• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2007년도 학술대회
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• pp.104-110
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• 2007

FTTH상용화, IEEE802.11n 무선랜 기술의 상용화 등과 같은 초고속 전송기술의 발전에 따라 홈네트워킹 환경 또한 급격하게 변화하고 있다. 100Mbps를 초과하는 많은 홈네트워킹 기술들의 개발로 인해 홈게이트웨이에 보다 넓은 대역의 LAN 인터페이스를 요구하게 되었고, xDSL이나 케이블모뎀 기반의 가입자망과의 대역폭 차이는 고성능의 QoS 기능을 요구하게 되었다. 이러한 통신환경을 토대로 홈게이트웨이의 기능에 대한 요구사항을 분석하고 홈게이트웨이용 스위칭 칩의 개발규격을 도출하였다. 그리고 새로운 네트워크 기반의 비즈니스 모델을 개발하고자 하는 통신사업자의 요구사항과 QoS나 IPv6등의 다양한 네트워크 요구사항을 등을 유연하게 수용할 수 있으며, 칩의 기능과 성능을 수정하 또는 추가할 수 있는 네트워크 프로세서 기반의 기가빗 스위치 칩을 개발하였다. 개발 칩은 패킷 프로세서로 Layer 4까지 의 패킷헤드를 처리하고, 2기가빗이더넷 + 6패스트이더넷 포트를 갖도록 설계하였으며, FPGA를 이용하여 스위칭 칩의 기본적인 전송기능과 성능, Flow별 패킷 분류 및 패킷 필터링, 스케쥴링 기능 등의 시험을 통하여 설계한 칩의 기능과 성능을 확인하였다.

• 한국산학기술학회논문지
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• 제4권3호
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• pp.177-182
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• 2003

Flash memory는 device 특성상 peripheral circuit을 구성하는 transistor의 종류가 다양하고, 이에 따른 각 transistor의 동작 전압 영역이 넓다. 이에 따라 설계 초기의 전기적 특성 사양 결정을 위해서는, 실리콘상에서 소자의 scale down에 따른 전기적 특성을 선 검증하는 과정이 필수적이었으며, 이로 인해 설계 및 소자 개발의 기간을 단축하기 어려웠다. 본 연구에서는 TCAD tool을 사용하여 실리콘상에서의 제작 공정을 거치지 않고, 효과적으로 model parameter를 생성할 수 있도록 하는 방법을 제안하여 전기적 특성 사양 결정과 설계 단계의 시간 지연을 감소할 수 있도록 한다. 또한 성공적 TCAD tool적용을 위해 필요한 process/device simulator의 calibration methodology와 이를 flash 메모리 소자에 대해 적용 검증한 결과를 분석한다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.18.2-18.2
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• 2011

생활수준이 향상되고, 환경오염이 가속되면서 환경에 대한 관심이 더욱 증대되고 있다. 수질센서의 경우, 그 측정 항목이 매우 다양하고, 높은 정밀도를 요하고 있을 뿐만 아니라 지속적인 실시간 모니터링을 요구하고 있어, 기술적으로 해결해야 할 문제가 많이 남아 있다. 또한, 현재 약 15% 정도로 매우 낮은 국산화율을 보이고 있어, 대부분의 주요 센서들이 수입에 의존하고 있는 실정이다. 수질을 측정하기 위한 센서는 크게 두 가지 형태로 나누어 질 수 있는데, 하나는 flow injection analysis (FIA) 방식이며, 다른 하나는 Probe 방식의 센서이다. 본 발표에서는 수질 센서에 대한 최근 국내 기술 동향과, 수질 모니터링을 위한 Lab-on-a-chip 형 암모니아 분석 칩, Probe 형 중금속 센서 연구 개발 결과를 요약하고자 한다. 암모니아 분석 칩은 마이크로 유체 소자 내에서 Berthelot reaction을 유도하고, 흡광법에 의하여 물 속에 존재하는 암모니아를 간접적으로 측정하는 방법이다. 또한, 중금속 센서로 일반적인 working electrode 소재로 사용되는 독성이 있는 Hg 보다 친환경적인 개발된 bismuth-modified carbon nanotube와 같은 Bi계 복합소재를 적용하여 물 속에 존재하는 저 농도의 Pb, Cd, Zn을 측정 분석할 수 있었다. 본 연구를 통해 개발된 분석칩과 중금속 센서를 이용하여 하천에서 샘플링된 물에서의 암모니아 및 중금속 농도를 각각 분석할 수 있었다.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• 한국전기전자재료학회논문지
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• 제26권2호
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• pp.158-163
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• 2013

