• 한국산업융합학회 논문집
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• 제25권6_3호
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• pp.1315-1324
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• 2022

The need for remanufacturing ships and various mechanical components continues to increase along with environmental problems. Research on remanufacturing is being carried out in various fields, but research on cleaning is quite insufficient. In particular, there is no research on the cleaning-ability of diverse mechanical components. In order to increase the life cycle of mechanical components, remanufacturing must be considered from the step of design. Particularly, it is also very important to evaluate the degree of easiness in cleaning to remove various pollutants generated by long-term use quickly as well as easily. In this study, the degree of easiness in cleaning is defined as cleaning-ability. In fact, remanufacturing components can be easily done only when cleaning-ability is set high from the step of design. The purpose of this study is to evaluate the cleaning-ability of ships and various mechanical components. The details of easiness in cleaning are cleaning and drying identification, accessibility to cleaning tools, convenience in cleaning, and convenience in drying. This study presents a quantitative procedure to evaluate cleaning-ability, derived various factors influencing each of the details of easiness and their ranges, and gave scores to the factors according to their ranges. The weight was also calculated for the details of easiness in cleaning and the factors. Lastly, this researcher suggests a scoring procedure to evaluate cleaning-ability quantitatively and the total weight of cleaning-ability.

• 청정기술
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• 제10권2호
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• pp.61-72
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• 2004

본 연구에서는 물성, 세정성, 헹굼액의 유수분리성을 고려하여 유기용매의 종류 및 함량, 계면활성제의 종류 및 함량, 부조계면활성제/계면활성제 (cosurfactant/surfactant, A/S) 비율 등의 변수로 하여 수계/준수계 세정제를 개발하였다. 개발된 세정제들은 대부분 평균 액적크기가 10 ~ 20 nm의 미세 나노입자를 형성 하였으며, 30.2~32.5 dyne/cm의 낮은 표면장력과 낮은 점도 값을 보여 주었다. 플럭스에 대한 용해력은 계면활성제의 소수성이 증가할수록 높게 나타났으며 terpene을 함유한 세정제들이 hydrocarbon 함유 세정제와 대응 시판세정제에 비해 우수한 용해력을 보여 terpene계 세정제가 대체세정제로의 적합성을 보여주었다. 또한, 개발된 세정제들을 함유한 헹굼액은 시판세정제에 비하여 우수한 유수분리성을 보여 헹굼액의 재활용이 가능하여 경제적인 부담과 수질오염을 줄일 수 있음을 보여주었다. 그리고 이렇게 개발된 세정제를 L 전자 회사의 전자부품 생산라인 SMT(surface mount technology) 세정공정에 적용시켜 보았다. 그 결과 solder cream 제거에 있어서 에탄올, 이소프로필알콜(IPA), glycol ether과 같은 물질이 함유된 기존의 세정제에 비하여 세정성능이 2 배이상 향상되었고 생산현장에서 악취와 VOC의 문제를 해결시킬 수 있었다.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.61-73
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.

• 분석과학
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• 제6권1호
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• pp.65-75
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• 1993

오존층 파괴물질로 규명된 CDC 113의 대체 세정제를 수집하여 실험적인 방법으로 밀도, 표면장력, 굴절지수, 비점, pH, 점도, 인화점, 용해도를 측정하였다. 대체세정제는 크게 수계 세정제, 준수계 세정제, 알코올 및 케톤계 세정제, 할로겐 세정제로 나누어서 측정한 물성들을 비교하였다. 전자산업의 잔자회로기판(PCB)에 사용되는 flux의 주성분인 abietic acid와 각 세정제의 용해실험은 HPLC를 사용하여 용해도를 구하였다. 각 분류별 세정제는 장단점을 갖추고 있으며 최종 사용자는 물성에 의한 세정제의 효율성과 세정방법 뿐만 아니라 안정성, 경제성을 종합적으로 고려해야 한다. 본 연구의 목적은 시판중인 CFC 113의 대체 세정제를 수집하여 물성을 측정하고 비교함으로써 사용자가 원하는 최적의 대체 세정제를 선정하는 데 기본적인 자료를 제공하는 것이다.

• 청정기술
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• 제12권1호
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• pp.1-9
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• 2006

산업세정제 중에서 환경친화적이라 대체 세정제로 유망한 수계세정제를 배합하고 임의 세정성을 평가하였다. 수계세정제 배합시 EO부가 몰수가 3, 5, 7인 primary alcohol ethoxylate계열의 비이온계면활성제를 주계면활성제(S)로 하고 음이온계면활성제, 알코올류 등을 보조계면활성제(A)로 하여 수계세정제를 배합하였고, 이들 배합비(A/S)에 따른 절삭유와 그리스의 혼합오염물에 대한 세정성을 평가하였다. 또한 builder인 NaOH, KOH, $Na_2CO_3$, $NaHCO_3$를 첨가하여 세정효율 향상을 평가하였다. 세정성 평가 실험결과 보조계면활성제로는 음이온계면활성제인 Triethanolamine Lauryl Sulfate(TLS) 사용 시에 가장 세정효율이 좋았고, builder로는 NaOH, $Na_2CO_3$가 우수한 세정효율을 보여주었다.

• 한국레이저가공학회지
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• 제6권2호
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• pp.27-33
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• 2003

A laser shock cleaning technology is a new dry cleaning methodology for the effective removal of small particles from the surface. This technique uses a plasma shock wave produced by a breakdown of air due to an intense laser pulse. In order to optimize the laser shock cleaning process, it needs to evaluate the cleaning performance quantitatively by using a monitoring technique. In this paper, an acoustic monitoring technique was attempted to investigate the laser shock cleaning process with an aim to optimize the cleaning process. A wide-band microphone with high sensitivity was utilized to detect acoustic signals during the cleaning process. It was found that the intensity of the shock wave was strongly dependent on the power density of laser beam and the gas species at the laser beam focus. As a power density was larger, the shock wave became stronger. It was also seen that the shock wave became stronger in the case of Ar gas compared with air and N$_2$ gas.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2001년도 춘계학술대회 발표논문집
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• pp.124-128
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• 2001

A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature Process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as functional water cleaning are being studied. The electrolyzed water was generated by an electrolysis system which consists of anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH$_4$Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO$_2$ concentration changes dissolved from air. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about 9$\ell$chemicals, while EW did only 400$m\ell$ HCI electrolyte or 600$m\ell$ NH$_4$Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for eliminating environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

• 공기청정기술
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• 제21권2호
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• pp.9-19
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• 2008

• 공기청정기술
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• 제5권4호통권19호
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• pp.50-58
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• 1992

• 공기청정기술
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• 제5권4호통권19호
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• pp.59-69
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• 1992