• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.4
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• pp.255-265
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• 2008

This paper presents the optimization process of evaporator for a vapor compression cooling system for high heat flux CPU. The CPU thermal capacity was given by 300W. Evaporating temperature and mass flow rate were $18^{\circ}C$ and 0.00182kg/s respectively. R134a was used as a working fluid. Channel width(CW) and height(CH) were selected as design factors. And thermal resistance, surface temperature of CPU, degree of superheat, and pressure drop were taken as objective responses. Fractional factorial DOE was used in screening phase and RSM(Response Surface Method) was used in optimization phase. As a result, CW of 2.5mm, CH of 2.5mm, and CL of 484mm were taken as an optimum geometry. Surface temperature of CPU and thermal resistance were $33^{\circ}C\;and\;0.0502^{\circ}C/W$ respectively. Thermal resistance of evaporator designed in this study was significantly lower than that of other cooling systems such as water cooling system and thermosyphon system. It was found that the evaporator considered in this work can be a excellent candidate for a high heat flux CPU cooling system.

• Journal of ILASS-Korea
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• v.19 no.1
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• pp.19-24
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• 2014

In this study, the cooling performance of a liquid CPU cooler using the water/propylene glycol(PG)-based $Al_2O_3$ nanofluids is experimentally investigated. Water/PG-based $Al_2O_3$ nanofluids are manufactured by two-step method with ultrasonic energy for 10 hours. The volume fractions of the nanofluids are 0.25% and 0.35%. Thermal conductivity and viscosity of the nanofluids are measured to theoretically predict the thermal performance of the liquid CPU cooler using performance factor. Performance factor results indicate that the cooling performance of the liquid CPU cooler can be improved using the manufactured nanofluids. To evaluate the cooling performance of the liquid CPU cooler experimentally, temperature differences between ambient air and heater are measured for base fluid and nanofluids respectively. Based on the results, it is shown that performance of the liquid CPU cooler using $Al_2O_3$ nanofluids is improved maximum up to 8.6% at 0.25 Vol.%.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.3
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• pp.417-422
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• 2002

The experiments have been carried out to evaluate the cooling performance of a fan-aluminum foam heat sink assembly in comparison with a conventional CPU cooler. In terms of the dimensionless surface temperature of the heater, the cooling performance of the aluminum foam heat sink is similar to that of the conventional one with much reduced weight. The optimum fin height is found to be strongly dependent on the fin height of the heat sink and flow characteristics of the cooling fan.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.258-263
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• 2007

The performance of louver-finned flat-tube radiators for computer CPU liquid cooling were experimentally investigated. In this study, 5 samples of louver-finned flat-tube radiators with different width size (19mm, 24mm), tube hole (1, 9) and pass number (1, 2, 5) were tested in a wind tunnel. The experiments were conducted under the different air velocity ranging from 1 to 5 m/s. The water flow rate through a pass was 1.7 LPM. Inlet temperatures of air and water were $20^{\circ}C$ and $30^{\circ}C$ respectively. The results showed that the best performance in the 24mm sample considering pressure drop and heat transfer coefficient.

• Journal of Power System Engineering
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• v.13 no.4
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• pp.56-61
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• 2009

In recent years, since the continuing increase in the capacity in personal computer such as the optimal performance, high quality and high resolution image, the computer system's components produce large amounts of heat during operation. This study analyzes and investigates the ability and efficiency of a cooling system inside a computer by means of central processing unit (CPU) and power supply cooling fan. This research was conducted to enhancement of efficiency of the cooling system inside the computer by making a structure which produces different air pressures in an air inflow tube. Consequently, when temperatures of the CPU and room inside computer were compared with a general personal computer, temperatures of the tested CPU, the room and the heat sink were as low as $5^{\circ}C$, $2.5^{\circ}C$ and $7^{\circ}C$ respectively. In addition to, revolution per minute (RPM) was shown as low as 250 after 1 hour operation. This research explored the possibility of enhancing the effective cooling of high-performance computer systems.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.1
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• pp.1-7
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• 2011

The performance of louver-finned flat-tube and fin and tube radiators for computer CPU liquid cooling was experimentally investigated. In this study, 7 samples of radiators with different shape and pass number (1, 2, 10) were tested in a wind tunnel. The experiments were conducted under the different air velocity ranged from 1 to 4 m/s. The water flow rate through a pass was 1.2 LPM. Inlet temperatures of air and water were $20^{\circ}C$ and $30^{\circ}C$ respectively. It was found that the best performance was observed in the louver-finned flat-tube sample considering pressure drop and heat transfer coefficient.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.601-604
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• 2008

Desktop PC CPUs have been significantly required to be the necessity of thermal management while they have satisfied the extensive data and graphic processing requirements. So the cooling systems assembled with heat pipes embedded in a metal cooling plate, and fins are widely used in the desktop PC markets. Due to a number of demands such as the confined space of desktop PCs, higher heat density of CPUs, and acoustic noise, however, there is the main drive to improve continuously cooling systems. This paper presents the flow and thermal behavior of the cooling system by using the computational fluid dynamics(CFD) code.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1153-1158
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• 2009

The performance of louver-finned flat-tube and fin & tube radiators for computer CPU liquid cooling were experimentally investigated. In this study, 7 samples of radiators with different shape and pass number (1, 2, 10) were tested in a wind tunnel. The experiments were conducted under the different air velocity range from 1 to 4 m/s. The water flow rate through a pass was 1.2 LPM. Inlet temperatures of air and water were $20^{\circ}C$ and $30^{\circ}C$ respectively. It was found that the best performance was observed in the louver-finned flat-tube sample considering pressure drop and heat transfer coefficient.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2298-2303
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• 2008

The increasing demands for the recently released CPU which has had higher heat density, the confined space of desktop PCs, and so on are the main drive for continuously improving PC cooling systems. In order to meet number of demands, this paper describes the flow and thermal behavior of the heat sink combined with heat pipes, and a fan through the numerical analysis by using the computational fluid dynamics(CFD) code and discusses how to extend the cooling capability.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.264-269
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• 2007

The microchannel waterblock has a good capability in the cooling of electronic devices. The object of this paper is to study on thermal performance of microchannel water block for cooling of CPU in desktop. The effects of header shape, liquid flow rate, and inlet temperature on the thermal performances of microchannel waterblock are investigated experimentally. Three types of waterblock with different header shape are manufactured from the micro milling and brazing processing. The experiments are conducted using water, over a liquid flow rate ranging from 0.7 to 2.0 LPM and inlet temperature ranging from 20 to $35^{\circ}C$. Waterblocks are attached both horizontally and vertically on the test section to anticipate a performance of waterblock under the actual state in computer. The base temperature and thermal resistance decrease with increasing of liquid flow rate. It was found that the sample #1 was appropriate for the prototype of liquid cooling system.