• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.3
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• pp.232-238
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• 2008

In this paper, a wideband power efficient 2.2 GHz - 4.9 GHz Medium Power Amplifier (MPA), has been designed and fabricated using $0.8{\mu}m$ SiGe BiCMOS process technology. Passive elements such as parallel-branch spiral inductor, metal-insulator-metal (MIM) capacitor and three types of resistors are all integrated in this process. This MPA is a two stage amplifier with all matching components and bias circuits integrated on-chip. A P1dB of 17.7 dBm has been measured with a power gain of 8.7 dB at 3.4 GHz with a total current consumption of 30 mA from a 3 V supply voltage at $25^{\circ}C$. The measured 3 dB bandwidth is 2.7 GHz and the maximum Power Added Efficiency (PAE) is 41 %, which are very good results for a fully integrated Medium PA. The fabricated circuit occupies a die area of $1.7mm{\times}0.8mm$.

• Transactions on Electrical and Electronic Materials
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• v.11 no.1
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• pp.24-28
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• 2010

A simulation study of a current-mode direct current (DC)-DC buck converter is presented in this paper. The converter, with a fully integrated power module, is implemented by using sense method metal-oxide-semiconductor field-effect transistor (MOSFET) and bipolar complementary metal-oxide-semiconductor (BiCMOS) technology. When the MOSFET is used in a current sensor, the sensed inductor current with an internal ramp signal can be used for feedback control. In addition, the BiCMOS technology is applied in the converter for an accurate current sensing and a low power consumption. The DC-DC converter is designed using the standard $0.35\;{\mu}m$ CMOS process. An off-chip LC filter is designed with an inductance of 1 mH and a capacitance of 12.5 nF. The simulation results show that the error between the sensing signal and the inductor current can be controlled to be within 3%. The characteristics of the error amplification and output ripple are much improved, as compared to converters using conventional CMOS circuits.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.9
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• pp.4126-4130
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• 2012

In this paper, we proposed planar spiral inductors based on AC coupling for high-frequency wireless signal transmission. Design and characteristics of various structures of the inductor were analyzed. Capacitance between the inductors can be reduced by positioning two thin-film inductors in parallel. So two structures were proposed. First structure is inter-diagonal structure. This structure was made not to overlap the wire part of the paralleled two inductors. Second structure is On-chip type structure that the two thin-film inductors were in parallel but located on diagonal line not to face each other. The resonance in this structure was reduced from twice to once by increasing horizontal distance between the two thin-film inductors, because the capacitance effect between the two thin-film inductors decreases when the distance between the two inductors increases.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• The Journal of the Acoustical Society of Korea
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• v.20 no.3
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• pp.83-90
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• 2001

Conventional SAW duplexer filters employ a 1/4 wavelength transmission line, which causes difficulty in fabrication of the strip line on the package. Its manufacturing process is also complicated, because it needs integrating process of the separate transmitting filter, receiving filter and isolation circuits. This paper concerns development of a new structure of the duplexer filter that has all the transmitting filter, the receiving filter and the isolation circuit as a one chip device. For composition of the duplexer, we design the component SAW ladder filters and the isolation network consisting of lumped inductor and capacitor elements. Performance of the whole duplexer is optimized by the nonlinear multivariable minimization of a proper target function, and the result is compared with that of commercial filters.

• Journal of electromagnetic engineering and science
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• v.9 no.1
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• pp.25-31
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• 2009

This paper describes CMOS VCO circuit design procedures and techniques for multi-band/multi-standard RF transceivers. The proposed techniques enable a 4 GHz CMOS VCO to satisfy all requirements for Quad-band GSMIEDGE and WCDMA standards by achieving a good trade-off among important specifications, phase noise, power consumption, modulation performance, and chip area efficiency. To meet the very stringent GSM T/Rx phase noise and wide frequency range specifications, the VCO utilizes bond-wire inductors with high-quality factor, an 8-bit coarse tune capbank for low VCO gain(30$\sim$50 MHz/V) and an on-chip $2^{nd}$ harmonic noise filter. The proposed VCO is implemented in $0.13{\mu}m$ CMOS technology. The measured tuning range is about 34 %(3.17 to 4.49 GHz). The VCO exhibits a phase noise of -123 dBc/Hz at 400 kHz offset and -145 dBc/Hz at 3 MHz offset from a 900 MHz carrier after LO chain. The calculated figure of merit(FOM) is -183.5 dBc/Hz at 3 MHz offset. This fully integrated VCO occupies $0.45{\times}0.9\;mm^2$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.6
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• pp.697-705
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• 2014

