• 대한전자공학회논문지SD
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• 제39권12호
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• pp.1045-1054
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• 2002

System-On-a-Chip(SOC)에 대하여 테스트 데이터 압축 및 저전력 스캔테스팅에 대한 새로운 알고리즘을 제안하였다. 스캔벡터내의 don't care 입력들을 저전력이 되도록 적절하게 값을 할당하였고 높은 압축율을 갖도록 적응적 인코딩을 적용하였다. 또한 스캔체인에 입력되는 동안 소모되는 scan-in 전력소모를 최소화하도록 스캔벡터의 입력 방향을 결정하였다. ISCAS 89 벤치마크 회로에 대하여 실험한 결과는 평균전력 소모는 약 12% 감소되었고 압축율은 약 60%가 향상됨을 보였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

• ETRI Journal
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• 제32권6호
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• pp.969-971
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• 2010

Based on a de-embedding technique, a new method is proposed which is capable of evaluating chip impedance behavior over absorbed power in flip-chip bonded UHF radio frequency identification transponder ICs. For the de-embedding, four compact co-planar test fixtures, an equivalent circuit for the fixtures, and a parameter extraction procedure for the circuit are developed. The fixtures are designed such that the chip can absorb as much power as possible from a power source without radiating appreciable power. Experimental results show that the proposed modeling method is accurate and produces reliable chip impedance values related with absorbed power.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.471-474
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• 2001

Recently, due to demands of faster speed and extra features for the chip mounters, there has been ever-demanding needs for the basic technology. Until four or five years ago, chip mounters placing 0.3sec/chip were considered to be in the high speed category, but since then it has become a borderline for categorizing high speed machines capable of placing 0.1sec/chip. In this study, in order to analyze the vibration of head generated by the dynamic behavior of x-frame, FEM model is composed and modal analysis is performed to identify the dynamic characteristics of the structure. Those results are compared with the modal test in order to verify the model. In this paper, Several other factors, such as definition of dynamic accuracy, static accuracy and tolerance of the axis settling range, that might affect the dynamic behavior the head are discussed.

• 한국안전학회지
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• 제30권1호
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• pp.66-71
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• 2015

Safety, resilience and comfort of pedestrian were assessed by the British Pendulum Test and SB/GB factor test at 8 kinds of sidewalk pavement. Sidewalk paving materials were normal concrete, porous concrete, concrete block, soil concrete, asphalt, rubber chip/resin mixture, wood chip/resin mixture and floor tile. In addition, a survey was conducted to investigate the perception of pedestrians on the sidewalk paving material. As a result, while the skid resistance value was measured in the most 60BPN above, the floor tile showed a low value of about 30BPN. The ratios of SB factor to GB factor of the elastic pavements(rubber/resin mixture and wood chip/resin mixture) appeared to be relatively large when compared with those of the conventional sidewalks. The survey showed that respondents perceived as more safe and comfortable elastic pavements compared to conventional pavements. Approximately 50% of respondents answered that hardened soil pavement was the most environmentally friendly.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.97-101
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• 1996

In this paper, We have studied internal quality incluiding chemical compositions, microscopic structrue and nonmetalic inclusion of test materials. We have analyzed dynamic characteristics of cutting resistence including tensile strength value, hardeness value, impact value etcs. We have compared chip treatments of test materials. In analyzing internal quality, all of test materials have typical ferrite+pearlite structure. But, nonmetallic inclusion have oxide and sulfide inclusion in medium carbon steels, mainly sulfide inclusion is existed in S-free cutting steels. In Ca+S-free cutting steels, calcium aluminate and sulfide complex inclusion, had low-melting points, as deformation of sulfide and oxide inclusion is existed. machining characteristics, cutting resistence is maximum in Ca+S-free cutting steels, minimum in medium carbon steels. Chip treatements are excellent in S-free cutting steels, similar to the Ca+S free cutting steels and medium carbon steels.

• Geomechanics and Engineering
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• 제15권3호
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• pp.811-822
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• 2018

Chip size distribution can be used to evaluate the cutting efficiency and to characterize the cutting behavior of rock during cutting and fragmentation process. In this study, a series of linear cutting tests was performed to investigate the effect of cutting conditions (specifically cut spacing and penetration depth) on the production and size distribution of rock chips. Linyi sandstone from China was used in the linear cutting tests. After each run of linear cutting machine test, the rock chips were collected and their size distribution was analyzed using a sieving test and image processing. Image processing can rapidly and cost-effectively provide useful information of size distribution. Rosin-Rammer distribution pamameters, the coarseness index and the coefficients of uniformity and curvature were determined by image processing for different cutting conditions. The size of the rock chips was greatest at the optimum cut spacing, and the size distribution parameters were highly correlated with cutter forces and specific energy.

• 한국정밀공학회지
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• 제14권7호
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• pp.22-28
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• 1997

In this paper, We have studied internal quality incluiding chemical compositions, microscopic structure and nonmetalic inclusion of test material. We have analyzed dynamic characteristics of cutting resistence and compared chip treatment of the test material. In analyzing internal quality, all of the test material have typical ferrite+pearlite structure. But, nonmetallic inclusion has oxide and sulfide inclusion has oxide and sulfide inclusion in medium carbon steel, mainly sulfide inclusion is existed in S-free cutting steel. In Ca+S-free cutting steel, calcium aluminate and sulfide complex inclusion, had low-melting point, as deformation of sulfide and oxide inclusion is existed. Machining characteristics, cutting resistence is maximum in medium carbon steel. Chip treatement are excellent in S-free cutting steel, similar to the Ca+S free cutting steel and medium carbon steel.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권3호
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• pp.293-296
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• 2012

SOC test methodology in ultra deep submicron (UDSM) technology with reasonable test time and cost has begun to satisfy high quality and reliability of the product. A novel hierarchical test architecture using IEEE standard 1149.1, 1149.7 and 1500 compliant facilities is proposed for the purpose of supporting flexible test environment to ensure SOC test methodology. Each embedded core in a system-on- a-chip (SOC) is controlled by test access ports (TAP) and TAP controller of IEEE standard 1149.1 as well as tested using IEEE standard 1500. An SOC device including TAPed cores is hierarchically organized by IEEE standard 1149.7 in wafer and chip level. As a result, it is possible to select/deselect all cores embedded in an SOC flexibly and reduce test cost dramatically using star scan topology.

• Journal of Welding and Joining
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• 제30권6호
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.