• Journal of Mechanical Science and Technology
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• 제14권10호
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• pp.1104-1113
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• 2000

This paper proposes an efficient reverse engineering technique for compound surfaces using a boundary detection method. This approach consists in extracting geometric edge information using a vision system, which can be used in order to drastically reduce geometric errors in the vicinity of compound surface boundaries. Through the image-processing technique and the interpolation process, boundaries are reconstructed by either analytic curves (e. g. circle, ellipse, line) or parametric curves (B-spline curve). In other regions, except boundaries, geometric data are acquired on CMM as points inspected using a touch type probe, and then they are interpolated on several surfaces using a B-spline skinning method. Finally, the boundary edge and the skinned surfaces are combined to reconstruct the final compound surface. Through simulations and experimental works, the effectiveness of the proposed method is confirmed.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 1996년도 춘계공동학술대회논문집; 공군사관학교, 청주; 26-27 Apr. 1996
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• pp.100-103
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• 1996

Presented in this study is an algorithmic procedure to obtain polyhedral model from a compound surface. The compound surface in this study denotes a collection of trimmed surfaces without topological relations. The procedure consists of two main modules: CAD data interface, and surface conversion to polyhedral model. The interface module gets geometric information from CAD databases, and makes topological information by scanning the geometric information. We are investigating CATIA system as a data source system. In the surface conversion module, a shell(compound surface with topological information) is approximated to a triangular-faceted polyhedral surface model through node sampling and triangulation steps. The obtained polyhedral model should obey the vertex-to-vertex rule and meet tolerance requirements. Since the polyhedral model has a simple data structure and geometry processing for it is very efficient and robust, the polyhedral model can be used in various applications, such as surface rendering in computer graphics, FEM model for engineering analysis, CAPP for surface machining, data generation for SLA, and NC tool path generation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.429-433
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• 1995

Compound solid is maded for specially fixed object. A number of compound soild are devided as a unit germetric solid. The special case of rotation about an arbitrary axis makes according selection modelfor transformation. View plane and View region are estiblished for back face removal. After back-face removal eachedge is checked for point of intersection. The designing of of fset surface id maded and tool-path gernerted on the part surface. In tersection point is checked among the offset surfaces. The paper used an efficient algorithm for generating tool paths to apply a notion view volume. Through machining experiments with a 3-axis machining centre, the adequacy of the analysis was confirmed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.287-292
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• 2002

This paper presents a reverse engineering method for compound surfaces using vision system. A CNC machining center is used as a measuring station, which is equipped with slit beam generator and vision probe. Since obtained data using slit beam or laser scanner may have much data loss along the edge of compound surfaces, an algorithm is presented in this study to recover missing geometric data at such region. First, b-spline interpolation is applied to extract edge information of the surface, and as a next step, b-spline approximation is applied to recover the missing geometric data. Finally, b-spline skinning method is applied to regenerate the surface information. Appropriate simulation and experimental works are preformed to very the effectiveness of the proposed methods.

• 마이크로전자및패키징학회지
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• 제16권2호
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• pp.27-31
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• 2009

Sn whiskers can grow from the pure Sn and high Sn-based finish and cause the electrical shorts and failures. Even with the wealth of information on whiskers, we have neither the clear understanding of whisker growth nor methods for its prevention. In this study, the whisker grain roots which connected with intermetallic layer were analyzed by high-resolution transmission electron microscopy (HR-TEM). In the Sn-Cu plated leadframe (LF) that was stored at ambient condition for 540 days, filament-shaped whiskers were grown on the Sn-plated surface and ${\eta}'-Cu_6Sn_5$ precipitates were widely distributed along the grain boundaries at the Sn matrix. The measured of the lattice fringes at the ${\eta}'-Cu_6Sn_5$ was $4.71{\AA}$ at the coarse grain and $2.91{\AA}$ at the fine grain. The $Cu_3Sn$ which generates the tensile stresses was not observed. The formation of $Cu_6Sn_5$ precipitates and intermetallic layer were strongly related to whisker growth, but, the whisker growth tendency does not closely relate with the geometric morphology of irregularly grown intermetallic compound (lMC).

• 약학회지
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• 제55권2호
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• pp.81-90
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• 2011

Most antineoplastic agents are nonselective in their mechanism of action, affecting noncancerous as well as cancerous cells, and resulting in acute effects such as irritation of mucous membranes and chronic effects such as genotoxicity, teratogenicity, and carcinogenicity. Healthcare workers occupationally exposed to antineoplastic agents are at risk. The present study aimed to develop and apply methods to monitor occupational exposure to antineoplastic agents, using cyclophosphamide (CP) as the model compound. To monitor environmental and biological exposure, potentially contaminated surfaces were wiped and 24 hour urine samples were collected from workers. Liquid chromatography combined with tandem mass spectrometry was performed, with a limit of detection of 0.05 ng/ml. Measurable amounts of CP were detected on 92% of the sampled surfaces, with a geometric mean of 175.22 $ng/m^2$. Despite the environmental contamination of the model compound, CP was below the detection limit in all urine samples. If workplace contamination cannot be completely avoided, it is importance to reduce exposure to the lowest possible levels. To this aim, efforts to minimize occupational exposure along with biological and environmental monitoring are required. The standardized sampling techniques, and specific and sensitive analytical methods reported in this study may be helpful in assessing occupational exposure and devising strategies to reduce exposure.

• 대한기계학회논문집
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• 제18권8호
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.215-216
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• 2013

The silicide is a compound of Si with an electropositive component. Silicides are commonly used in silicon-based microelectronics to reduce resistivity of gate and local interconnect metallization. The popular silicide candidates, CoSi2 and TiSi2, have some limitations. TiSi2 showed line width dependent sheet resistance and has difficulty in transformation of the C49 phase to the low resistive C54. CoSi2 consumes more Si than TiSi2. Nickel silicide is a promising material to substitute for those silicide materials providing several advantages; low resistivity, lower Si consumption and lower formation temperature. Nickel silicide (NiSi) nanowire (NW) has features of a geometrically tiny size in terms of diameter and significantly long directional length, with an excellent electrical conductivity. According to these advantages, NiSi NWs have been applied to various nanoscale applications, such as interconnects [1,2], field emitters [3], and functional microscopy tips [4]. Beside its tiny geometric feature, NW can provide a large surface area at a fixed volume. This makes the material viable for photovoltaic architecture, allowing it to be used to enhance the light-active region [5]. Additionally, a recent report has suggested that an effective antireflection coating-layer can be made with by NiSi NW arrays [6]. A unique growth mechanism of nickel silicide (NiSi) nanowires (NWs) was thermodynamically investigated. The reaction between Ni and Si primarily determines NiSi phases according to the deposition condition. Optimum growth conditions were found at $375^{\circ}C$ leading long and high-density NiSi NWs. The ignition of NiSi NWs is determined by the grain size due to the nucleation limited silicide reaction. A successive Ni diffusion through a silicide layer was traced from a NW grown sample. Otherwise Ni-rich or Si-rich phase induces a film type growth. This work demonstrates specific existence of NiSi NW growth [7].