• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• Bulletin of the Korean Space Science Society
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• 2004.10b
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• pp.223-226
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• 2004

This paper presents a feasibility study of an advanced IO board design for the next generation of low-earth orbit satellites. Advanced IO board design includes sensor interface, NO, D/A, Digital Module, Serial Module etc, and allows to process increasing data rates between IO board and CPU board. The higher data rate involved in modem IO board additionally introduce issues such as noise, fault tolerance, command and data handling, limited pin count and power consumption problems. The experience in KOMPSAT-l and 2 program with this kind of problems resulted in using SMCS chip set, a high speed serial link technology based on IEEE-1355 (Space Wire Protocol) (ESA-ESTEC 2003, Parkes 1999), as a standard for next generation of satellite IO board design.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.10a
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• pp.276-280
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• 2001

In the development of Chip Mounter(C/M), much interests have risen regarding how to decrease the operation time of mounting the different chips on the printed circuit board(PCB). The existing method to determine the time sequence of teaching C/M was to follow the procedure which was made by the operater. IN this study, a new but effective algorithm has been developed and employed in SCM-130 Chip Mounter and its online programming had reduced the mounting time significantly and provided the basis for the future online CAD/CAM system.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.1
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.131.1-131
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• 2001

At the present time, multimedia chip, internet application, and network equipment is designed by using ARM core. Because it has a good debugging, software compiler and needed low power. We must process a data coding to send a multimedia data by real time. So need to connect software and hardware algorithm. In this research, We design interface for ARM9/AMBA based board using VHDL for these function implementation. The board is used the ARM company´s ARM940T for software function implementation and Xilinx company´s Virtex E2000 for hardware function algorithm. The various hardware algorithm (ME,ME,DCT) block for performance can be implemented on this system.

• Journal of IKEEE
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• v.21 no.3
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• pp.272-275
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• 2017

Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

• IEMEK Journal of Embedded Systems and Applications
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• v.17 no.6
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• pp.375-382
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• 2022

This paper proposes a multi-core cooperative computing structure considering the heterogeneous features of automotive embedded on-chip software. The automotive embedded software has the heterogeneous execution flow properties for various hardware drives. Software developed with a homogeneous execution flow without considering these properties will incur inefficient overhead due to core latency and load. The proposed method was evaluated on an target board on which a automotive MCU (micro-controller unit) with built-in multi-cores was mounted. We demonstrate an overhead reduction when software including common embedded system tasks, such as ADC sampling, DSP operations, and communication interfaces, are implemented in a heterogeneous execution flow. When we used the proposed method, embedded software was able to take advantage of idle states that occur between heterogeneous tasks to make efficient use of the resources on the board. As a result of the experiments, the power consumption of the board decreased by 42.11% compared to the baseline. Furthermore, the time required to process the same amount of sampling data was reduced by 27.09%. Experimental results validate the efficiency of the proposed multi-core cooperative heterogeneous embedded software execution technique.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.6
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• pp.488-492
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• 2013

Current limiting diode (CLD) was fabricated using junction field effect transistor (JFET) structured two small cells and eight large cells. Two small cells and eight large cells were connected in parallel and the obtained constant current was 110 mA. The application of CLD in each of the parallel circuits on chip on board (COB) type LED lighting source, could significantly reduce the current deviation within the parallel circuits. The applications of CLD on AC power small lighting source, battery power low voltage parallel lighting source and AC flat lighting source were investigated.