• Journal of the Korean Society of Safety
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• v.9 no.1
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• pp.100-109
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• 1994

In this study, it is investigated that the possibility of the numerical simulation for the incineration of the hazardous material, crbon tetrachloride($CCl_4$). A 3-dimensional numerical technology is applied for turbulent reacting flows of the full-scale Dow Chemical incinerator. The calculations are made by a CRAY-2S, super computer. The major parameters considered in this study are kiln revolution rate (rpm), filling ratio of the solid waste(f), burner Injection velocity and angle, and turbulent air jets for swirl. And the employed turbulent reaction model is the eddy break-up model which is a kind of fast chemistry model assuming general equilibrium and used for a premixed flame. The calculated flow fields are presented and discussed. 1) The presence of turbulent air nozzles for swirl gives rise to visible increase of the convective motion over the region of the solid waste. This implies the possibility to enhance the mixing of the waste with the surrounding all and thereby to reduce thermal and species stratification, which were reported in a large rotary kiln operation. 2) Considering that the location of the recirculation region has a strong relation with the heating rate of the solid waste, the control of the recirculation region by the burner injection angle Is quite desirable in the sense of the flexible design of the rotary kiln incinerator for a carbon tetrachloride. 3) Finally, it is found that the eddy break-up model Is not suitable for carbon tetrachloride($CCl_4$) because this model is not incorporated the flame inhibition trend due to the presence $CCl_4$compound.

• Korean Journal of Crystallography
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• v.15 no.1
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• pp.1-4
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• 2004

The title compound, $C_{18}H_{20}O_5S$, crystallized in the centrosymmetric space group $P\={1}$ with one molecule in an asymmetric unit. The S atom in the sulfonate group retains the overall tetrahedral environment of the O and C atoms with an average S-O bond of 1.420(2) ${\AA}$ for double bond and of 1.598(2) ${\AA}$ for single bond and S-C length of 1.742(3) ${\AA}$. The torsion angle C(7)-S-O(3)-C(8) is 100.3(2)$^{\circ}$ and the dihedral angle of the two planar six-membered rings is 42.73(20)$^{\circ}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.193-196
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• 2001

Single phase $CuInS_2$ thin film with the highest diffraction peak (112) at diffraction angle $(2\theta)$ of $27.7^{\circ}$ and the second highest diffraction peak (220) at diffraction angle $(2\theta)$ of $46.25^{\circ}$ was well made with chalcopyrite structure at substrate temperature of $70^{\circ}C$, annealing temperature of $250^{\circ}C$, annealing time of 60 min. The $CuInS_2$ thin film had the greatest grain size of $1.2{\mu}m$ and Cu/In composition ratio of 1.03. Lattice constant of a and c of that $CuInS_2$ thin film was 5.60 A and 11.12 A respectively. Single phase $CuInS_2$ thin films were accepted from Cu/In composition ratio of 0.84 to 1.3. P-type $CuInS_2$ thin films were appeared at over Cu/In composition ratio of 0.99. Under Cu/In composition ratio of 0.96, conduction types of $CuInS_2$ thin films were n-type. Also, fundamental absorption wavelength, the absorption coefficient and optical energy band gap of p-type $CuInS_2$ thin film with Cu/In composition ratio of 1.3 was 837 nm, $3.0{\times}104cm^{-1}$ and 1.48 eV respectively. When Cu/In composition ratio was 0.84, fundamental absorption wavelength, the absorption coefficient and optical energy band gap of n-type $CuInS_2$ thin film was 821 nm, $6.0{\times}10^4cm^{-1}$ and 1.51 eV respectively.

• Transactions on Electrical and Electronic Materials
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• v.4 no.1
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• pp.7-10
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• 2003

