• Transactions of Materials Processing
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• v.13 no.4
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• pp.326-333
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• 2004

The nanoprobe based on lithography, mainly represented by SPM based technologies, has been recognized as a potential application to fabricate the surface nanosctructures because of its operational versatility and simplicity. However, nanoprobe based on lithography itself is not suitable for mass production because it is time a consuming method and not economical for commercial applications. One solution is to fabricate a mold that will be used for mass production processes such as nanoimprint, PDMS casting, and others. The objective of this study is to fabricate the silicon stamper for PDMS casting process by a mastless fabrication technique using the combination of nano/micro machining by Nanoindenter XP and KOH wet etching. Effect of the Berkovich tip alignment on the deformation was investigated. Grooves were machined on a silicon surface, which has native oxide on it, by constant load scratch (CLS), and they were etched in KOH solutions to investigate chemical characteristics of the machined silicon surface. After the etching process, the convex structures was made because of the etch mask effect of the mechanically affected layer generated by nanoscratch. On the basis of this fact, some line patterns with convex structures were fabricated. Achieved groove and convex structures were used as a stamper for PDMS casting process.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.3
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• pp.116-121
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• 2006

Most high-k materials are well known not to be etched easily, Some problems such as low etch rate poor sidewall angle, plasma damage, and process complexity were emerged from the high-density DRAM fabrication. Chemical mechanical polishing (CMP) by a damascene process was proposed to pattern this high-k material was polished with some commercial silica slurry as a function of pH variation. Sufficient removal rate with adequate selectivity to realize the pattern mask of tera-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible. The planarization was also achieved for the subsequent multi-level processes. Our new CMP approach will provide a guideline for effective patterning of high-k material by CMP technique.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• v.2
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• pp.131-136
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• 2006

Commercial uses of GPS have been growing rapidly with applications for aircraft, ship, and land vehicle navigation as well as for surveying and time keeping. The next generation GPS and Japanese QZS (Quasi Zenith Satellite) will provide three different civil signals. Galileo will also provide several types of civil signals. The availability of the third civil frequency has obvious advantages to instantaneous carrier phase accuracy and ambiguity resolution for centimeter level measurements. This paper discusses the effects of additional new civil signals for the high accuracy positioning in urban areas based on simulation using practical raw data. As for constellation, only GPS and GPS+QZS are considered. For positioning, a short distance baseline is assumed in order to disregard atmosphere effects. In this simulation, mask angle and signal conditions were fixed and ambiguity success rates were compared between different triple frequency combination scenarios. The coefficient of reflection was set randomly from 0.05 to 0.5 and the multipath delay was also set randomly from 5-100 m. Visible satellites and signal strength were determined by raw data collected in Tokyo by car. These simulation results have confirmed that the availability of high accuracy positioning will increase in all scenarios if we use GPS+QZS with triple frequencies.

• Journal of Adhesion and Interface
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• v.24 no.4
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• pp.120-123
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• 2023

Graphene, with its exceptional mechanical and electrical properties, has gained significant attention from researchers due to its superior characteristics compared to conventional materials. However, the application of graphene in electronic devices requires a crucial transcription and patterning process, which often introduces numerous defects, substantially impairing its properties. To overcome this limitation and unlock the full potential of graphene for commercial use, there have been various efforts to develop integrated processes for transcription and patterning. In this study, we present a novel growth method that simultaneously achieves precise patterning using polymer nanowires as masks, allowing for the direct growth of graphene. This innovative approach holds promise for realizing advanced electronic components based on nanomaterials in the future.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.32 no.1
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• pp.53-63
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• 2022

Objectives: This study was designed to evaluate the filtration efficiency, inhalation resistance, and liquid resistance of commercial reusable masks in comparison to the performance of KF-AD masks (reference masks). Methods: Thirty-six masks were purchased from an online market. Filtration efficiency and inhalation resistance were determined in the same manner as in MFDS certification testing, respectively using TIL/IL & Filter Test 1300S (SFP Services, UK) and Breathing Resistance Analyzer DA2001 (Lambda Ray, South Korea). Results: Most of the filtration efficiencies found for the 19 masks were far lower than the test standard for KF-certified masks. Four masks met KF94 and three masks even met KF80. Most inhalation resistances were also much lower than the standard, with many almost one-half of the standard. In addition, all the masks except KF-AD masks did not pass the liquid resistance test. Conclusions: Although most of the filtration efficiency performance results found in this study for the reusable masks, which emerged as an alternative, were lower than the standard for health masks, multi-use masks can be used with a replacement filter inserted.

