• Title/Summary/Keyword: Coated layer

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Effect of Talc on Improvement of Gravure Printability of Coated Paperboard

  • Kim, Chang-Keun;Cheong, Hee-Seok;Cho, Byoung-Uk;Lee, Yong-Kyu
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 2006.06b
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    • pp.505-508
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    • 2006
  • Talc has been used as coating pigments for gravure printing paper and light weight coated paper (LWC) in Europe for 30 years and the use of talc has been significantly increased every year. Currently, talc is used for about 15% of pigments for paper coating. Especially more than 50% of the coating pigments for gravure printing paper and web printing paper (web off-set) is applying talc. The use of talc improves printability, smoothness, and the coverage of base paper, and showed a significant effect on reducing the coated paper basis weight. In addition, it improves compressibility of the coating layer, influencing the gravure printability.

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Evaluation of thermal conductivity in REBCO coated conductor

  • Yong-Ju, Hong;Sehwan, In;Hyobong, Kim;Hankil, Yeom
    • Progress in Superconductivity and Cryogenics
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    • v.24 no.4
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    • pp.78-83
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    • 2022
  • REBCO coated conductors are widely used for HTS power application, high magnetic field magnet application, and etc. A thermal stability of the REBCO conductor is essential for the operation of HTS-based device, and thermal conductivities of the conductor are relevant parameters for modeling cryogenic heat transfer. REBCO conductors consist of a REBCO layer, copper layers for electrical stabilization and a hastelloy substrate. At cryogenic temperature, thermal conductivity of copper and silver strongly depend on the purity of the material and the intensity of the magnetic field. In this study, thermal conductivities of the laminated composite structure of REBCO conductor are evaluated by using the thermal network model and the multidimensional heat conduction analysis. As a result, the thermal network model is applicable to REBCO conductors configured in series or parallel alone and multidimensional heat conduction analysis is necessary for complex cases of series and parallel configuration.

Adhesion Characteristics between Stamp and Polymer Materials Used in Thermal Nanoimprint Lithography (열 나노임프린트 리소그래피에서 사용되는 스탬프와 폴리머 재료 사이의 점착 특성)

  • Kim Kwang-Seop;Kang Ji-Hoon;Kim Kyung-Woong
    • Tribology and Lubricants
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    • v.22 no.4
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    • pp.182-189
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    • 2006
  • In this paper, the adhesion characteristics between a fused silica without or with an anti-sticking layer and a thermoplastic polymer film used in thermal NIL were investigated experimentally in order to identify the release performance of the anti-sticking layer. The anti-sticking layers were derived from fluoroalkylsilanes, (1H, 1 H, 2H, 2H-perfluorooctyl)trichlorosilane ($F_{13}-OTS$) and (3, 3, 3-trifluoropropyl)trichlorosilane (FPTS), and coated on the silica surface in vapor phase. The commercial polymers, mr-I 7020 and 8020 (micro resist technology, GmbH), for thermal NIL were spin-coated on Si substrate with a rectangular island which was fabricated by conventional microfabrication process to achieve small contact area and easy alignment of flat contact sur- faces. Experimental conditions were similar to the process conditions of thermal NIL. When the polymer film on the island was separated from the silica surface after imprint process, the adhesion force between the silica surface and the polymer film was measured and the surfaces of the silica and the polymer film after the separation were observed. As a result, the anti-sticking layers remarkably reduced the adhesion force and the surface damage of polymer film and the chain length of silane affects the adhesion characteristics. The anti-sticking layers derived from FPTS and $F_{13}-OTS$ reduced the adhesion force per unit area to 38% and 16% of the silica sur-faces without an anti-sticking layer, respectively. The anti-sticking layer derived from $F_{13}-OTS$ was more effective to reduce the adhesion, while both of the anti-sticking layers prevented the surface damages of the polymer film. Finally, it is also found that the adhesion characteristics of mr-I 7020 and mr-I 8020 polymer films were similar with each other.

Fabrication of cube textured Au/Ni template using electoless-plating (무전해 도금법을 이용한 cube 집합조직을 가지는 Au/Ni template 제조)

  • Lim Jun Hyung;Kim Jung Ho;Jang Seok Hem;Kim Kyu Tae;Lee Jin Sung;Yoon Kyung Min;Joo Jinho;Kim Chan-Joong;Ha Hong-Soo;Park Chan
    • Progress in Superconductivity
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    • v.6 no.2
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    • pp.133-137
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    • 2005
  • We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.