In this paper, thermal analysis of heatsink for 30 W class Chip-on-Board (COB) LED light source is performed by using SolidWorks Flow Simulation package. In order to increase the convection heat transfer, number of fin and shape of the heatsink is optimized. Furthermore, a copper spread is applied between the COB LED light source and the heatsink to mitigate the heat concentration on the heatsink. With the copper spread, the junction temperature between the COB LED light source and the heatsink is $50.9^{\circ}C$, which is $5.4^{\circ}C$ lower than the heatsink without the copper spread. Due to the improvement of the junction temperature, the light output is improved by 5.8% when the LED light source is stabilized. The temperature difference between the simulation and measured result of the heatsink with the copper spread is within $2^{\circ}C$, which verifies the validity of the thermal design method using a simulation package.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.593-598
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• 2003

Ceramic plates containing many micro-holes are used in diverse applications such as MCP (Microchannel Plate). catalytic converters, filters, electrical insulators in integrated circuits, and so on. One of the efficient methods for machining many holes in ceramic plates is wet drilling of ceramic green bodies followed by sintering them. Since the strength of ceramic green bodies is much lower than the strength of sintered ceramic plate, ceramic green bodies can be drilled with high feed rate. The axial force during micro-drilling of ceramic green bodies increases rapidly at high feed rate, which induces the crack in workpiece. Therefore, the tool lift of micro-drill with respect to feed rate may be determined by the predicting increase of axial force. In this work, the axial force during micro-drilling was calculated using the chip flow model on the micro-drill tip. from which the tool life of diamond abrasive micro-drill during micro-drilling of ceramic green bodies was calculated.

• 한국생산제조학회지
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• 제24권5호
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• pp.508-513
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• 2015

In this study, the effect of the helix angle and rake angle of a flat end-mill in the milling of titanium alloy was investigated. Tool shape parameters such as helix angle and rake angle affect the cutting force, cutting zone temperature, vibration, and chip flow mechanism, which in turn determine tool life, surface integrity, and dimensional accuracy of the milling process. To investigate the effect of the helix and rake angles, a certain range of parameters was selected, and three-dimensional tool models were generated for finite element analysis (FEA) for each case. The cutting force and pressure on the tool flank face and rake face were investigated by FEA. Further, several tool models were proposed for machining tests. The cutting force characteristics were investigated by the machining tests.

• 대한기계학회논문집A
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• 제29권6호
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• pp.904-912
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• 2005

The flow in a microchannel is usually characterized as a low Reynolds number (Re) so that good mixing is quite difficult to be achieved. In this regard, we developed a novel chaotic micromixer, named Barrier Embedded Kenics Micromixer (BEKM). In the BEKM, the higher level of chaotic mixing can be achieved by combining two general chaotic mixing mechanisms: (i) splitting/reorientation by helical elements inside the microchannel and (ii) stretching/folding via periodically located barriers on the channel wall. The fully three-dimensional geometry of BEKM was realized by a micro-stereolithography technology, in this study, along with a Kenics micromixer and a circular T-pipe. Mixing performances of three micromixers were experimentally characterized in terms of an average mixing color intensity of phenolphthalein. Experimental results show that BEKM has better mixing performance than other two micromixers. Chaotic mixing mechanism, proposed in this study, could be integrated as a mixing component with Micro-Total-Analysis-System, Lab-on-a-chip and so on.

• 한국기계가공학회지
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• 제3권3호
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• pp.24-31
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• 2004

A successful on-line monitoring system for conventional machining operations has the potential to reduce cost, guarantee consistency of product quality, improve productivity and provide a safer environment for the operator. In fine-shape machining, typical signs of tool problems such as vibration, noise, chip flow characteristics and visual signs are almost unnoticeable without the use of special equipment. These characteristics increase the importance of automatic monitoring in fine-shape machining, however, sensing and interpretation of signals ar more complex. In addition, the shafts of the mini-tools break before the typical extensive cutting edge of the tool gets damaged. In this study, the existence of a relationship between the characteristics of the cutting force and tool usage was investigated, and tool breakage detection algorithm by LabVIEW was developed and the following results are obtained. It was possible to use a relative error compare which mainly used in established experiment and investigated tool breakage detection algorithm in time domain which can detect AE and cutting force signals more effective and accurate.

• 한국소음진동공학회논문집
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• 제19권3호
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• pp.251-260
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• 2009

In this paper, we studied on an attenuation effect of automobile exhaust noise according to the direction of canceling speaker in ANC system. Automobile exhaust noise was recorded at 800 rpm, 3500 rpm and 5000 rpm of a diesel engine. Directions of canceling speaker can be set to $30^{\circ}$, $90^{\circ}$ and $150^{\circ}$ against the primary noise flow by acrylic ducts to be made for the experimentation. DSP board with TMS320C6416 chip of Texas Instrument Co. used to control the ANC system. The algorithm of this ANC system applied the Filtered-x-LMS algorithm that is modified to compensate for a property of DSP input signal and the secondary-path effect. As an experiment result, the direction of canceling speaker was proved to influence the reduction effect of noise. The $150^{\circ}$ duct in the attenuation effect of noise showed a better result than the $90^{\circ}$ or $30^{\circ}$ duct.