• Journal of the Korea Fashion and Costume Design Association
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• v.16 no.4
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• pp.217-228
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• 2014

The purpose of this study is to grasp inconveniences and improvements by examining wearing condition and satisfaction of protective clothing targeting 114 Korean farmers and to suggest basic data for enhancement of pattern and wearing satisfaction of protective clothing by understanding problems of pesticide-proof clothing through comparative analysis on the size of its commercial products. Most of male subjects were in charge of spraying pesticide, whereas female were most likely to play an assistant role to hold the hose of pesticide applicator. Both of female and male subjects were very aware of the harmful effect of pesticide on human body and tried to take off the clothes immediately after spraying it to reduce possible damage caused by pesticide. As a result of examining wearing condition, the farmers avoided wearing protective clothing because that it feels hot, stuffy, and uncomfortable to move. This hesitant response of wearing the clothing was not shown significantly in case of female subjects who play an assistant role for spraying. Although the farmers wore protective equipments such as mask or gloves in a proper way as compared to protective clothing, they seemed to choose alternative way rather than best way to block pesticide completely. The satisfaction regarding to the fitting of protective clothing which the subjects showed low in all items of upper-lower clothes except waistline. It is necessary to improve the functionality such as relief from heat stress and convenience for movement rather than design or economic in protective clothing development. As a result of comparing the size of five kinds of commercial protective clothing, the farmers got confused to choose the product since designation method of size across companies showed a significant difference in an identical clothing size. In addition, the sizing system developed on a basis of a well-built man has become a hindering factor in wearing satisfaction of female farmers.

• Journal of Satellite, Information and Communications
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• v.2 no.2
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• pp.22-28
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• 2007

Spectrum spreading, in its general form, can be conceived as an artificial expansion of the signal bandwidth with respect to the minimum Nyquist band required to transmit the desired information. Spreading can be functional to several objectives, including resilience to interference and jammers and reduction of power spectral density levels. In the paper, signal spreading is manly used for increasing the received energy, thus satisfying link budget constraints, for terminals with low aperture antennas, without increasing the transmitted EIRP. As a matter of fact, in many mobile scenarios, even when MODCOD configurations with very low spectral efficiency (i.e. QPSK-1/4) in DVB-S2 standard, are used, the link budget cannot be closed. Spectrum spreading has been recently proposed as a technique to improve system performance without introducing additional MODCOD configurations under the constraint of fixed power spectrum density level at the transmitter side. To this aim, the design of spectrum spreading techniques shall keep into consideration requirements such as spectrum mask, physical layer performance, link budget, hardware reuse, robustness, complexity, and backward compliance with existing commercial equipments. The proposed implementation allows to fully reuse the standard DVB-S2 circuitry and is inserted as an 'inner layer' in the standard DVB-S2 chain.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.81.2-81.2
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• 2012

To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.1
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• pp.18-26
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• 2016

The semiconductor industry is one of the key industries of Korea, which has continued growing at a steady annual growth rate. Important technology for the semiconductor industry is high integration of devices. This is to increase the memory capacity for unit area, of which key is photolithography. The photolithography refers to a technique for printing the shadow of light lit on the mask surface on to wafer, which is the most important process in a semiconductor manufacturing process. In this study, the width and step-height of wafers patterned through this process were measured to ensure uniformity. The widths and inter-plate heights of the specimens patterned using photolithography were measured using transmissive digital holography. A transmissive digital holographic interferometer was configured, and nine arbitrary points were set on the specimens as measured points. The measurement of each point was compared with the measurements performed using a commercial device called scanning electron microscope (SEM) and Alpha Step. Transmission digital holography requires a short measurement time, which is an advantage compared to other techniques. Furthermore, it uses magnification lenses, allowing the flexibility of changing between high and low magnifications. The test results confirmed that transmissive digital holography is a useful technique for measuring patterns printed using photolithography.