• Journal of Power System Engineering
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• v.17 no.6
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• pp.79-87
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• 2013

The improvement of cooling efficiency for the cabinet of automatic controller is the most efficient method of it's application. Therefore, this study has been analyzed and investigated the improvement of cooling efficiency and reduction of energy for the cabinet of automatic controller, respectively. So this study was conducted to enhancement of cooling efficiency for the cabinet of automatic controller by making a structure which produces difference of air pressures in the entrance tube of external air. And the structure has capacity of the pyrogen source (PTC elements) to make temperature range from $145^{\circ}C$ to $155^{\circ}C$. Consequently, temperatures of the upper, the lower in the interior of the cabinet of automatic controller and the exhaust part were revealed $28.57^{\circ}C$, $23.38^{\circ}C$and $36.14^{\circ}C$(average temperature of the exhaust part in case of existing method : $45^{\circ}C$) in target test of this study, respectively. It was found that the cabinet of the automatic controller has better cooling ability than the cabinet of automatic controller by using an existing method.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1385-1390
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• 2009

In this study the purpose is development of passive cooling system for telecommunication cabinet used by latent heat material. This cooling system is not required for electronic power. It was tested for the performance of the telecommunication combined latent heat material with $48^{\circ}C$ of phase changed temperature and heat pipe. At $45^{\circ}C$ of outside temperature, when heater power was 1,000 W and 1,500 W, the inside temperature of the cabinet was $55^{\circ}C$ and $62^{\circ}C$. This system was showed better performance than the other systems.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.7
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• pp.2356-2366
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• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.21 no.2
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• pp.87-93
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• 2009

Slim telecommunication cabinet cooler, equipped with parallel flow heat exchangers and operating with R-22, is developed. The performance is compared with imported one, equipped with fin-tube heat exchangers and operating with R-134a. Test results show that the newly-developed cooler increases the cooling capacity by 6% and EER by 33%. The refrigerant charge for the developed cooler is 500g compared with 1250g for the imported one. The adoption of parallel flow heat exchanger appears to have reduced the refrigerant charge. In addition, it is shown that the reduced air flow rates through parallel heat exchangers as compared with those through fin-tube heat exchangers are beneficial to the reduction of the equipment noise.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.8 no.2
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• pp.230-239
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• 1996

A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.29 no.6
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• pp.279-288
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• 2017

Heat generation rate in a telecommunication cabinet increases due to the continued usage of mobile devices. Insufficient removal of heat intensifies the cabinet temperature, resulting in the malfunction of electronic devices. In this study, we assessed both aluminum and plastic heat exchangers used for cooling of the telecommunication cabinet, and compared the results against theoretical predictions. The aluminum heat exchanger was composed of counter flow parallel channels of 4.5 mm pitch, and the plastic heat exchangers were composed of cross flow triangular channels of 2.0 mm pitch. Samples were made by installing two plastic heat exchangers in both series and parallel. Results showed that the heat transfer rate was highest for the series cross flow heat exchanger, and was least for the aluminum heat exchanger. The temperature efficiency of the series cross flow heat exchanger was 59% greater than that of the aluminum heat exchanger, and was 4.3% greater than that of the parallel cross flow heat exchanger. In contrast, the pressure drop of the parallel cross flow heat exchanger was significantly lower than other samples. The heat exchange efficiency was also the largest for the parallel cross flow heat exchanger. The theoretical analysis predicted the temperature efficiency to be within 3.3%, and the pressure drop within 6.1%.

