• Journal of the Korean Ceramic Society
• /
• v.40 no.7
• /
• pp.657-661
• /
• 2003

The elastic moduli or fracture strengths of multi-layered film (SiO$_2$/po1y-Si/SiN/SiO$_2$, 2.77 $\mu\textrm{m}$ thick), CVD diamond film (1.6 $\mu\textrm{m}$ thick), SiO$_2$ film (1.0 $\mu\textrm{m}$ thick) and SiN film (0.43 $\mu\textrm{m}$ thick) made for the membrane of ink-jet printer head were measured with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam (${\mu}$-CLB). And the elastic moduli of ${\mu}$-CLB of SiO$_2$ film and SiN film were compared with the value of each film on silicon substrate determined with nanoindentation method. The results showed that the modulus and strength of multi-layered film decrease from 68.08 ㎬ and 2.495 ㎬ to 56.53 ㎬ and 1.834 ㎬, respectively as the width of CLB increases from 18.5 $\mu\textrm{m}$ to 58.5 $\mu\textrm{m}$. And the elastic moduli of SiO$_2$ and SiN films measured with ${\mu}$-CLB bending method are 68.16 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with nanoindentation method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with ${\mu}$-CLB bending technique, moduli can be measured to within 2%.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.376-376
• /
• 2012

Semiconductor nanowires (NWs) are future building block for nano-scale devices. Especially, Ge NWs are fascinated material due to the high electrical conductivity with high carrier mobility. It is strong candidate material for post-CMOS technology. However, thermal stability of Ge NWs are poor than conventional semiconductor material such as Si. Especially, when it reduced size as small as nano-scale it will be melted around CMOS process temperature due to the melting point depression. Recently, Graphene have been intensively interested since it has high carrier mobility with single atomic thickness. In addition, it is chemically very stable due to the $sp^2$ hybridization. Graphene films shows good protecting layer for oxidation resistance and corrosion resistance of metal surface using its chemical properties. Recently, we successfully demonstrated CVD growth of monolayer graphene using Ge catalyst. Using our growth method, we synthesized Ge/graphene core/shell (Ge@G) NW and conducted it for highly thermal stability required devices. We confirm the existence of graphene shell and morphology of NWs using SEM, TEM and Raman spectra. SEM and TEM images clearly show very thin graphene shell. We annealed NWs in vacuum at high temperature. Our results indicated that surface melting phenomena of Ge NWs due to the high surface energy from curvature of NWs start around $550^{\circ}C$ which is $270^{\circ}C$ lower than bulk melting point. When we increases annealing temperature, tip of Ge NWs start to make sphere shape in order to reduce its surface energy. On the contrary, Ge@G NWs prevent surface melting of Ge NWs and no Ge spheres generated. Furthermore, we fabricated filed emission devices using pure Ge NWs and Ge@G NWs. Compare with pure Ge NWs, graphene protected Ge NWs show enhancement of reliability. This growth approach serves a thermal stability enhancement of semiconductor NWs.

• Current Photovoltaic Research
• /
• v.2 no.1
• /
• pp.1-7
• /
• 2014

We developed a method of growing thin Si film at $600^{\circ}C$ by hot wire CVD using a very thin large-grained poly-Si seed layer for thin-film Si solar cells. The seed layer was prepared by crystallizing an amorphous Si film by vapor-induced crystallization using $AlCl_3$ vapor. The average grain size of the p-type epitaxial Si layer was about $20{\mu}m$ and crystallographic defects in the epitaxial layer were mainly low-angle grain boundaries and coincident-site lattice boundaries, which are special boundaries with less electrical activity. Moreover, with a decreasing in-situ boron doping time, the mis-orientation angle between grain boundaries and in-grain defects in epitaxial Si decreased. Due to fewer defects, the epitaxial Si film was high quality evidenced from Raman and TEM analysis. The highest mobility of $360cm^2/V{\cdot}s$ was achieved by decreasing the in-situ boron doping time. The performance of our preliminary thin-film solar cells with a single-side HIT structure and $CoSi_2$ back contact was poor. However, the result showed that the epitaxial Si film has considerable potential for improved performance with a reduced boron doping concentration.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.378.2-378.2
• /
• 2016

Biosensors currently suffer from severe non-specific adsorption of proteins, which causes false positive errors in detection through overestimation of the affinity value. Overcoming this technical issue motivates our research. Polyethylene glycol (PEG) is well known for its ability to reduce the adsorption of biomolecules; hence, it is widely used in various areas of medicine and other biological fields. Likewise, amine functionalized surfaces are widely used for biochemical analysis, drug delivery, medical diagnostics and high throughput screening such as biochips. As a result, many coating techniques have been introduced, one of which is plasma polymerization - a powerful coating method due to its uniformity, homogeneity, mechanical and chemical stability, and excellent adhesion to any substrate. In our previous works, we successfully fabricated plasmapolymerized PEG (PP-PEG) films [1] and amine functionalized films [2] using the plasma enhanced chemical vapor deposition (PECVD) technique. In this research, an amine functionalized PP-PEG film was fabricated by using the plasma co-polymerization technique with PEG 200 and ethylenediamine (EDA) as co-precursors. A biocompatible amine functionalized film was surface characterized by X-ray photoelectron spectroscopy (XPS) and Fourier-transform infrared spectroscopy (FT-IR). The density of the surface amine functional groups was carried out by quantitative analysis using UV-visible spectroscopy. We found through surface plasmon resonance (SPR) analysis that non-specific protein adsorption was drastically reduced on amine functionalized PP-PEG films. Our functionalized PP-PEG films show considerable potential for biotechnological applications such as biosensors.

