• Title/Summary/Keyword: Components

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Present State and Prospect of Sensor Technologies for Smart Building (스마트 빌덩용 센서 기술 현황 및 전망)

  • Park, K.H.;Choi, N.J.;Yang, W.S.;Lee, H.Y.;Lee, S.K.;Choi, C.A.;Kim, J.D.
    • Electronics and Telecommunications Trends
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    • v.24 no.6
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    • pp.1-10
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    • 2009
  • 지능형 센서 네트워크 기반의 첨단 IT 시스템을 이용한 실시간 환경 관리 및 보안 서비스를 제공하는 스마트 빌딩에서 다양한 빌딩내 환경 및 보안 정보를 감지하여 실시간으로 전달, 판단, 처리 및 제어할 수 있는 지능형 센서노드 플랫폼의 핵심 부품인 각종 센서의 제품 기술과 산업 현황을 분석하고 관련 센서 기술 및 산업의 미래 전망을 예측하였다.

Novel Maskless Bumping for 3D Integration

  • Choi, Kwang-Seong;Sung, Ki-Jun;Lim, Byeong-Ok;Bae, Hyun-Cheol;Jung, Sung-Hae;Moon, Jong-Tae;Eom, Yong-Sung
    • ETRI Journal
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    • v.32 no.2
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    • pp.342-344
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    • 2010
  • A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.

Optimal Burn-In for a Process with Weak Components

  • Kim, Kuinam J.;Boardman, Thomas J.
    • Journal of Korean Society for Quality Management
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    • v.24 no.4
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    • pp.70-89
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    • 1996
  • This paper discusses an optimal burn -in procedure to minimize total costs based on the assumption that some of the components are weak for stress and deteriorate faster than the main components. The procedure will define the costs of burn-in errors. An ideal burn-in consists of process in which all weak (substandard) components and no main (standard) components fail. In practice, the burn-in errors could occur for some reasons. For example, it is impossible to eliminate all weak components through burn-in, due to a nonzero proportion of defectives of the components. Probability model and cost function model are formulated to find the optimal burn-in time that minimizes the expected total cost. Several examples are included to show how to use the results.

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The Influence of the Asian Dust on the Metallic Composition of Fine and Coarse Particle Fractions (황사와 비황사기간의 중금속 농도분포 특성: 2001년 황사기간에 대한 비교연구)

  • 최규훈;김기현;강창희;이진홍
    • Journal of Korean Society for Atmospheric Environment
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    • v.19 no.1
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    • pp.45-56
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    • 2003
  • In this study the distribution patterns of the metallic components were analyzed both before and after the Asian Dust (AD) events at 2001 by comparing the chemical composition of metallic components in terms of various statistical methods. According to the AD/NAD concentration ratio of metallic components, the main components of crustal soils were exhibiting the values above 1.0; but opposite results were seen dominantly for hazardous metallic components. Examination of fine-to-coarse (F/C) ratios of metallic components showed higher values for major anthropogenic components including Pb (5.83). Ni (2.61), etc. Comparison of our measurement data with those obtained within and across the Korean peninsula indicated that the metallic distribution patterns of the study area can be distinguished from previous studies. The results of our analysis, when investigated in relation with air mass movement patterns. indicated evidence of the direct influence of AD events and anthropogenic processes.

Fabrication Scheduling of Products with Common and Unique Components at a Single Facility (공통 및 고유부품으로 구성되는 제품의 부품공급을 위한 단일설비 일정계획)

  • 윤상흠
    • Journal of the Korean Operations Research and Management Science Society
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    • v.28 no.4
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    • pp.105-114
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    • 2003
  • This paper considers a single facility scheduling problem for the fabrication of components supporting the subsequent assembly into products. Each product consists of two types of components, one is common to all products and the other is unique to itself. The unique components are processed individually and the common components are processed in batches, and a distinct setup is incurred for the production of a batch of common components. Under the so-called “batch availability” environment, we propose an efficient dynamic programming(DP) procedure for the optimal sequencing and batching schedule with minimum total completion times of products in the situation that each product is said to be complete if both common and unique components of the product are finished. Computational results show that the proposed DB procedure is more efficient than the previous work which has considered the same problem as this paper.

