• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.3
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• pp.376-383
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• 2008

Generally a return current plane(RCP) of high speed digital and analog part is partitioned. This is achieved in order to decrease the noise interference between subsystem in PCBs(Printed Circuit Boards). However, when the connected signal line exists between each subsystem, this partition will cause unwanted effects. In a EMI(Electromagnetic Interference) point of view, the partition of the return current plane becomes a primary factor to increase the radiated emission. Component bridge(CB) is used for the way of maintaining radiated emission, still specific user's guide doesn't give sufficient principle. In a view point of EMI, design principle of multi-CB using method will be analyzed by measurement. And design principle of noise mitigation will be provided. Generally interval of multi-CB is ${\lambda}/20$ ferrite bead. In this study, When multi-CB connection is applied, design principle of ferrite bead and chip resistor is proved by measurement. Multi-connected chip resistance$(0{\Omega})$ is proved to be more effective design method in the point of EMI.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.19 no.3
• /
• pp.366-375
• /
• 2008

Generally a return current plane(RCP) of high speed digital and analog part is partitioned. This is achieved in order to decrease the noise interference between subsystem in PCBs(Printed Circuit Boards). However, when the connected signal line exists between each sub system, this partition will cause unwanted effects. In a circuital point of view, RCP partition has a bad influence upon signal integrity. In a EMI(Electromagnetic Interference) point of view, the partition of the return current plane becomes a primary factor to increase the radiated emission. Component bridge(CB) is usecl for the way of maintaining signal integrity, still specific user's guide doesn't give sufficient principle. In a view point of signal integrity, design principle of multi-CB using method will be analyzed by measurement and simulation. And design principle of noise mitigation will be provided. Generally interval of CB is ${\lambda}/20$ ferrite bead. In this study. When multi-CB connection is applied, design principle of ferrite bead and chip resistor is proved by measurement and simulation. Multi-connected chip resistance$(0{\Omega})$ is proved to be more effective design method in the point of signal integrity.