• Journal of Korean Society for Atmospheric Environment
• /
• v.20 no.5
• /
• pp.625-632
• /
• 2004

Perfluorocompounds ($PFC_s$), such as tetrafluoromethane ($CF_4$) and hexafluoroethane ($C_2F_6$), have been widely used as plasma etching and chemical vapor deposition (CVD) gases for semiconductor manufacturing processes. Since these $PFC_s$ are known to cause a greenhouse effect intensively, there has been a growing interest in reducing $PFC_s$ emissions. Among various $CF_4$ decomposing techniques, a dielectric barrier discharge (DBD) is considered as one of a promising candidate because it has been successfully used for generating ozone ($O_3$) and decomposing nitrogen oxide (NO). Firstly, optimal concentration of oxygen for $CF_4$ decomposition was found to figure out how many primary and secondary reactions are associated with DBD process. Secondary, to find effective discharge method for $CF_4$ decomposition, a streamer and a glow mode in DBD are experimentally compared, which includes (i) coaxialcylinder DBD, (ii) DBD reactor packed with glass beads. and (iii) a glow mode operation with a helium gas. The test results showed that optimal concentration of oxygen was ranged 500 ppm~1% for treating 500 ppm of $CF_4$ and helium glow discharge was the most efficient one to decompose $CF_4$.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.10a
• /
• pp.30.1-30.1
• /
• 2011

Silicon is one of useful materials in various industry such as semiconductor, solar cell, and secondary battery. The metallic silicon produces generally melting process for ingot type or chemical vapor deposition (CVD) for thin film type. However, these methods have disadvantages of high cost, complicated process, and consumption of much energy. Electrodeposition has been known as a powerful synthesis method for obtaining metallic species by relatively simple operation with current and voltage control. Unfortunately, the electrodeposition of the silicon is impossible in aqueous electrolyte solution due to its low oxidation-reduction equilibrium potential. Ionic liquids are simply defined as ionic melts with a melting point below $100^{\circ}C$. Characteristics of the ionic liquids are high ionic conductivities, low vapour pressures, chemical stability, and wide electrochemical windows. The ionic liquids enable the electrochemically active elements, such as silicon, titanium, and aluminum, to be reduced to their metallic states without vigorous hydrogen gas evolution. In this study, the electrodeposion of silicon has been investigated in ionic liquid of 1-butyl-3-methylpyrolidinium bis (trifluoromethylsulfonyl) imide ([bmpy]$Tf_2N$) saturated with $SiCl_4$ at room temperature. Also, the effect of electrode materials on the electrodeposition and morphological characteristics of the silicon electrodeposited were analyzed The silicon electrodeposited on gold substrate was composed of the metallic Si with single crystalline size between 100~200nm. The silicon content by XPS analysis was detected in 31.3 wt% and the others were oxygen, gold, and carbon. The oxygen was detected much in edge area of th electrode due to $SiO_2$ from a partial oxidation of the metallic Si.

• Korean Journal of Materials Research
• /
• v.20 no.11
• /
• pp.600-605
• /
• 2010

In order to meet the requirements of faster speed and higher packing density for devices in the field of semiconductor manufacturing, the development of Cu/Low k device material is explored for use in multi-layer interconnection. SiOC(-H) thin films containing alkylgroup are considered the most promising among all the other low k candidate materials for Cu interconnection, which materials are intended to replace conventional Al wiring. Their promising character is due to their thermal and mechanical properties, which are superior to those of organic materials such as porous $SiO_2$, SiOF, polyimides, and poly (arylene ether). SiOC(-H) thin films containing alkylgroup are generally prepared by PECVD method using trimethoxysilane as precursor. Nano voids in the film originating from the sterichindrance of alkylgroup lower the dielectric constant of the film. In this study, methyltriphenylsilane containing bulky substitute was prepared and characterized by using NMR, single-crystal X-ray, GC-MS, GPC, FT-IR and TGA analyses. Solid-state NMR is utilized to investigate the insoluble samples and the chemical shift of $^{29}Si$. X-ray single crystal results confirm that methyltriphenylsilane is composed of one Si molecule, three phenyl rings and one methyl molecule. When methyltriphenylsilane decomposes, it produces radicals such as phenyl, diphenyl, phenylsilane, diphenylsilane, triphenylsilane, etc. From the analytical data, methyltriphenylsilane was found to be very efficient as a CVD or PECVD precursor.

