연구)

  • Ryoo, Hee-Soo;Won, Yong-Gwan;Park, Kwon-Chul;Ahn, Yong-Beom
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.47 no.10
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    • pp.17-26
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    • 2010
  • This is concerned with the technology to monitor the vehicle operation, failure and disorder by using WiBro portable device. More precisely, the technology makes it possible that the information collection device is connected to both ECU(Electronic Control Unit) which is the device for controlling engine, transmission, brake, air-bag, etc that are connected to in-vehicle network and OBD-II connector that is for data collection from various sensors. In addition, with a WiBro portable device (cell phone, PDA, PMP, UMPC, etc). equipped with a vehicle diagnostic programs, information for operation, failure and malfunction can be obtained and analyzed in real-time, and alarm is alerted when the vehicle is in abnormal status, which makes the early reactions to the status. Furthermore, the collected data can be sent through WiBro network to the server managed by the company specialized in managing the vehicles, thus the technology could help the drivers who have less knowledge about their auto-vehicles have safe and economic driving. There is always a possibility of malfunction due to various types of noise that are caused by wring-harness when the device is wired-connected. In this research, in order to overcome this problem, we propose a system configuration that can do monitoring and diagnosis with a device for collecting data from vehicle and a personal WiBro device. Also, we performed research on data acquisition and interlock for the system defined by the definition for information and data sharing platform.

Effects of implant alignment and load direction on mandibular bone and implant: finite element analysis (임플란트 배열과 하중 방향이 임플란트와 치조골에 미치는 유한요소 응력분석)

  • Chung, Hyunju;Park, Chan;Yun, Kwi-Dug;Lim, Hyun-Pil;Park, Sang-Won;Yang, Hongso
    • Journal of Dental Rehabilitation and Applied Science
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    • v.36 no.3
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    • pp.176-182
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    • 2020
  • Purpose: To evaluate the effects of load direction, number of implants, and alignment of implant position on stress distribution in implant, prosthesis, and bone tissue. Materials and Methods: Four 3D models were made to simulate posterior mandible bone block: two implants and 3-unit fixed dental prosthesis (FDP) with a pontic in the center (model M1), two implants and 3-unit FDP with a cantilever pontic at one end (model M2), FDP supported by three implants with straight line placement (model M3) and FDP supported by three implants with staggered implant configuration (model M4). The applied force was 120 N axially or 120 N obliquely. Results: Peak von Mises stresses caused by oblique occlusal force were 3.4 to 5.1 times higher in the implant and 3.5 to 8.3 times higher in the alveolar bone than those stresses caused by axial occlusal force. In model M2, the connector area of the distal cantilever in the prosthesis generated the highest von Mises stresses among all models. With the design of a large number of implants, low stresses were generated. When three implants were placed, there were no significant differences in the magnitude of stress between staggered arrangement and straight arrangement. Conclusion: The effect of staggering alignment on implant stress was negligible. However, the number of implants had a significant effect on stress magnitude.