• 한국전기전자재료학회논문지
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• 제28권12호
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• pp.792-796
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• 2015

With high integration of electronic components, power inductors are also miniaturized. Recently, thick film processes for small size power inductors were developed and commercialized. However, the thick film process to prepare soft magnetic green sheets was not reported enough. In this study, we used Fe-Si magnetic and CIP (carbonyl iron powders) as starting materials to lead to a bimodal particle size distribution in the sheet. We proposed a newly developed 'Modified slurry preparation process' to get well dispersed condition even at high solid contents. Using the new process, it was possible to prepare a well dispersed slurry over 70 vol% of solid. BYK-103 was better than BYK-111 as dispersant in this slurry and the optimum amount was 0.6 wt%. The optimized slurry was formed into a sheet by tape casting process and then the sheet was laminated. We conformed that small size powder, large size powder, and epoxy resin were well dispersed in the green sheet.

• 한국수소및신에너지학회논문집
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• 제21권5호
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• pp.375-382
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• 2010

A layered perovskite photocatalysts, $SrBi_2Nb_2O_9$ (SBN), was synthesized by the conventional solid-state reaction method and characterized by X-ray diffraction (XRD) and UV-visble spectrophotometry. The results showed that the structure of $SrBi_2Nb_2O_9$ is orthorhombic. Diffuse reflectance spectra for calcined and attrition-milled SBN showed the main absorption edges were less 400 nm, that is ultraviolet region. SBN under micron-sized powder was deposited on the $Al_2O_3$ by room temperature powder spray in vacuum process, so called aerosol deposition (AD), and nano-grained $SrBi_2Nb_2O_9$ photocatalytic thick film was fabricated. AD-deposited SBN thick films were characterized by XRD, scanning electron microscopy (SEM) and UV-visable spectrophotometry, Moreover, it was found that several nano-sized SBN film by AD process can improve the photocatalytic activity under visable reflectance.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• 한국세라믹학회지
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• 제36권5호
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• pp.564-569
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• 1999

• 한국전기전자재료학회논문지
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• 제25권12호
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• pp.955-960
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• 2012

We fabricated piezoelectric unimorph cantilever generators (UCG) using $Pb(Zr_{0.54}Ti_{0.46})O_3$ + 0.2 wt% $Cr_2O_3$ + 1.0 wt% $Nb_2O_5$ (PZCN) piezoelectric thick films, which were produced by a tape casting method. The PZCN thick films were tailored with same width and thickness but different lengths from 7.7 to 57.7 mm in order to evaluate optimized UCG for energy harvesting device applications. When the length of PZCN film was increased, the resonance frequency of UCG was slightly increased from 7 Hz to 8 Hz, which could be due to enlarged area of the highly stiff piezo-ceramic film. However, the output power was proportionally increased with the length of PZCT film and it reached 4.68 mW (1.221 $mW/cm^3$) when the film's length was 57.7 mm under 25 g of tip mass at 8 Hz, which is sufficient for micro-scale device applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.272-272
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• 2010

We have fabricated alumina thick films by inkjet printing technology. Two different types of ink system were formulated in order to understand their evaporation behaviors and their evaporation effects on the powder distribution on, the surface during inkjet-printed alumina thick films. Single solvent system was formulated with N,N-dimethylformamide(DMF), which led to coffee ring effects which non-uniformly distributed alumina particles on the substrate during the ink evaporation. However, Co-solvent system which consists of both Water and DMF produced relatively uniform distribution of the particles on the substrate. We believe that these two different distributions of alumina particles are attributed to the ink fluid flow directions in the ink droplets ejected from the different ceramic ink system. We have modulated inkjet parameters such as dot-to-dot distance, line-to-line distance, jetting velocity and jetting drop size in order to find out the optimum condition for the printing of alumina thick films from two different ink systems. The surface roughness, microstructures and dielectric properties of these inkjet-printed alumina thick films were investigated.

• 한국세라믹학회지
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• 제52권6호
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• pp.435-440
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• 2015

It is a challenge from an industrial point of view to fabricate silicon nitride substrates with high thermal conductivity and good mechanical properties for power devices from high-purity Si scrap powder by means of thick film processes such as tape casting. We characterize the residual carbon and oxygen content after the binder burnout followed by nitridation as a function of the temperature in the temperature range of $300^{\circ}C-700^{\circ}C$ and the atmosphere in a green tape sample which consists of high-purity Si powder and polymer binders such as polyvinyl butyral and dioctyl phthalate. The optimum condition of binder burnout is suggested in terms of the binder removal temperature and atmosphere. If considering nitridation, the burnout of the organic binder in air compared to that in a nitrogen atmosphere could offer an advantage when fabricating reaction-bonded $Si_3N_4$ substrates for power devices to enable low carbon and oxygen contents in green tape samples.

• 한국세라믹학회지
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• 제41권4호
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• pp.313-322
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• 2004

후막 광식각 기술은 스크린 인쇄 등의 일반적인 후막공정에 노광 및 현상 등의 리소그라피 공정을 접목시킨 새로운 기술이다. 본 연구에서는 후막 광식각 기술을 이용하여 미세라인을 형성할 수 있는 저온동시소성용 Ag 페이스트를 개발하였다. 페이스트를 구성하는 Ag분말과 폴리머, 모노머, 광개시제 등의 양을 조절하여 미세라인을 형성할 수 있는 최적 조성을 연구하였으며. 또한 노광량과 같은 공정변수가 미세라인 형성에 미치는 영향을 연구하였다. 실험결과 폴리머/모노머비, Ag 분말 중량비, 광개시제의 양 등이 미세라인의 해상도에 영향을 미치는 주요 인자임을 확인할 수 있었다. 개발된 감광성 Ag 페이스트를 저온동시소성용 그린 시트에 전면 인쇄한 후 건조, 노광, 현상, 적층, 소성 과정을 통하여, 소성 후 20$\mu\textrm{m}$ 이하의 선폭을 가지는 후막 미세라인을 형성할 수 있었다.

• 한국세라믹학회지
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• 제38권8호
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• pp.724-731
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• 2001

스크린 인쇄법에 의해 Si 기판에 PZT 후막의 제조에 있어서 주요 문제점은 낮은 소결밀도 및 PZT 후막과 Si 기판과의 반응현상이다. 이러한 현상을 억제하기 위해 본 연구에서는 스크린 인쇄법 및 PZT sol-gel 처리법의 혼합된 방법을 채택하여 Pt/TiO$_2$/YSZ/SiO$_2$/Si(100) 기판에 Zr/Ti 비가 52/48인 PZT 후막을 제조하였으며, 소결온도에 따른 잔류분극(P$_{r}$), 유전상수($\varepsilon$$_{r}$) 및 압전상수(d$_{33}$)를 측정하였다. 인쇄된 PZT 후막에 졸 처리함으로써 단순히 인쇄된 후막에 비해 전기적 특성이 증진된 결과를 얻었다.다.

• 한국세라믹학회지
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• 제33권4호
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• pp.379-384
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• 1996

The H2S sensing mechanism of CuO-SnO2 was confirmed by analyzing the electrical-resistance variation with temperature under an H2S atmosphere. While the resistance of CuO-SnO2 thick film at N2+H2S atmosphere was almost invariant with change in temperature it increased with increasing temperature for air +H2S atmos-phere. This behavior was analyzed using an equation derived from a basic assumption based on the H2S sensing mechanism proposed before. the experimental results are sufficiently explained with the equation derived which showed that the H2S sensing mechanism was reasonable. The equation also gave a detailed analysis and physical meaning to the behavior of the resistance variation with change in H2S concentration.