Single phase CuInS$_2$ thin film with the strongest diffraction peak (112) at diffraction angle (2$\theta$) of 27.7$^{\circ}$ and the second strongest diffraction peak (220) at diffraction angle (2$\theta$) of 46.25$^{\circ}$was well made with chalcopyrite structure at substrate temperature of 70$^{\circ}C$. annealing temperature of 250$^{\circ}C$, annealing time of 60 min. The CuInS$_2$ thin film had the greatest grain size of 1.2 Um when the Cu/In composition ratio of 1.03, where the lattice constant of a and c were 5.60${\AA}$ and 11.12${\AA}$, respectively. The Cu/In stoichiometry of the single-phase CuInS$_2$thin films was from 0.84 to 1.3. The film was p-type when tile Cu/In ratio was above 0.99 and was n-type when the Cu/In was below 0.95. The fundamental absorption wavelength, absorption coefficient and optical band gap of p-type CuInS$_2$ thin film with Cu/In=1.3 were 837nm, 3.OH 104 cm-1 and 1.48 eV, respectively. The fundamental absorption wavelength absorption coefficient and optical energy band gap of n-type CuInS$_2$ thin film with Cu/In=0.84 were 821 nm, 6.0${\times}$10$^4$cm$\^$-1/ and 1.51 eV, respectively.

• Applied Chemistry for Engineering
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• v.25 no.4
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• pp.352-356
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• 2014

PDMS modified epoxy resin with epoxy group (EMPDMS) was prepared from the reaction of ${\alpha},{\omega}$-aminopropylpolydimethylsiloxane and diglycidyl ether of bisphenol-A (DGEBA) based epoxy resin, and PDMS modified epoxy hybrid compound (EMPDMSH) was prepared by introducing alkylesteraminopropyl alkoxy silane to EMPDMS. Their structures were characterized using FT-IR, $^1H$-NMR and $^{29}Si$-NMR. Coating materials were prepared by mixing EMPDMSH base and solvent. Physical properties of the coating materials coated on epoxy/glass fiber composite film were measured according to the content of PDMS in EMPDMSH. Contact angle of coating film was increased 30 to 71 degree. Adhesive property of coating film was 5B degree better then epoxy or acrylate coating materials, and surface roughness was decreased as increasing in EMPDMSH.

• Polymer(Korea)
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• v.30 no.5
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• pp.391-396
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• 2006

It has been reported that plasma treatments are used to modify surface properties of polymers such as adhesivity hydrophobicity and hydrophilicity. Using plasma treatment, interfacial pro-perty can be introduced to a polymer surface without affecting the desired bulk properties of a material. In this study, commercial polyamide66 (PA66) /polyphenylene (PPE) polymer was modified by plasma treatment under a various gas specious for elimination of organic compound and polymer surface property with hvdrophilicity. PA66/PPE polymer with hydrophilicity was treated by RF plasma vacuum system under a various parameter such as gas specious, processing time and partial pressure. Hydrophilicity of PA66/PPE was confirmed by calculation of the surface free energy from contact angle measurement. The highest surface free energy of $50.03 mJ/m^2$ with the lowest contact angle of $14^{\circ}$ was obtained at plasma process power of 100 W, treatment time of 2 min and $Ar/O_2$ gases of 100 and 200 sccm. Moreover the change of organic compounds on the polymer surface was analyzed by fourier transforms infrared spectrometry (FTIR).

• Bulletin of the Korean Chemical Society
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• v.33 no.12
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• pp.4161-4164
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• 2012

Density functional MO calculations for the methylsilole anion of $[C_4H_4SiMe]^-$ and methylgermole anion of $[C_4H_4SiMe]^-$ at the B3LYP (full)/6-311+$G^*$ level (GAUSSIAN 94) were carried out and characterized by frequency analysis. The ground state structure for the methylsilole anion and methylgermole anion is that the methyl group is pyramidalized with highly localized structure. The difference between the calculated $C_{\alpha}-C_{\beta}$ and $C_{\beta}-C_{\beta}$ distances are 9.4 and 11.5 pm, respectively. The E-Me vector forms an angle of $67.9^{\circ}$ and $78.2^{\circ}$ with the $C_4E$ plane, respectively. The optimized structures of the saddle point state for the methylsilole anion and methylgermole anion have been also found as a planar with highly delocalized structure. The optimized $C_{\alpha}-C_{\beta}$ and $C_{\beta}-C_{\beta}$ distances are nearly equal for both cases. The methyl group is located in the plane of $C_4E$ ring and the angle between the E-Me vector and the $C_4E$ plane for the methylsilole anion and methylgermole anion is $2.0^{\circ}$ and $2.3^{\circ}$, respectively. The energy difference between the ground state structure and the transition state structure is only 5.1 kcal $mol^{-1}$ for the methylsilole anion. However, the energy difference of the methylgermole anion is 14.9 kcal $mol^{-1}$, which is much higher than that for the corresponding methylsilole monoanion by 9.8 kcal $mol^{-1}$. Based on MO calculations, we suggest that the head-to-tail dimer compound, 4, result from [2+2] cycloaddition of silicon-carbon double bond character in the highly delocalized transition state of 1. However, the inversion barrier for the methylgermole anion is too high to dimerize.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.193-196
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• 2001

