• Journal of Sensor Science and Technology
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• v.24 no.2
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• pp.131-136
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• 2015

This paper presents a wide dynamic range complementary metal oxide semiconductor (CMOS) image sensor with column capacitor and feedback structure. The designed circuit has been fabricated by using $0.18{\mu}m$ 1-poly 6-metal standard CMOS technology. This sensor has dual mode operation using combination of active pixel sensor (APS) and passive pixel sensor (PPS) structure. The proposed pixel operates in the APS mode for high-sensitivity in normal light intensity, while it operates in the PPS mode for low-sensitivity in high light intensity. The proposed PPS structure is consisted of a conventional PPS with column capacitor and feedback structure. The capacitance of column capacitor is changed by controlling the reference voltage using feedback structure. By using the proposed structure, it is possible to store more electric charge, which results in a wider dynamic range. The simulation and measurement results demonstrate wide dynamic range feature of the proposed PPS.

• Journal of Sensor Science and Technology
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• v.26 no.2
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• pp.85-90
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• 2017

A wide dynamic range (WDR) CMOS image sensor (CIS) was developed with a specialized readout architecture for realizing high-sensitivity (HS) and low-sensitivity (LS) reading modes. The proposed pixel is basically a three-transistor (3T) active pixel sensor (APS) structure with an additional transistor. In the developed WDR CIS, only one mode between the HS mode for relatively weak light intensity and the LS mode for the strong light intensity is activated by an external controlling signal, and then the selected signal is read through each column-parallel readout circuit. The LS mode is implemented with the column capacitors and a feedback structure for adjusting column capacitor size. In particular, the feedback circuit makes it possible to change the column node capacitance automatically by using the incident light intensity. As a result, the proposed CIS achieved a wide dynamic range of 94 dB by synthesizing output signals from both modes. The prototype CIS is implemented with $0.18-{\mu}m$ 1-poly 6-metal (1P6M) standard CMOS technology, and the number of effective pixels is 176 (H) ${\times}$ 144 (V).

• Journal of IKEEE
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• v.24 no.4
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• pp.942-949
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• 2020

In this paper, we propose an improved algorithmic ADC for CMOS Image Sensor that is suitable for a column-parallel readout circuit. The algorithm of the conventional algorithmic ADC is modified so that it can operate as a single amplifier while being independent of the capacitor ratio and insensitive to the gain of the op-amp, and it has a high conversion efficiency by using an adaptive biasing amplifier. The proposed ADC is designed with 0.18-um Magnachip CMOS process, Spectre simulation shows that the power consumption per conversion speed is reduced by 37% compared with the conventional algorithmic ADC.

• Journal of Sensor Science and Technology
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• v.14 no.3
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• pp.191-197
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• 2005

When fabricating a vision chip, we should consider the noise problem, such as the fixed pattern noise(FPN) due to the process variation. In this paper, we propose an edge-detection circuit based on biological retina using the offset-free column readout circuit to reduce the FPN occurring in the photo-detector. The offset-free column readout circuit consists of one source follower, one capacitor and five transmission gates. As a result, it is simpler and smaller than a general correlated double sampling(CDS) circuit. A vision chip for edge detection has been designed and fabricated using $0.35\;{\mu}m$ 2-poly 4-metal CMOS technology, and its output characteristics have been investigated.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.13 no.1
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• pp.8-16
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• 2020

In this paper, a single-bit 2nd-order delta-sigma modulator with the architecture of cascaded-of-integrator feedforward (CIFF) is proposed for column-parallel analog-to-digital converter (ADC) array used in a low noise CMOS image sensor. The proposed modulator implements two switched capacitor integrators and a single-bit comparator within only 10-㎛ column-pitch for column-parallel ADC array. Also, peripheral circuits for driving all column modulators include a non-overlapping clock generator and a bias circuit. The proposed delta-sigma modulator has been implemented in a 110-nm CMOS process. It achieves 88.1-dB signal-to-noise-and-distortion ratio (SNDR), 88.6-dB spurious-free dynamic range (SFDR), and 14.3-bit effective-number-of-bits (ENOB) with an oversampling ratio (OSR) of 418 for 12-kHz bandwidth. The area and power consumption of the delta-sigma modulator are 970×10 ㎛2 and 248 ㎼, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.12
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• pp.1033-1044
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• 2002

