• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Journal of Bio-Environment Control
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• v.23 no.2
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• pp.158-166
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• 2014

This experiment has investigated suitable methods to improve precision water content monitoring of coconut coir substrates to control irrigation by frequency domain reflectometry(FDR) sensors. Specifically, water content changes and variations were observed at different sensing distances and positions from the irrigation dripper location, and different spaces between the FDR sensors with or without noise filters. Commercial coconut coir substrates containing different ratios of dust and chips(10:0, 7:3, 5:5, 3:7) were used. On the upper side and the side of the substrates, a FDR sensor was used at 5, 10, 20, 30cm distances respectively from the irrigation dripper point, and water content was measured by time after the irrigation. In the glass beads, sensors were installed with or without noise filtering. Closer sensing distance had a higher water content increasing rate, regardless of different coir substrate ratios. There were no differencies of water content increasing rates in 10:0 and 3:7 substrates between the upper side and the side. Whereas, 7:3 and 5:5 substrates showed higher increasing rates on the upper side measurements. Substrates with higher ratios of chip(3:7) had lower increasing rates than others. And, with noise filters, the exatitude of measurement was improved because the variation and deviation were reduced. Therefore, in coconut coir with FDR sensors, an efficient water content measurment to control irrigations can be achieved by installing sensors closer to an irrigation point and upper side of substrates with noise filters.

• Analytical Science and Technology
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• v.11 no.2
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• pp.112-119
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• 1998

A Siemens SemiQuant (SSQ) 3000 program, a precalibrated 'standardless' analytical program handling up to 90 elements, was evaluated for the fast analysis of various types of reference materials using a wavelength dispersive X-ray spectrometer. Various types of standard reference materials such as metal discs, metal chips, and geological materials in powder form were analysed and it took 23 minutes of measuring time for 75 elements. Measurements of geological reference materials using different sampling methods were carried out and their data were interactively evaluated. The analysis of materials of a known matrix concentration such as stainless steels provided higher precision value compared to totally unknown samples. The analyses of materials prepared as pressed pellets or fused glass beads provided higher precision values compared to the measurement of loose powders with a foil on the sample surface and helium operation, though their sampling procedures were more complicate and took more time. Since very light elements such as boron, carbon, and oxygen have a strong influence on the matrix effects and also on the calculation of effective matrix corrections, the rhodium Compton check was applied to verify the reliability of the defined light element concentrations of light matrix materials and the defined major sample compounds. Failure of defining correct matrix resulted in an unoptimized matrix correction and therefore in the wrong calculation of the element concentration.

• Journal of the Korean Chemical Society
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• v.48 no.5
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• pp.483-490
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• 2004

We have developed a novel polymerase chain reaction (PCR)-microchip gel electrophoresis (MGE) method based on the sieving gel mixture of commercially available poly(vinylpyrrolidone) (PVP) and hydroxy ethyl cellulose (HEC) for the rapid detection and diagnosis of the orf virus (ORFV) from Korean indigenous goat. After amplification of 594-bp DNA fragment from the B2L gene of ORF virus, the amplicon was analyzed by the MGE separation. The glass microfluidic chip (64 mm total length (36 mm effective length)${\times}$90 ${\mu}$m width${\times}$20 ${\mu}$m depth) allowed the fast detection and diagnosis of ORFV in the mixture of 1.0% PVP ($M_r$ 360,000) and 1.0% HEC ($M_r$250,000) as a sieving matrix with better resolution and reproducibility of DNA fragments. Under the electric field of 277.8 V/cm, the 594-bp DNA was analyzed within 4 min. Compared to traditional slab gel electrophoresis, the PCR-MGE method was twenty times faster and an effective clinical method for the quantitative analysis of ORFV.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.11-15
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• 2001

In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

• Journal of Radiation Protection and Research
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• v.40 no.4
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• pp.194-201
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• 2015

We have investigated the EPR signal properties in 12 components of two mobile phones (LCD, OLED) using electron paramagnetic resonance (EPR) spectrometer in this study.EPR measurements were performed at normal atmospheric conditions using Bruker EXEXSYS-II E500 spectrometer with X-band bridge, and samples were irradiated by $^{137}Cs$ gamma-ray source. To identify the presence of radiation-induced signal (RIS), the EPR spectra of each sample were measured unirradiated and irradiated at 50 Gy. Then, dose-response curve and signal intensity variating by time after irradiation were measured. As a result, the signal intensity increased after irradiation in all samples except the USIM plastic and IC chip. Among the samples, cover glass(CG), lens, light guide plate(LGP) and diffusion sheet have shown fine linearity ($R^2$ > 0.99). Especially, the LGP had ideal characteristics for dosimetry because there were no signal in 0 Gy and high rate of increase in RIS. However, this sample showed weakness in fading. Signal intensity of LGP and Diffusion Sheet decreased by 50% within 72 hours after irradiation, while signals of Cover Glass and Lens were stably preserved during the short period of time. In order to apply rapidly EPR dosimetry using mobile phone components in large-scale radiation accidents, further studies on signal differences for same components of the different mobile phone, fading, pretreatment of samples and processing of background signal are needed. However, it will be possible to do dosimetry by dose-additive method or comparative method using unirradiated same product in small-scale accident.