• Korean Journal of Computational Design and Engineering
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• v.4 no.4
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• pp.318-326
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• 1999

Recently, electronic systems including computers have been rapidly shrinking in size while at the same time the complexity and the capability of these systems continue to grow/sup [1]/. Thus, system volumes have decreased as system power has increased, resulting in dramatic increases in system heat density. The high temperature of the computer system is considered as the major reason for low performance and shortening life of the product. It is necessary to solve this problem due to the heat density increased and to develop the design skill of the computer cabinet according to miniaturization. M4500 desk-top computer was selected for analyzing the thermal management inside cabinet. The cabinet volume, the configuration of the heating devices, the size and location of air ventilation, and the fan selection have been investigated as the important parameters to find out an optimal cabinet design. The objectives of this project were to analyze which design parameters would affect cooling performance by thermal strategy, to design an optimal model, and to measure the temperatures of the main parts to confirm the effect of the thermal design. The temperatures of each part of the optimal model were compared with those of the existing model. As a result. the volume of this miniaturized model was about 16% smaller than that of M4500 without any change in operating performance.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.4
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• pp.771-779
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• 1989

Numerical analysis by SIMPLE algorithm has been performed to predict the characteristics of flow and heat transfer in channels between the printed circuit boards of an electronic cabinet. It is assumed that the electronic parts release uniform heat flux per unit axial length to the cooling air. The air flow between channels is assumed fully developed laminar, incompressible, and mixed convective. In this study, the electronic parts are mounted on both sides of the prinked circuit boards by two kinds of configuration such as the zig-zag and the symmetric one. The Rayleigh numbers ranging from 0 to 10$^{6}$ are considered to predict the characteristics of the main flow and the secondary flow occurred by natural convection, the temperature distribution in channel, the heat transfer rate from heated electronic parts and the increase of friction factor by natural convection. As the results of numerical calculation, several conclusions are drawn as follows. The influence of natural convection on the flow characteristics appears strong when the Rayleigh number is above 10$^{4}$. The main axial flow rate decreases by a half or more at the Rayleigh number of 10$^{6}$ . Although the friction factor increases as Rayleigh number increases, the increasing rate of heat transfer is higher than that of the friction factor. The cooling efficiency of the zig-zig-configuration is superior to that of the symmetric configuration at same Rayleigh number.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.1
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• pp.702-708
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• 2017

The heat generation rate in a telecommunications cabinet keeps increasing due to the increased usage of mobile devices. Insufficient removal of the heat increases the cabinet temperature, which results in the malfunction of the electronic devices. In this study, tests were conducted on aluminum and plastic heat exchangers for cooling a telecommunications cabinet, and the results were compared with theoretical predictions. The aluminum heat exchanger comprised counter flow parallel channels with 4.5-mm pitch, and the plastic heat exchangers comprised cross or cross-counter flow triangular channels with 2.0-mm pitch. The volume of the cross flow heat exchanger was the same as that of the aluminum heat exchanger, and the volume of the cross-counter heat exchanger was 33% larger than that of the aluminum heat exchanger. The results show that the heat transfer rate is the highest for the cross-counter heat exchanger and lowest for the aluminum one. The temperature efficiency of the cross-counter heat exchanger was 56% higher than that of the aluminum one and 20% higher than that of the cross flow heat exchanger. The pressure drop of the cross-counter heat exchanger was approximately the same as that of the aluminum one. The heat exchange efficiency was the highest for the cross-counter heat exchanger and lowest for the cross flow heat exchanger. The theoretical analysis somewhat overestimated or underestimated the data.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.3524-3528
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• 2007

In this study, the Peltier effect was applied to eliminate moistures in the air enclosed by a cabinet. We have developed the new electronic dehumidifier which has a new function of automatically evaporating the condensed water inner cabinet into the outside air. To obtain this function, the processes of dehumidification is that it condensed the moistures on the cold side heat sink and drained it into the hot side heat sink by the both gravitational and capillary forces and the droplets on the hot side heat sink surface was evaporated into the air outside the cabinet by the heat conducted through the hot side heat sink surface and the forced heat convection through the fan for cooling hot side heat sink. Compared to existing electronic dehumidifiers, this manufactured one showed a good performance that the electric power consumption for the same dehumidifying quantity was reduced by 50% compared with that of existing ones.