Diet components can suppress inflammation and reduce cancer risk

  • Hardman, W. Elaine
    • Nutrition Research and Practice
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    • v.8 no.3
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    • pp.233-240
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    • 2014
  • Epidemiology studies indicate that diet or specific dietary components can reduce the risk for cancer, cardiovascular disease and diabetes. An underlying cause of these diseases is chronic inflammation. Dietary components that are beneficial against disease seem to have multiple mechanisms of action and many also have a common mechanism of reducing inflammation, often via the $NF{\kappa}B$ pathway. Thus, a plant based diet can contain many components that reduce inflammation and can reduce the risk for developing all three of these chronic diseases. We summarize dietary components that have been shown to reduce cancer risk and two studies that show that dietary walnut can reduce cancer growth and development. Part of the mechanism for the anticancer benefit of walnut was by suppressing the activation of $NF{\kappa}B$. In this brief review, we focus on reduction of cancer risk by dietary components and the relationship to suppression of inflammation. However, it should be remembered that most dietary components have multiple beneficial mechanisms of action that can be additive and that suppression of chronic inflammation should reduce the risk for all three chronic diseases.

Reliability prediction of electronic components on PCB using PRISM specification (PRISM 신뢰성 예측규격서를 이용한 전자부품(PCB) 신뢰도 예측)

  • Lee, Seung-Woo;Lee, Hwa-Ki
    • Journal of the Korea Safety Management & Science
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    • v.10 no.3
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    • pp.81-87
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    • 2008
  • The reliability prediction and evaluation for general electronic components are required to guarantee in quality and in efficiency. Although many methodologies for predicting the reliability of electronic components have been developed, their reliability might be subjective according to a particular set of circumstances, and therefore it is not easy to quantify their reliability. In this study reliability prediction of electronic components, that is the interface card, which is used in the CNC(Computerized Numerical Controller) of machine tools, was carried out using PRISM reliability prediction specification. Reliability performances such as MTBF(Mean Time Between Failure), failure rate and reliability were obtained, and the variation of failure rate for electronic components according to temperature change was predicted. The results obtained from this study are useful information to consider a counter plan for weak components before they are used.

VLSI Implementation of H.264 Video Decoder for Mobile Multimedia Application

  • Park, Seong-Mo;Lee, Mi-Young;Kim, Seung-Chul;Shin, Kyoung-Seon;Kim, Ig-Kyun;Cho, Han-Jin;Jung, Hee-Bum;Lee, Duk-Dong
    • ETRI Journal
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    • v.28 no.4
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    • pp.525-528
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    • 2006
  • In this letter, we present a design of a single chip video decoder called advanced mobile video ASIC (A-MoVa) for mobile multimedia applications. This chip uses a mixed hardware/software architecture to improve both its performance and its flexibility. We designed the chip using a partition between the hardware and software blocks, and developed the architecture of an H.264 decoder based on the system-on-a-chip (SoC) platform. This chip contains 290,000 logic gates, 670,000 memory gates, and its size is $7.5\;mm{\times}7.5\;mm$ (using 0.25 micron 4-layers metal CMOS technology).

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Development of 2 inch LTPS-TFT AMOLED on Flexible Metal Foil

  • Park, Dong-Jin;Moon, Jae-Hyun;Kim, Yong-Hae;Chung, Choong-Heui;Lee, Myung-Hee;Lee, Jin-Ho;Song, Yoon-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1111-1114
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    • 2006
  • We have developed a 2 inch LTPS-TFT AMOLED display with a top emission structure on a $50-{\mu}m-thick$ metal foil. The Active matrix back planes were fabricated with the p-channel LTPS TFT with a conventional pixel circuit consisting of 2 transistors and 1 capacitance. The p-channel TFTs on the metal foil exhibited the field-effect mobility of $22cm^2/Vs$. Finally, a images from prototype monochrome AMOLED displays are successfully presented, with $64{\times}88$ pixels and 56-ppi resolution.

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RGB White Organic Light Emitting Diode with a Color Control Layer

  • Lee, Jeong-Ik;Chu, Hye-Yong;Yang, Yong-Suk;Lee, Mi-Do;Chung, Sung-Mook;KoPark, Sang-Hee;Hwang, Chi-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1587-1590
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    • 2006
  • Through the engineering of recombination region and energy transfer in organic light emitting device, blue and red light emitting device with good color stability has been successfully obtained. A Color control layer (CCL), which emits green light through the energy transfer from the emission layers, has been introduced into the blue and red light emitting device for RGB white OLED. The RGB white OLED showed the current efficiency of 13 cd/A and the CIE coordinates of (0.33, 0.38) at $1000\;cd/m^2$. The device exhibited very stable spectrum with respect to operating current density and the CIE coordinates varied from (0.34, 0.38) to (0.31, 0.37) for $100-22000\;cd/m^2$.

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