• Title/Summary/Keyword: Co-planar PCBs

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Residues of Co-planar PCBs in Ginseng at Environment of North Gyeongbuk (경북 북부 인삼 재배환경 중 Co-planar PCBs의 잔류)

  • Kim, Jung-Ho
    • Journal of Environmental Science International
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    • v.20 no.8
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    • pp.987-995
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    • 2011
  • Co-planar PCBs(polychlorinated biphenyls) of non-ortho are investigated in soil and ginseng on the North Gyeongbuk with HRGC/HRMS. PCB77 in soil on Yeongju and Sangju are detected 0.0007 pgTEQ/g and 0.0009 pgTEQ/g, respectively. PCB81 in soil on Yeongju and Sangju are detected 0.0113 pgTEQ/g and 0.0108 pgTEQ/g, respectively. Also PCB126 in soil on Yeongju and Sangju are detected 0.0907 pgTEQ/g and 0.0944 pgTEQ/g, respectively. But PCB169 in soil on Yeongju and Sangju is not detected. Total Co-planar PCBs of non-ortho in soil on Yeongju and Sangju are 0.1027 pgTEQ/g and 0.1061 pgTEQ/g, respectively. PCB77 in ginseng on Yeongju and Sangju are detected 0.0008 pgTEQ/g. Then PCB81 in ginseng on Yeongju and Sangju are detected 0.0104 pgTEQ/g and 0.0112 pgTEQ/g, respectively. But PCB126 in ginseng on Yeongju and Sangju are detected 0.0585 pgTEQ/g and 0.0579 pgTEQ/g, respectively. PCB169 in ginseng on Yeongju and Sangju is not detected. Total Co-planar PCBs of non-ortho in ginseng on Yeongju and Sangju are 0.0697 pgTEQ/g and 0.0700 pgTEQ/g, respectively. Relationship of PCBs in between soil and ginseng shown significance($R^2$ : 0.99).

Analyzing Co-planar PCBs in Food by HRGC/HRMS with Isotopic Dilution Method (동위원소희석법 HRGC/HRMS에 의한 식품 중 Co-planar PCBs 분석)

  • Choi, Dongmi;Suh, Junghyuck;Kim, Minjung;Hong, Mooki;Kim, Changmin;Song, Insang
    • Analytical Science and Technology
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    • v.16 no.4
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    • pp.325-332
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    • 2003
  • To analyze co-planar PCBs in food, the isotopic dilution method by high resolution gas chromatography/high resolution mass spectrometry was applied. Among 209 PCB congeners, 12 congeners (#77, #81, #126, #169, #105, #114, #118, #123, #156, #157, #167 and #189) were chosen as target compounds that were toxic congeners re-assessed by WHO in 1998. Milk and milk products including cheese and butter were collected as food samples. Samples were homogenized, spiked with the known amount of the standard mixture and extracted. After extraction, extracts were cleaned up by sulfuric acid impregnated silica gel, purified on silica gel and alumina column chromatography and then analyzed by HRGC/HRMS. As results, the overall recoveries were ranged from 83% to 106% and the limit of detection was about 0.1 pg/g at signal/noise>3. Levels of targets in the selected food samples were 0.001~0.107 pgWHO-TEQ/g.

PYE [2-(1-pyrenyl)ethyldimethylsilylated silica] Column HPLC and HR-GC-(micro) ECD in the Accurate Determination of Toxic Co-planar PCBs and Polybrominated Diphenyl Ethers (PBDEs)