A single chip Programmable AC to DC Power Converter, consisting of wide band gap SiC MOSFET and SiC diodes, has been proposed which converts high frequency ac voltage to a conditioned dc output voltage at user defined given power level. The converter has high conversion efficiency because of negligible reverse recovery current in SiC diode and SiC MOSFET. High frequency operation reduces the need of bigger size inductor. Lead inductors are enough to maintain current continuity. A complete electrical analysis, die area estimation and thermal analysis of the converter has been presented. It has been found that settling time and peak overshoot voltage across the device has reduced significantly when SiC devices are used with respect to Si devices. Reduction in peak overshoot also increases the converter efficiency. The total package substrate dimension of the converter circuit is only $5mm{\times}5mm$. Thermal analysis performed in the paper shows that these devices would be very useful for use as miniaturized power converters for load currents of up to 5-7 amp, keeping the package thermal conductivity limitation in mind. The converter is ideal for voltage requirements for sub-5 V level power supplies for high temperatures and space electronics systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.4
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• pp.281-287
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• 1998

$BiNbO_4$ ceramics doped with 0.07wt% $V_2O_5$ and 0.03wt% CuO (BNC3V7) were sucessfully sintered at $900^{\circ}C$ through the firing process with Ag electrode. The BNC3V7 shows typically Dielectric constant of 44.3, Thermal Coefficient of resonance Frequency(TCF) of 2 ppm/$^{\circ} and $Qxf_o$ value of 22,000 GHz. The laminated chip Low Pass Filter (LPF) is very sensitive to chip processing parameters, was confirmed by the computer simulation as a function of Q(Quality factors), filter size, capacitor layer thickness, inductor pattern widths. The multilayer type LPF was fabricated by screen-printing with Ag electrode after tape casting and then compared with the simulated characteristics. The results show that characterization of band pass width was similar to that of designed ones.

• ETRI Journal
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• v.46 no.3
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• pp.550-563
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• 2024

A novel inductance simulation circuit employing only two dual-output voltage-differencing buffered amplifiers (DO-VDBAs) and a single capacitance (grounded) is proposed in this paper. The reported configuration is a purely resistor-less realization that provides electronically controllable realized inductance through biasing quantities of DO-VDBAs and does not rely on any constraints related to matched values of parameters. This structure exhibits excellent behavior under the influence of tracking errors in DO-VDBAs and does not exhibit instability at high frequencies. The simple and compact metal-oxide semiconductor (MOS) implementation of the DO-VDBAs (eight MOS per DO-VDBA) and adoption of grounded capacitance make the proposed circuit suitable for on-chip realization from the perspective of chip area consumption. The function of the pure grounded inductance is validated through high pass/bandpass filtering applications. To test the proposed design, simulations were performed in the PSPICE environment. Experimental validation was also conducted using the integrated circuit CA3080 and operational amplifier LF-356.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.5
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• pp.397-400
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• 2018

This paper presents a miniaturized 65 nm CMOS 30~46 GHz wideband amplifier. To minimize the chip area, coupled inductors are used in the matching networks. The measurement shows that the fabricated amplifier exhibits 9.3 dB of peak gain, 16 GHz of 3 dB bandwidth, and 42 % fractional bandwidth. The measured input and output return losses were more than 10 dB at 35.8~46.0 GHz and 28.6~37.8 GHz, respectively. The chip consumes 42 mW at 1.2 V. The measured group delay variation is 19.1 ps within the 3 dB bandwidth and the chip size excluding the pads is $0.09mm^2$.