Single phase CuInS$_2$ thin film with the highest diffraction peak (112) at diffraction angle (2$\theta$) of 27.7$^{\circ}$ and the second highest diffraction peak (220) at diffraction angle (2$\theta$) of 46.25$^{\circ}$ was well made with chalcopyrite structure at substrate temperature of 70 $^{\circ}C$, annealing temperature of 25$0^{\circ}C$, annealing time of 60 min. The CuInS$_2$ thin film had the greatest grain size of 1.2 ${\mu}{\textrm}{m}$ and Cu/In composition ratio of 1.03. Lattice constant of a and c of that CuInS$_2$ thin film was 5.60 $\AA$ and 11.12 $\AA$ respectively. Single phase CuInS$_2$ thin films were accepted from Cu/In composition ratio of 0.84 to 1.3. P-type CuInS$_2$ thin films were appeared at over Cu/In composition ratio of 0.99. Under Cu/In composition ratio of 0.96, conduction types of CuInS$_2$ thin films were n-type. Also, fundamental absorption wavelength, the absorption coefficient and optical energy band gap of p-type CuInS$_2$ thin film with Cu/In composition ratio of 1.3 was 837 nm, 3.0x10 $^4$ $cm^{-1}$ / and 1.48 eV respectively. When CuAn composition ratio was 0.84, fundamental absorption wavelength, the absorption coefficient and optical energy band gap of n-type CuInS$_2$ thin film was 821 nm, 6.0x10$^4$ $cm^{-1}$ / and 1.51 eV respectively.

• Korean Journal of Clinical Pharmacy
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• v.31 no.3
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• pp.205-215
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• 2021

Background: The treatment of primary open-angle glaucoma (POAG) or ocular hypertension (OHT) for intraocular pressure (IOP) reduction is recommended to proceed with the use of the compound. Therefore, this study aimed to evaluate the efficacy and safety of brinzolamide combination therapy on POAG and OHT following the subgroup analysis among types of brinzolamide combined medications. Methods: By June 2019, PubMed, EMBASE and Cochrane Library were searched to find a study that met our inclusion criteria. Based on randomized control trials (RCTs), we collected studies that tested the brinzolamide combination therapy in POAG and OHT patients, and analyzed the literature identified by the results of the study on IOP reduction and adverse reactions. Results: A total of 13 literature was collected to conduct an analysis including 2,197 patients. The intervention included brinzolamide combination therapies, combined with timolol, brimonidine, PGA or combined with both brimonidine and PGA. The analysis showed significant decreasing tendency for values at morning and end treatment per day in the use of brinzolamide combination therapy in the absolute IOP change (mean difference (MD) -1.41; 95% CI -1.92, -0.90; p<0.001 vs. MD -1.46; 95% CI -2.03, -0.89; p<0.00001, respectively). We could see higher adverse reactions in the brinzolamide combination group using intervention (odds ratio 1.43; 95% CI 1.20, 1.71; p<0.0001). Conclusion: Regarding IOP reduction in POAG and OHT patients, brinzolamide combination therapy is more effective but less safe than control treatment, which diverse among types of combined medications. Thus, more individualized therapy should be applied in real-world practice.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.12
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• pp.1178-1184
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• 2015

In conventional robotics, charge-coupled device (CCD) and complementary metal-oxide-semiconductor (CMOS) cameras have been utilized for acquiring vision information. These devices have problems, such as narrow optic angles and inefficiencies in visual information processing. Recently, biomimetic vision sensors for robotic applications have been receiving much attention. These sensors are more efficient than conventional vision sensors in terms of the optic angle, power consumption, dynamic range, and redundancy suppression. This paper presents recent research trends on biomimetic vision sensors and discusses future directions.