• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.204-205
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• 2011

In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is a most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. For best performance of thin film silicon solar cell, the dopant profiles at p/i and i/n interfaces need to be as sharp as possible. The sharpness of dopant profiles can easily achieved when using multi-chamber PECVD equipment, in which each layer is deposited in separate chamber. However, in a single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of a single-chamber PECVD system in spite of the advantage of lower initial investment cost for the equipment. In order to resolve the cross-contamination problem in single-chamber PECVD systems, flushing method of the chamber with NH3 gas or water vapor after doped layer deposition process has been used. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. A single-chamber VHF-PECVD system was used for superstrate type p-i-n a-Si:H solar cell manufacturing on Asahi-type U FTO glass. A 80 MHz and 20 watts of pulsed RF power was applied to the parallel plate RF cathode at the frequency of 10 kHz and 80% duty ratio. A mixture gas of Ar, H2 and SiH4 was used for i-layer deposition and the deposition pressure was 0.4 Torr. For p and n layer deposition, B2H6 and PH3 was used as doping gas, respectively. The deposition temperature was $250^{\circ}C$ and the total p-i-n layer thickness was about $3500{\AA}$. In order to remove the deposited B inside of the vacuum chamber during p-layer deposition, a high pulsed RF power of about 80 W was applied right after p-layer deposition without SiH4 gas, which is followed by i-layer and n-layer deposition. Finally, Ag was deposited as top electrode. The best initial solar cell efficiency of 9.5 % for test cell area of 0.2 $cm^2$ could be achieved by applying the in-situ plasma cleaning method. The dependence on RF power and treatment time was investigated along with the SIMS analysis of the p-i interface for boron profiles.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.53-59
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• 2005

In this study, the supercritical electroplating was investigated by forming macroemulsion of electroplating solution using surfactant in supercritical $CO_2$. The fluorinated analogous AOT surfactant, sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate which has both '$CO_2$ philic' chains and 'hydrophilic' head group was used as a surfactant, and Ni plate and Cu plate were used as the anode and the cathode, respectively. Electroplating was carried out in the conventional method and the supercritical macroemulsion and both results were compared. The supercritical electroplating was carried out in various concentration of surfactant such as 2, 4, 7 wt%, the volume ratio of Ni-plating solution to $CO_2$ was varied in the range of 10-70 vol%, and propane was used as a supercritical fluid instead of $CO_2$. According to the experimental results, the plated surface of Ni on Cu plate performed in supercritical macroemulsion was better than that, in conventional state. In the image of Ni surface plated on Cu plate in supercritical state, there were fewer pin-holes and pits comparing with that in the conventional process. The current and conductivity was increased as the volume ratio of Ni-plating solution to $CO_2$ was increased and the current and the amount of Ni plated on Cu plate were decreased as the concentration of surfactant become higher. In addition, in case of the continuous phase, using $CO_2$ was more effective than using $CO_2$.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.13 no.1
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• pp.1-8
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• 1999

In recent years, concern has been raised about the technique of controlling electrical breakdown by using laser in many fields. Especially, laser has attracted much attention in the Electro-Discharge Machining(EDM) because of its many rrents. 1berefore, this research has been perfonred to obtain fundarrental data for the discharge guide technology by a pulsed Nd:YAG laser which can be awJied to discharge processing machining. 1be experilnnts of laser-guided de discharge have been carried out at low air pressure ranging from 0.2 to 20 torr. The minimum laser-guided de discharge voltage $V_{G.min}$ at the given pressures P and distances d between an anode and a cathode was rreasured It is found that $V_{G.min}$ is much lower than the natural discharge voltage $V_{ND}$, and the values of VGrrin and $V_{ND}$ as a function of P.d has a similar tendency. The laser output energy $E_{out}$ decreases with input pulse duration $t_p$ increasing, and the rrore the value of $t_p$ increases, the higher that of V$V_{G.min}$ is obtained because the number of photons N decreases with $t_p$ increasing. In addition, the laser-guided de discharge range and the discharge guide characteristics as laser outpIt $E_{out}$ was investigated.igated.

• Journal of the Korean Electrochemical Society
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• v.10 no.1
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• pp.25-30
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• 2007

Proton exchange membrane fuel cell(PEMFC) performance could be affected by various factors such as cell temperature, total pressure, partial pressure of reactants and relative humidity. Hydrogen ion is combined with water to form hydronium ion [$H_3O^+$] and pass through membrane resulting electricity generation. Cooling system is needed to remove heat and other uses on large scale fuel cell. In case that collant conductivity is increased, fuel cell performance could be decreased because produced electricity could be leaked through coolant. In this study, triple distilled water(TDW) and antifreeze solution containing ethylene glycol was used to observe resistance change. Resistance of TDW was taken 28 days to reach preset value, and effect on fuel cell operation was not observed. Resistance of antifreeze solution was not reached to preset value up to 48 days, but performance failure occurred presumably caused by bipolar plate junction resulting stoppage resistance experiment. Generally PEMFC humidification is performed near-saturated operating conditions at various temperatures and pressures, but non-humidifying condition could be applied in small scale fuel cell to improve efficiency and reduce system cost. However, it was difficult to operate large scale fuel cell without humidifying, especially higher than $50{\sim}60^{\circ}C$. In case of small flux such as 0.78 L/min, temperature difference between inlet and outlet was occurred larger than other cases resulting performance decrease. Non-humidifying performance experiments were done at various cell temperature. When both of anode and cathode humidification were removed, cell performance was strongly depended on cell operating temperature.

• Journal of the Korean Electrochemical Society
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• v.9 no.3
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• pp.124-131
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• 2006

For commercialization of molten carbonate fuel cell (MCFC), it has some problems to be overcome such as decrease of porosity and thickness of the anode under the operating condition (at $650^{\circ}C$ and working pressure of more than 2 $kg_f/cm^2$). Recently, Ni-Al alloy anode has been proposed to replace the conventional Ni-Cr anode as an alternative material to resist a creep and inhibit the sintering. The objective of this research is to sinter the green sheet of Ni-Al alloy anode during single cell pre-treatment process, which has several advantages like cost down and simplification of manufacturing process. However, the Ni-Al alloy anode prepared with a conventional pre-treatment process showed the phase separation of Ni-Al alloy and formation of micropore(${\leqq}0.4{\mu}m$), resulting in low creep resistance and high electrolyte re-distribution. In order to prevent the Ni-Al alloy anode from phase-separating, nitrogen gas was used in the process of pre-treatment. Introducing the nitrogen, the phase separation from Ni-Al alloy into nickel and alumina was minimized and increased creep resistance. However, there was some micropore formation on the surface of Ni-Al alloy anode during the cell operation due to creation of lithium aluminate. Addition of more amount of electrolyte into a cell, especially at cathode, made the cell performance stable for 2,000 hrs. Consequently, it was possible to make the Ni-Al alloy anode with good creep resistance by the modified in-situ sintering technique.