• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.147.2-147.2
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• 2007

• Proceedings of the Korean Magnestics Society Conference
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• 2003.12a
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• pp.276-276
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• 2003

• Proceedings of the Korean Magnestics Society Conference
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• 2003.06a
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• pp.108-109
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• 2003

• Proceedings of the Korean Magnestics Society Conference
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• 2005.12a
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• pp.60-61
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• 2005

• Journal of the Korean Ceramic Society
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• v.43 no.2 s.285
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• pp.74-78
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• 2006

A non-integrated type noise filter on a Coplanar Waveguide (CPW) transmission line is demonstrated by using a highly resistive $Co_{41}Fe_{38}Al_{13}O_8$ nanogranular thin film with the dimensions of $4\;mm (\iota)\times4\;mm(\omega)\times0.1\;{\mu}m(t)$. The noise suppression characteristics are evaluated without placing an insulating layer between the CPW line and the magnetic thin film. The insertion loss is very low being less than 0.3 dB and this low value is maintained up to 2 GHz. At a ferromagnetic resonance frequency of 3.3 GHz, the power loss is very large and the degree of noise attenuation is measured to be 3 dB. This level of noise attenuation is still small for real applications; however, considering the small magnetic volume used in this work, further improvement is expected by simply increasing the magnetic volume and by integrating the magnetic thin film into the CPW transmission line.

• Journal of Surface Science and Engineering
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• v.32 no.1
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• pp.61-66
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• 1999

The Spin-dependent tunneling magnetoresistance (TMR) effect was observed in $NiFe/Al_2O_3$/Co thin films. The samples were prepared by magnetron sputtering in a system with a base pressure of $3\times10^{-6}$Torr. the insulating $Al_2O_3$layer was prepared by r.f. plasma oxydation method of a metallic Al layer. The ferromagnetic and insulating layers were deposited through metallic masks to produce the cross pattern form. The junction has an active area of $0.3\times0.3\textrm{mm}^2$ and the $Al_2O_3$layer is deposited through a circular mask with a diameter of 1mm. It is very important that insulating layer is formed very thinly and uniformly in tunneling junction. The ferromagnetic layer was fabricated in optimum conditions and the surface of that was very flat, which was observed by AFM. Tunneling junction was confirmed through nonlinear I-V curve. $NiFe/Al_2O_3$/Co junction was observed for magnetization behavior and magnetoresistance property and magnetoresistance property is dependent on magnetization behavior and magnetoresistance property and magnetoresistance property is dependent on magnetization behavior of t재 ferromagnetic layer. The maximum magnetoresistance ratio was about 6.5%.

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.220-221
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• 2002

There has been a demand for higher frequency operation of magnetic devices. Consideration of the materials that could be applicable to such high frequency applications is the first step when designing magnetic thin films for high-frequency use. Materials suitable for high frequency application should have a larger $M_{S}$ and an appropriate anisotropy field ( $H_{K}$), which increase a resonance frequency, and also a larger $\rho$, which reduces eddy current loss. (omitted)ted)

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.314.1-314.1
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• 2007

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.