• Laser Solutions
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• v.6 no.2
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• pp.27-33
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• 2003

A laser shock cleaning technology is a new dry cleaning methodology for the effective removal of small particles from the surface. This technique uses a plasma shock wave produced by a breakdown of air due to an intense laser pulse. In order to optimize the laser shock cleaning process, it needs to evaluate the cleaning performance quantitatively by using a monitoring technique. In this paper, an acoustic monitoring technique was attempted to investigate the laser shock cleaning process with an aim to optimize the cleaning process. A wide-band microphone with high sensitivity was utilized to detect acoustic signals during the cleaning process. It was found that the intensity of the shock wave was strongly dependent on the power density of laser beam and the gas species at the laser beam focus. As a power density was larger, the shock wave became stronger. It was also seen that the shock wave became stronger in the case of Ar gas compared with air and N$_2$ gas.

• Laser Solutions
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• v.3 no.1
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• pp.2-11
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• 2000

Laser cleaning has begun to attract a considerable amount of interest recently as a new cleaning technique among scientists and engineers. The unique characteristics of laser cleaning are currently finding successful applications in industry, in medicine as well as in the world of art conservation. This paper takes an overview of the laser cleaning technique itself including basic principles and characteristics, and provides an account of current trends especially with regard to practical applications. Experience with its successful applications in various fields shows that laser cleaning may be about to emerge as a real alternative to conventional cleaning methods.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.295-298
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• 2015

Ozone micro-bubble cleaning system was designed, and made to develop a unique technique to clean wafers by using ozone micro-bubbles. The ozone micro-bubble cleaning system consisted of loading, cleaning, rinsing, drying and un-loading zones, respectively. In case of the cleaning the silicon wafers of a solar cell, more than 99 % of cleaning efficiency was obtained by dipping the wafers at 10 ppm of ozone for 10 minutes. Both of long cleaning time and high ozone concentration in the wet-solution with ozone micro-bubbles reduced cleaning efficiency because of the re-sorption of debris. The cleaning technique by ozone micro-bubbles can be also applied to various wafers for an ingot and LED as an eco-friendly method.

• Laser Solutions
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• v.4 no.2
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• pp.39-45
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• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.743-746
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• 2000

The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

• Air Cleaning Technology
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• v.3 no.2 s.10
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• pp.129-131
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• 1990

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.11a
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• pp.23-26
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• 2000

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning performance and time-resolved optical diagnostics are performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• Journal of Korean Society of Water and Wastewater
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• v.29 no.4
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• pp.459-468
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• 2015

Deposits discharged through the cleaning mainly were cement mortar, bitumen paintings and rust pieces, and fragments of perforation, stones and gravels. Deposits were more removed through swabbing pig cleaning rather than air scouring cleaning on the whole. However, air scouring cleaning were not influenced by the constraint conditions such as a change in the diameter or the presence of the valve in water mains compare to swabbing pig cleaning. So, it was thought that air scouring cleaning might be more favorable to water distribution network cleaning in the future. After the cleaning, water quality including residual chlorine and turbidity also was improved because of the removal of a significant amount of the deposits. Therefore, if the cleaning is continuously and regularly implemented in water mains, it is expected that it will help to recover the reliability and to preserve the health of water quality.

• Membrane Journal
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• v.27 no.6
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• pp.519-527
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• 2017

Membrane fouling is the main issue hindering the expansion of low pressure membrane processes for surface water treatment. Therefore, applying periodic hydraulic cleaning for fouling control should be well optimized. Better understanding of membrane fouling associated with periodic hydraulic cleaning would be useful to optimize membrane cleaning strategies. By comparing experimental permeability data with the classical Hermia blocking laws, this study aims at analyzing membrane fouling and understanding dominant fouling mechanisms occurring when filtering a synthetic surface water solution with a pressurized membrane process during six filtration cycles of 30 min each, separated with cyclic cleaning of 1 min by backwashing and forward flushing separately and combined. When applying single cleaning technique, membrane fouling during the first cycles was controlled by complete blocking mechanism while the last cycles were dominated by cake formation. Nevertheless, when combining cleaning technique better membrane regeneration was obtained and fouling was mainly due to cake formation.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.33 no.4
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• pp.419-426
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• 2023

Objectives: This study aims to develop an Occupational Safety and Health (OSH) guide for the safe cleaning of contaminated machinery, equipment, and parts used in the electronics manufacturing process. Methods: A literature review, field investigations, and discussions were conducted. An initial draft of an OSH guide was developed and reviewed by experts with significant experience in maintenance work in the electronics manufacturing process in order to refine the guide. Results: Workers involved in cleaning processes with chemicals, solvents, and abrasive blasting can face exposure to a wide range of chemicals, abrasives, and noise. Identifying potential risks associated with each cleaning technique was an essential first step toward enhancing safety measures. The OSH guide comprises approximately eleven to twelve sections spanning 20-25 pages. It includes engineering and administrative protocols systematically organized to address the necessary actions before, during, and after cleaning tasks, depending on the technique. It is recommended that airline respirator masks be used in conjunction with an air purification system to ensure adherence to air quality standard "D" for atmosphere level. The use of an oil-free air compressor is advised, preferably a stationary model that does not rely on fuel sources like diesel. Conclusions: This OSH guide is designed to protect workers involved in maintenance activity in the electronics industry and aligns with global standards, such as those from the International Organization for Standardization (ISO) and Semiconductor Equipment and Material International, ensuring a higher level of safety and compliance.