• 대한기계학회논문집A
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• 제28권11호
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• pp.1646-1655
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• 2004

A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 1999년도 추계학술발표대회 논문집
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• pp.272-276
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• 1999

The present paper proposes design and manufacturing methods of the carbon/epoxy square grid structure with near zero-CTE in three geometrical principal directions. Bonding strength of the grid structure is examined for different bonding methods. Numerical examples show that maximum displacement of the composite grid structure is almost zero comparing with that of aluminum grid structure with same dimension under thermal loading.

• 월간산업보건
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• 통권361호
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• pp.6-13
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• 2018

• 월간 한농연
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• 6호
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• pp.34-35
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• 2002

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• 한국전산구조공학회논문집
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• 제27권5호
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• pp.393-401
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• 2014

복합재료 구성성분은 수 마이크로미터 수준의 크기를 가지고 있으므로 시험을 통한 정확한 물성 측정이 매우 어렵다. 그러므로 본 논문에서는 역해석을 이용하여 복합재료 구성성분의 열팽창계수를 예측할 수 있는 기법을 제안한다. 복합재료에 대한 등가 열팽창계수를 예측할 수 있는 Mori-Tanaka 기법과 결합된 역해석기법을 이용하면, 라미나 수준의 목적함수를 최소화함으로써 구성성분의 열팽창계수를 효율적으로 구할 수 있다. 본 연구에서 제안한 기법을 검증하기 위하여 다양한 섬유(glass fiber, P75, P100, M55J)에 대한 열팽창계수를 예측하고 이를 시험결과와 비교하였다. 또한 라미나와 기지 물성치에 대한 불확실성이 섬유 물성치 예측에 미치는 영향을 분석하였다.

• 대한치과기공학회지
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• 제31권4호
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• pp.25-30
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• 2009

Zirconia($ZrO_2$) has attracted much attention in science and technology because of its high refractive index, high melting temperature, hardness, low thermal conductivity and corrosion barrier properties. And it is widely used as the dental restoration material because of its esthetic appearance. In this research, we analyzed the particle size and composition of the imported dental porcelain for zirconia. And the glass frit was produced. To decrease the glass transition temperature and softening temperature of the glass frit, $Li_2O$ was added into it and the effect of $Li_2O$ on the firing temperature was researched. Then the glass which contains leucite crystal with a high coefficient of thermal expansion(CTE) was manufactured and it was mixed with the glass frit to control the CTE. The phase composition were analyzed using the X-ray diffraction. The morphologies of the samples were observed by the scanning electron microscope. The 4wt% $Li_2O$-added glass frit has the optimal glass transition temperature and softening temperature. And 6 wt% leucite crystal was mixed with the glass frit to control the CTE. From the experimental results of crystallization, the crystal phase was found only leucite crystal.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.365-370
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).

• 한국군사과학기술학회지
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• 제21권2호
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• pp.217-224
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• 2018

The purpose of this study is to evaluate the future potential value of CTE(Critical Technology Element)s that are evaluated to be low in TRA(Technology Readiness Assesment) and to present investment prioritization technologies in defense R&D(Research and Development) based on them. To do this, we used the DEA(Data Envelopment Analysis) method, which is useful in evaluating the efficiency of the organization. Specifically, we suggest a systematic framework to evaluate the future value of CTEs by setting the CTEs derived from the TRA process to DMU(Decision Making Unit)s, the cost and time required to develop each CTE as the input factor of the DEA and the effects of the development of each CTE as the output factor of the DEA respectively. We also conducted an illustrative case study on radar technologies to demonstrate the usefulness of the proposed approach.