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Characteristics of Electroplated Ni Thick Film on the PN Junction Semiconductor for Beta-voltaic Battery (베타전지용 PN 접합 반도체 표면에 도금된 Ni 후막의 특성)

  • Kim, Jin Joo;Uhm, Young Rang;Park, Keun Young;Son, Kwang Jae
    • Journal of Radiation Industry
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    • v.8 no.3
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    • pp.141-146
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    • 2014
  • Nickel (Ni) electroplating was implemented by using a metal Ni powder in order to establish a $^{63}Ni$ plating condition on the PN junction semiconductor needed for production of beta-voltaic battery. PN junction semiconductors with a Ni seed layer of 500 and $1000{\AA}$ were coated with Ni at current density from 10 to $50mA\;cm^{-2}$. The surface roughness and average grain size of Ni deposits were investigated by XRD and SEM techniques. The roughness of Ni deposit was increased as the current density was increased, and decreased as the thickness of Ni seed layer was increased. The results showed that the optimum surface shape was obtained at a current density of $10mA\;cm^{-2}$ in seed layer with thickness of $500{\AA}$, $20mA\;cm^{-2}$ of $1000{\AA}$. Also, pure Ni deposit was well coated on a PN junction semiconductor without any oxide forms. Using the line width of (111) in XRD peak, the average grain size of the Ni thick firm was measured. The results showed that the average grain size was increased as the thickness of seed layer was increased.

Oxidation Behaviors and Degradation Properties of Aluminide Coated Stainless Steel at High Temperature (알루미나이드 확산코팅된 스테인레스 합금의 내산화 및 내삭마 특성)

  • Hwang, Cheol Hong;Lee, Hyo Min;Oh, Jeong Seok;Hwang, Dong Hyeon;Hwang, Yu Seok;Lee, Jong Won;Choi, Jeong Mook;Park, Joon Sik
    • Journal of Powder Materials
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    • v.28 no.5
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    • pp.396-402
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    • 2021
  • Stainless steel, a type of steel used for high-temperature parts, may cause damage when exposed to high temperatures, requiring additional coatings. In particular, the Cr2O3 product layer is unstable at 1000℃ and higher temperatures; therefore, it is necessary to improve the oxidation resistance. In this study, an aluminide (Fe2Al5 and FeAl3) coating layer was formed on the surface of STS 630 specimens through Al diffusion coatings from 500℃ to 700℃ for up to 25 h. Because the coating layers of Fe2Al5 and FeAl3 could not withstand temperatures above 1200℃, an Al2O3 coating layer is deposited on the surface through static oxidation treatment at 500℃ for 10 h. To confirm the ablation resistance of the resulting coating layer, dynamic flame exposure tests were conducted at 1350℃ for 5-15 min. Excellent oxidation resistance is observed in the coated base material beneath the aluminide layer. The conditions of the flame tests and coating are discussed in terms of microstructural variations.

Resistance Switching Mechanism of Metal-Oxide Nano-Particles Memory on Graphene Layer

  • Lee, Dong-Uk;Kim, Dong-Wook;Kim, Eun-Kyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.318-318
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    • 2012
  • A graphene layer is most important materials in resent year to enhance the electrical properties of semiconductor device due to high mobility, flexibility, strong mechanical resistance and transparency[1,2]. The resistance switching memory with the graphene layer have been reported for next generation nonvolatile memory device[3,4]. Also, the graphene layer is able to improve the electrical properties of memory device because of the high mobility and current density. In this study, the resistance switching memory device with metal-oxide nano-particles embedded in polyimide layer on the graphene mono-layer were fabricated. At first, the graphene layer was deposited $SiO_2$/Si substrate by using chemical vapor deposition. Then, a biphenyl-tetracarboxylic dianhydride-phenylene diamine poly-amic-acid was spin coated on the deposited metal layer on the graphene mono-layer. Then the samples were cured at $400^{\circ}C$ for 1 hour in $N_2$ atmosphere after drying at $135^{\circ}C$ for 30 min through rapid thermal annealing. The deposition of aluminum layer with thickness of 200 nm was done by a thermal evaporator. The electrical properties of device were measured at room temperature using an HP4156a precision semiconductor parameter analyzer and an Agilent 81101A pulse generator. We will discuss the switching mechanism of memory device with metal-oxide nano-particles on the graphene mono-layer.