In this Paper, a new FRAM design technique utilizing grounded-plate PMOS-gate (GPPG) ferroelectric cell is proposed. A GPPG cell consists of a PMOS access transistor and a ferroelectric data storage capacitor. Its plate is grounded. The proposed architecture employs three novel methods for cell operation: 1) $V_{DD}$ -precharged bitline, 2) negative-voltage wordline technique and 3) negative-pulse restore. Because this configuration doesn't need the plate control circuitry, it can greatly increase the memory cell efficiency. In addition, differently from other reported common-plate cells, this scheme can supply a sufficient voltage of $V_{DD}$ to the ferroelectric capacitor during detecting and storing the polarization on the cell. Thus, there is no restriction on low voltage operation. Furthermore, by employing a compact column-path circuitry which activates only needed 8-bit data, this architecture can minimize the current consumption of the memory array. A 4- Mb FRAM circuit has been designed with 0.3-um, triple-well/1-polycide/2-metal technology, and the possibility of the realization of GPPG cell architecture has been confirmed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.1
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• pp.52-59
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• 2010

This paper proposes a high-resolution and high-frame rate CMOS image sensor with column-wise cyclic ADC. The proposed ADC uses the sharing techniques of OTAs and capacitors for low-power consumption and small silicon area. The proposed ADC was verified implementing the prototype chip as QVGA image sensor. The measured maximum frame rate is 120 fps, and the power consumption is 130 mW. The power supply is 3.3 V, and the die size is $4.8\;mm\;{\times}\;3.5\;mm$. The prototype chip was fabricated in a 2-poly 3-metal $0.35-{\mu}m$ CMOS process.

• Nano
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• v.13 no.11
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• pp.1850136.1-1850136.12
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• 2018

Three-dimensional (3D) mixed phases NiSe nanoparticles growing on the nickel foam were synthesized via a simple one-step hydrothermal method. A series of experiments were carried out to control the morphology by adjusting the amount of selenium in the synthetic reaction. Meanwhile, the as-prepared novel column-acicular structure NiSe exist three advantages including ideal electrical conductivity, high specific capacity and high cycling stability. It delivered a high capacitance of $10.8F\;cm^{-2}$ at a current density- of $5mA\;cm^{-2}$. An electrochemical capacitor device operating at 1.6 V was then constructed using NiSe/NF and activated carbon (AC) as positive and negative electrodes. Moreover, the device showed high energy density of $31W\;h\;kg^{-1}$ at a power density of $0.81kW\;kg^{-1}$, as well as good cycling stability (77% retention after 1500 cycles).

• Analytical Science and Technology
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• v.10 no.4
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• pp.231-239
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• 1997

We developed a procedure that can effectively separate and determine tertiary amines and quaternary ammonium salts in some samples with reverse phase ion-pair high performance chromatography, employing indirect spectrophotometric detection method. Detection and ion-pairing reagents used in this study were benzyl trimethylammonium chloride (BTMACl) and sodium dodecyl sulfate(DDSANa), respectively. Eluting the electrolyte solutions of some commercial electrolytic capacitors with a MeOH(40):water(60) eluent (pH 8.5 adjusted with NH4Cl-NH3 buffer) containing 0.010M DDSANa and 0.004 M BTMACl through Supelco LC-18 or ${\mu}$-Bondapak phenyl column, amines and ammonium salts contained in the sample were successfully separated and determined. Varying the composition, especially the content of quaternary ammonium salts, of electrolyte solutions based on this analysis. we could prepare the low impedance(0.08~0.13) electrolytic capacitors with excellent electrical properties and it was a confirmation that the analysis is favorable.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.5
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• pp.87-97
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• 2016

This work proposes a time-shared 10b DAC based on a two-step resistor string to minimize the effective area of a DAC channel for driving each AMOLED display column. The proposed DAC shows a lower effective DAC area per unit column driver and a faster conversion speed than the conventional DACs by employing a time-shared DEMUX and a ROM-based two-step decoder of 6b and 4b in the first and second resistor string. In the second-stage 4b floating resistor string, a simple current source rather than a unity-gain buffer decreases the loading effect and chip area of a DAC channel and eliminates offset mismatch between channels caused by buffer amplifiers. The proposed 1-to-24 DEMUX enables a single DAC channel to drive 24 columns sequentially with a single-phase clock and a 5b binary counter. A 0.9pF sampling capacitor and a small-sized source follower in the input stage of each column-driving buffer amplifier decrease the effect due to channel charge injection and improve the output settling accuracy of the buffer amplifier while using the top-plate sampling scheme in the proposed DAC. The proposed DAC in a $0.18{\mu}m$ CMOS shows a signal settling time of 62.5ns during code transitions from '$000_{16}$' to '$3FF_{16}$'. The prototype DAC occupies a unit channel area of $0.058mm^2$ and an effective unit channel area of $0.002mm^2$ while consuming 6.08mW with analog and digital power supplies of 3.3V and 1.8V, respectively.