  • Kannan, Narayanan;Hong, Sang-Hee;Oh, Jae-Ryoung;Yim, Un-Hyuk;Li, Donghao;Shim, Won-Joon
    • Bulletin of the Korean Chemical Society
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    • v.26 no.4
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    • pp.529-536
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    • 2005
  • Measurement of toxicologically relevant polychlorinated biphenyl (PCB) congeners such as non-ortho(IUPAC#) 77, 81, 126, 169 and mono-ortho 105, 114, 118, 123, 156, 157, 189 and di-ortho 170, 180 and polybrominated diphenyl ethers (PBDEs) such as 47, 66, 85, 99, 100, 138, 153, 154 in environmental samples become almost mandatory in several countries now. However, most of the available methods involve expensive instrumentations such as HRGC-HRMS or ECNI-LRMS, apart from expensive extraction and clean-up (with large volume of solvents) steps. A method has been devised combining the analytical separation power of PYE [2-(1-pyrenyl)ethyldimethysilylated silica] column HPLC and high-resolution gas chromatographic techniques including micro-electron capture detection (ECD) and two dimensional gas chromatograpy-ECD techniques to determine these eco-toxic substances at parts-per-trillion (ppt) levels. This combination resolves co-elution of congeners that occur in disproportionate ratios (e.g. CB-110 and -77) and allows accurate congener-specific determination of target compounds. This method is cost effective as it requires only hexane, that in small quantities (10 mL) and GC-ECD. The elution and analysis time are optimized to less man hours. This method is effectively utilized in the analysis of co-planar PCBs and PBDEs from archived solvent extracts of samples previously analyzed for pesticides and PCBs. Structure based separation of contaminant classes improves GCECD determination at ppt levels.

A Comparative Study on Adsorption of PCB Congeners in Mineral Oil by Activated Carbon (활성탄에 의한 광유내 PCB Congeners의 흡착에 관한 비교 연구)

  • Ryoo, Keon Sang
    • Journal of the Korean Chemical Society
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    • v.41 no.5
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    • pp.239-245
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    • 1997
  • The sorption kinetic was studied to evaluate feasibility of removing PCBs from mineral oil with activated carbon. Adsorption efficiency for Aroclor 1242 which is composed of lower chlorinated PCB formulations was $\geq$ 95%, whereas the adsorption efficiency for Aroclor 1260 having higher chlorinated constituents was considerably lower with the efficiency falling to 75%. The observed difference in the adsorption efficiency is attributed to the geometry of PCBs with non-planar and coplanar structure. The concentration of coplanar PCBs is appreciably higher in Aroclor 1242. Since toxicity is primarily associated with coplanar congeners, the preferential adsorption of coplanar congeners by activated carbon accounts for the fact that toxicity reduction can be achieved through this process. The efficiency of process was assessed in terms of Toxicity Equivalence Factor (TEF).

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Analysis of Dioxins in Meat by HRGC/HRMS (HRGC/HRMS를 이용한 국내유통 육류 중 다이옥신류 분석)

  • Choi, Dongmi;Hu, Soojung;Jeong, Jiyoon;Won, Kyungpoong
    • Analytical Science and Technology
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    • v.14 no.1
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    • pp.88-93
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    • 2001
  • To measure the levels of dioxins in food selling at local markets, meat was analyzed by high resolution gas chromatography/high resolution ass spectrometry (HRGC/HRMS). The food samples were obtained from 5 large cities of Seoul, Chunchon, Daejon, Kwangju and Busan in Korea. All the samples were minced and extracted with Soxhlet extractor for 18 hours. After extraction, extracts were cleaned up by sulfuric acid impregnated silica gel, purified on a series of silica gel, alumina, carbon column chromatography and then analyzed by HRGC/HRMS. The contaminated levels were calculated as the TEQs by multiplying with the corresponding WHO-TEFs for each congeners. The overall recoveries were ranged from 80% to 153% and the limit of detection was about 0.01 ppt at S/N>3. The levels of PCDD/Fs for beef, pork and chicken were 0.018, 0.008 and <0.001 pgTEQ/g, respectively. In addition, the levels of non-ortho-co-planar PCBs for beef, pork and chicken were 0.008, 0.002 and 0.001 pgTEQ/g, respectively. Among food samples analyzed, chicken showed the lowest level of dioxin-like compounds. Regarding congener pattern, OCDD and PCB #77 were the highest contributing congeners.

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Studies on the Interfacial Reaction of Screen-Printed Sn-37Pb, Sn-3.5Ag and Sn-3.8Ag-0.7Cu Solder Bumps on Ni/Au and OSP finished PCB (Ni/Au 및 OSP로 Finish 처리한 PCB 위에 스크린 프린트 방법으로 형성한 Sn-37Pb, Sn-3.5Ag 및 Sn-3.8Ag-0.7Cu 솔더 범프 계면 반응에 관한 연구)

  • Nah, Hae-Woong;Son, Ho-Young;Paik, Kyung-Wook;Kim, Won-Hoe;Hur, Ki-Rok
    • Korean Journal of Materials Research
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    • v.12 no.9
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    • pp.750-760
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    • 2002
  • In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.