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Palmitoylpolysaccharide-coated Liposomes As A Potential Oral Drug Carrier (경구용 약물수송체로서의 팔미토일 치환 다당체로 코팅된 리포좀)

  • Hahn, Yang-Hee;Yi, Jung-Woo;Choi, Young-Wook
    • Journal of Pharmaceutical Investigation
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    • v.24 no.2
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    • pp.73-83
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    • 1994
  • Applications of liposomes as a drug carrier for the oral delivery of poorly-absorbable macromolecular drugs have been limited, because of their instability in gastrointestinal environments including pH, bile salts, and digestive enzymes. Two polysaccharides, dextran(DX) and pullulan(PL), were introduced to the preformed liposomes in order to enhance the stability. Palmitoyl derivatives of polysaccharides, palmitoyldextran(PalDX) and palmitoylpullulan(PalPL), were synthesizd and introduced to the liposomes during preparation for the same purpose of stability. The effects of these polysaccharides coating were evaluated basically by physical properties of particle size distribution and optical microscopy, then compared with uncoated liposomes by the observations of both in vitro stability and in vovo absorption characteristics. The geometric mean diameters of polysaccharide-coated liposomes were greater than that of uncoated liposome, showing the outermost polysaccharide-coated layer under the optical microscopy. In vitro stabilities of uncoated or polysaccharides-coated liposomes were measured by turbidity changes in various pH buffer solutions containing sodium choleate as bile salts. While uncoated liposome was very sensitive to bile salts, polysaccharides-coated liposomes were stable in relatively higher concentrations of sodium choleate, giving the results of better stability of PalDX- and PalPL-coated liposomes than that of DX- and PL-coated liposomes. After liposomal encapsulation of acyclovir(ACV), an antiviral agent as a model drug, it has been administered orally to rats as dose of ACV 40 mg/kg. Plasma concentrations of ACV were assayed by HPLC and analyzed by model-independent pharmacokinetics. Pharmacokinetic parameters of Cmax, tmax, and [AUC] have been compared.

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Numerical Investigation of Forming Limit of Clad Coated Sheet Metals (클래드코팅재의 성형성에 대한 수치적연구)

  • 정태훈
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.340-345
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    • 2003
  • By the use of a similar numerical method as that in the previous paper, the forming limit strain by coating method of clad sheet metals is investigated, in which the FEM is applied and J2G(J2-Gotoh's corner theory) is utilized as the plasticity constitutive equation. Clad two-layer sheets and sheets bonded with dissimilar sheets on both surface planes are stretched in a plane-strain state, with various work-hardening exponent n-values and thicknesses of each layer. Processes of shear-band formation in such composite sheets are clearly illustrated. It is concluded that, in the clad state, the higher limiting strain of one layer is reduced due to the lower limiting strain of the other layer and vice versa, and does not necessarily obey the rule of linear combination of the limiting strain of each layer weighted according thickness.

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Study for the Film Coating Techniqur of Gilt Bronze Artifacts from Mir ksa Temple (미륵사지 출토 고대 금동유물의도금기법에 관한 연구)

  • Lim, Sun-Ki;Kang, Dai-Ill;Kim, Sun-Dug;Park, Dong-Kyu;Kang, Sung-Goon
    • 보존과학연구
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    • s.14
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    • pp.45-76
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    • 1993
  • Au-Cu alloyed coating layer were found by Hg-amalgam process and it seemed to be used Cu-amalgam process similar to Au-amalgam. Coated layer is dense and unique, Thickness of layer was 1.5 to $18.0\mum$ which had 95.3 to 99.8% purity of gold Matrix metal mostly cosists of forged copper alloy which had high purity and ferrite ($\alpha$) strusture. It showed excellent refining technical level at that time. Aowever, the nail, ferrous matrix used for strength needed, composed of silver foil packed and gold layer for adherence between ferrous matrix and gold layer

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