• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.836_837
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• 2009

PC용 냉각장치의 일환으로 CPU의 외벽에 방열판을 달고 열전냉각모듈을 설치한 후 방열판을 냉각하기 위해서 펌프를 적용한 수냉식 냉각 시스템을 개발하고자 하였다. 먼저, 냉각 시 펌프의 부하를 설계하고 그 용량에 적절한 저소음, 고효율 BLDC 모터를 개발하고자, 상용화된 외국제품인 S사의 저효율 단상 BLDC 모터가 적용된 수냉식 펌프를 기준으로 하였다. S사의 단상 BLDC 모터에 대한 시뮬레이션과 테스트를 통해서 거의 비슷한 결과를 얻었으며, 이를 이용하여 단가가 다소 상승하더라도 효율과 성능을 향상시킬 수 있는 3상 BLDC 모터구조로 설계를 하였으며, 그 결과 효율이 거의 2배 향상되며 출력 또한 향상됨을 시뮬레이션으로 구현하였다.

• Journal of Power System Engineering
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• v.13 no.4
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• pp.56-61
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• 2009

In recent years, since the continuing increase in the capacity in personal computer such as the optimal performance, high quality and high resolution image, the computer system's components produce large amounts of heat during operation. This study analyzes and investigates the ability and efficiency of a cooling system inside a computer by means of central processing unit (CPU) and power supply cooling fan. This research was conducted to enhancement of efficiency of the cooling system inside the computer by making a structure which produces different air pressures in an air inflow tube. Consequently, when temperatures of the CPU and room inside computer were compared with a general personal computer, temperatures of the tested CPU, the room and the heat sink were as low as $5^{\circ}C$, $2.5^{\circ}C$ and $7^{\circ}C$ respectively. In addition to, revolution per minute (RPM) was shown as low as 250 after 1 hour operation. This research explored the possibility of enhancing the effective cooling of high-performance computer systems.

• The Magazine for Energy Service Companies
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• s.62
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• pp.58-65
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• 2010

최근 가정용 컴퓨터와 노트북 등의 중앙처리장치(CPU) 속도가 급격히 빨라지고 있다. 더욱이 화석 에너지 고갈 위기에 따라 제품의 발열량은 급속도로 늘어날 전망이라는 관측이 나왔다. 때문에 에너지절약에 대한 해결이 동반된 연구가 이뤄져야 한다는 목소리가 커지고 있다. 이러한 문제를 해결하기 위해 발열원에 히트싱크를 직접 부착하는 강제대류 방식에 대한 연구가 진행되고 있고, 최근 들어 열전소자를 이용한 냉각방식과 히트파이프를 이용한 방식도 대두되고 있다. 그 중 열저항 특성 연구에 집중했던 기존 방식에서 벗어나 Pulsating Heat Pipe(PHP)를 열확산기로 적용시킨 연구방식을 소개한다.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.77-82
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• 2000

Parametric study fur the cooling characteristic investigation of a notebook PC mounted with heat spreader has been numerically performed. Two oases of air-blowing and air-exhaust at inlet were tested. The cooling effect on Parameters such an, velocities of air-blowing and air-exhaust, materials of heat spreader, and CPU powers were simulated for two cases. Cooling performance in the case of air-blowing was better than the case of air-exhaust.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1153-1158
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• 2009

The performance of louver-finned flat-tube and fin & tube radiators for computer CPU liquid cooling were experimentally investigated. In this study, 7 samples of radiators with different shape and pass number (1, 2, 10) were tested in a wind tunnel. The experiments were conducted under the different air velocity range from 1 to 4 m/s. The water flow rate through a pass was 1.2 LPM. Inlet temperatures of air and water were $20^{\circ}C$ and $30^{\circ}C$ respectively. It was found that the best performance was observed in the louver-finned flat-tube sample considering pressure drop and heat transfer coefficient.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2298-2303
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• 2008

The increasing demands for the recently released CPU which has had higher heat density, the confined space of desktop PCs, and so on are the main drive for continuously improving PC cooling systems. In order to meet number of demands, this paper describes the flow and thermal behavior of the heat sink combined with heat pipes, and a fan through the numerical analysis by using the computational fluid dynamics(CFD) code and discusses how to extend the cooling capability.

• The KSFM Journal of Fluid Machinery
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• v.11 no.5
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• pp.63-69
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• 2008

• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.12
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• pp.1475-1483
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• 2004

Loop thermosyphon(LTS) has many good characteristics such as low thermal resistance, no power consumption, noiseless operation and small size. To investigate the overall performance of LTS, we have performed various experiments varying three parameters: input power of the heater, working fluid(water, ethanol, FC3283) and filling ratio of the working fluid. At a combination of these parameters, temperature measurements are made at many locations of the LTS. The temperature difference between the evaporator and the condenser is used to obtain the thermal resistance. In addition, flow visualization using a high speed camera is carried out. The thermal resistance is not constant. It is lower at higher input power, which is one of the distinct merits of LTS. Flow instabilities are frequently observed when changing the working fluid, the input power and the filling ratio. The results show that the LTS can be readily put into practical use. Future practical application in electronic cooling is recommended.

• Proceedings of the Korean Society of Computer Information Conference
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• 2012.07a
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• pp.9-11
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• 2012

프로세서 설계 기술의 발달로 인해 그래픽 프로세서 또한 기술적으로 크게 발전하였다. 그래픽 프로세서는 단순한 그래픽 표현장치에서 대용량의 데이터를 병렬로 처리하는 고성능 장치로 변화하고 있다. 뿐만 아니라 그래픽 프로세서는 대용량의 데이터처리가 가능한 병렬 프로세서로 특화되어 있기 때문에 이를 활용하여 CPU의 작업을 보조하며 빠른 연산 수행을 가능하게 한다. 이로 인해, 최신의 고성능 시스템 설계에서 그래픽 프로세서는 매우 중요한 역할을 한다. 그래픽 프로세서를 활용하는 고성능의 시스템을 설계하기 위해서는 발열과 소비 전력을 고려해야 한다. 본 논문에서는 그래픽 프로세서의 온도를 제어하는 냉각팬의 세기를 조절하여 그에 따른 온도와 소비 전력을 분석한다. 실험 결과 냉각팬 세기가 낮은 경우 그래픽 프로세서의 온도는 $100^{\circ}C$까지 급격히 상승한다. 냉각팬 세기가 높은 경우 그래픽 프로세서의 온도는 천천히 증가하여 일정 온도에 수렴함을 알 수 있다. 또한, 그래픽 프로세서의 소비 전력은 작업량을 할당하지 않았을 때보다 최대작업량을 할당하였을 때 냉각팬 세기에 따른 소비전력 차이가 큼을 알 수 있다.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.