• The KIPS Transactions:PartB
• /
• v.15B no.2
• /
• pp.113-122
• /
• 2008

While there are about 1 million color vision deficiencies in Korea, an assistive technology to digital contents of broadcasting and web for them remains scarce. In this study, we developed a generation method of the ICC profile to correct a graphic digital content adapted to various color perception characteristics of CVD by tuning the correction rules of the ICC profile by themselves. We tested the performance of the ICC profile to apply 10 Ishihara plates to the participants, 1 protanomaly, 1 protanomaly and deuteranomaly and 2 deuteranomaly. We used the color range information to build correction rules. Results of the test show that they passed Ishihara test by 97.5% success rate, compared to 20% success rate without it. The average time for them to spend to tune the customized ICC profile was about 13 minute without any diagnosis of specialist, any special instrument.

• KSTLE International Journal
• /
• v.6 no.1
• /
• pp.13-16
• /
• 2005

Friction characteristics at nano-scale of self-assembled monolayers (SAMs) having different chain lengths and end groups were experimentally studied.51 order to understand the effect of the chain length and end group on the nano-scalefriction: (1) two different SAMs of shorter chain lengths with different end groups such as methyl and phenyl groups, and (2)four different kinds of SAMs having long chain lengths (C10) with end groups of fluorine and hydrogen were coated on siliconwafer (100) by dipping method and Chemical Vapour Deposition (CVD) technique. Their nano-scale friction was measuredusing an Atomic Force Microscopy (AFM) in the range of 0-40 nN normal loads. Measurements were conducted at the scanning speed of 2 $mu$m/s for the scan size of 1$mu$m x 1 $mu$m using a contact mode type $Si_3N_4$ tip (NPS 20) that had a nominal spring constant0.58 N/m. All experiments were conducted at anlbient temperature (24 $pm$1$circ$C) and relative humidity (45 $pm$ 5%). Results showedthat the friction force increased with applied normal load for all samples, and that the silicon wafer exhibited highest frictionwhen compared to SAMs. While friction was affected by the inherent adhesion in silicon wafer, it was influenced by the chainlength and end group in the SAMs. It was observed that the nano-friction decreased with the chain length in SAMs. In the caseof monolayers with shorter length, the one with the phenyl group exhibited higher friction owing to the presence of benBenerings that are stiffer in nature. In the case of SAMs with longer chain length, those with fluorine showed friction values relativelyhigher than those of hydrogen. The increase in friction due to the presence of fluorine group has been discussed with respect tothe siBe of the fluorine atom.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.616-616
• /
• 2013

그래핀(Graphene)은 열전도도가 높고 전자 이동도(200,000 cm2V-1s-1)가 우수한 전기적 특성을 가지고 있어 전계 효과 트랜지스터(Field effect transistor; FET), 유기 전자 소자(Organic electronic device)와 광전자 소자(Optoelectronic device) 같은 반도체 소자에 응용 가능하다. 최근에는 아크 방출(Arc discharge method), 화학적 기상 증착법(Chemical vapor deposition; CVD), 이온-조사법(Ionirradiation)등을 이용한 이종원자(Hetero atom)도핑과 화학적 처리를 이용한 기능화(Functionalization)등의 방법으로 그래핀의 전도도를 향상시킬 수 있었다. 그러나 이러한 방법들은 기판의 표면을 거칠게 하며, 그래핀에 많은 결함들이 발생한다는 단점이 있다. 이러한 단점을 극복하기 위해 자가조립 단층막법(Self-assembled monolayers; SAMs)을 이용하여 기판을 기능화한 후 그 위에 그래핀을 전사하면, 자가조립 단층막의 기능기에 따라 그래핀의 일함수를 조절 가능하고 운반자 농도나 도핑 유형을 변화시켜 소자의 전기적 특성을 최적화 할 수 있다 [1-3]. 본 연구에서는 PET(polyethylene terephthalate) 기판에 SAMs를 이용하여 유연하고 투명한 그래핀 전극을 제작하였다. 산소 플라즈마와 3-Aminopropyltriethoxysilane (APTES)를 이용하여 PET 기판 표면 위에 하이드록실 기(Hydroxyl group; -OH)와 아민 기(Amine group; -NH2)를 순차적으로 기능화 하였고, 그 위에 화학적 기상 증착법을 이용하여 합성한 대면적의 균일한 그래핀을 전사하였다. PET 기판 위에 NH2 그룹이 존재하는 것을 접촉각 측정(Contact angle measurement)과 X-선 광전자 분광법(Xray photoelectron spectroscopy: XPS)을 통해 확인하였으며, NH2그룹에 의해 그래핀에 도핑 효과가 나타난 것을 라만 분광법(Raman spectroscopy)과 전류-전압 특성곡선(I-V characteristic curve)을 이용하여 확인하였다. 본 연구 결과는 유연하고 투명한 기판 위에 안정적이면서 패턴이 가능하기 때문에 그래핀을 기반으로 하는 반도체 소자에 적용 가능할 것이라 예상된다.