Optimization of Process Condition for Flip-Chip Bonding Process using Anisotropic Conductive Film(ACF) (ACF를 이용한 Flip-Chip 본딩 공정에서의 공정조건 최적화)
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- Proceedings of the Korean Society of Precision Engineering Conference
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- 2008.06a
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- pp.531-532
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- 2008