• Journal of Welding and Joining
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• 제19권2호
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• pp.191-199
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• 2001

The oxidation and recrystallization behaviors of Ni-base single crystal superalloy, CMSX-2 were investigated to determine the condition of the preparation for transient liquid phase (TLP) bonding operations. The faying surfaces of CMSX-2 were worked by the shot peening, fine cutting and mechanical polishing treatments and the degree of working of treated surfaces was evaluated by the hardness test and X-ray diffraction method CMSX-2 was heat-treated at 1,173∼1.589k for 3.6ks in vacuum of 4mPa. The mechanically polished surface was slightly oxidized after heat treatment even in the vacuum atmosphere of 4mPa. The thickness of an oxide film increased with increasing the heating temperature and the surface roughness of the faying surface. Recrystallization occurred at the surface after heat treatment at above 1,423K when the hardness was increased more than Hv600 by the shot peening treatment while the mechanically polished or fine cut surfaces didn't recrystallized. Based on these results, it was clearfied that the mechanically polishing with fine abrasive grit could be used for the preparation of faying surface of CMSX-2 before bonding operation.

• Journal of Welding and Joining
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• 제19권3호
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• pp.325-333
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• 2001

The effect of base metal grain size on isothermal solidification behavior of Ni-base superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 insert metal. TLP-bonding of single crystal. coarse-grained and fine-grained CMSX-2 was carried out at 1373∼1548k for various holding time in vacuum. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process for single crystal, coarse-grained and fine-grained base metals. The completion time for isothermal solidification decreased in the order ; single crystal, coarse-grained and fine-grained base metals. The difference of isothermal solidification rates produced when bonding the different base metals could be explained quantitatively by the effect of base metal grain boundaries on the apparent average diffusion coefficient of boron in CMSX-2.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1997년도 특별강연 및 춘계학술발표 개요집
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• pp.201-202
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• 1997

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1998년도 특별강연 및 추계학술발표 개요집
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• pp.213-215
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• 1998

• Journal of Welding and Joining
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• 제19권1호
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• pp.75-81
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• 2001

The metallurgical study of microconstituents in transient liquid phase bonded joints of Ni-base single crystal superalloys, CMSX-2 and CMSX-4 was investigated employing MBF-80 insert metal. TLP bonding of specimens was carried out at 1,373~1,523K for 0~19.6ks in vacuum. Three types of microconstituents ; needle-like constituent, dot-like constituent and abnormal shape constituent were formed in the bonded interlayer during TLP bonding operation. All these microconstituents were identified as boride. Microconstituents contain a large percentage of Cr in the early stage of bonding. As increasing the holding time, the amount of Cr was decreased and the amount of W, Co and Re were increased. From the analysis results of electron diffraction pattern by TEM, composition of elements in microconstituents were into MBlongrightarrowM$_{5}$B$_3$longrightarrowM$_2$B type with the increased in holding time. It can be explained by the fact that the relative amount of boron in microconstituents was decreased when the holding time was increased.d.

• Journal of Welding and Joining
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• 제19권1호
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• pp.82-87
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• 2001

The creep-rupture and low cycle fatigue properties of transient liquid phase bonded joints of Ni-base single crystal superalloy, CMSX-2 was investigated using MBF-80 insert metal. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. CMSX-2 was bonded at 1523K for 1.8ks in vacuum, optimum bonding condition. The creep rupture strength and rupture lives of the joints were the almost identical to ones of the base metal. SEM observation of the fracture surfaces of joints after creep rupture test revealed that the fracture surfaces classified three types of region, ductile fracture surface, cleavage fracture surface and interfacial fracture surface. The low cycle fatigue properties of the joints were also the same level as those of base metal. The elongation and reduction of area values of joints were comparable to those of base metal while fell down on creep rupture condition of high temperature.

• 자원리싸이클링
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• 제19권5호
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• pp.25-30
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• 2010

CMSX-4 초내열합금의 순환활용을 위한 습식제련기술 개발의 일환으로 영신에서의 니켈, 코벨트, 크롬, 알루미늄 등 주요 구성 금속성분들의 침출 특성을 조사하였다. 염산농도에 따른 합금시료 내 주요 금속성분들의 침출율은 염산농도가 높아짐에 따라 증가하였으나, 3 M 이상에서는 둔화되었다 염산농도 4 M, 고액비 10 g/L, 침출시간 60 분 조건에서 침출온도가 높아짐에 따라 침출율은 급격히 증가하였으며, $90^{\circ}C$에서 니켈 93.2%, 알루미늄 89.9%, 코발트 80.4%, 크롬 79.1%의 침출율을 나타내었다. 한편 침출 초기에는 니켈과 알루미늄의 침출속도가 빠르고 60 분 이후 급격히 둔화되는 형태를 보인 반면 코발트와 크롬은 침출이 느리고 60 분 이후의 감소율만 상대적으로 적었다. 120 분 경과 시 주요 금속원소들의 침출율은 모두 99% 수준에 도달하였다. 고액비가 높아지면 침출율은 서서히 감소하였으며, 니켈과 알루미늄이 코발트와 크롬에 비하여 침출율 감소가 적었다. 염산농도 4 M, 침출온도 $90^{\circ}C$, 침출시간 120 분의 조건에서 고액비 125 g/L 이하의 조건이 주요 금속 성분의 침출에 효과적임을 확인하였으며, 이는 CMSX-4 합금의 금속학적 조직구조와 관련이 있는 것으로 생각된다.

• 한국주조공학회지
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• 제44권2호
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• pp.31-39
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• 2024

제2세대 단결정 초내열합금 CMSX-4은 1310℃ 이상의 온도로 용체화처리에 의해 수지상 경계와 γ/γ'공정조직이 제거되었으며, γ'상의 크기는 용체화처리 온도와 시간의 증가에 따라 수지상간 영역에서 감소하는 경향을 보였다. γ'상의 크기는 수지상 중심과 수지상간 영역에서 큰 차이를 보였다. 모든 열처리 조건에서 수지상간 영역에서 γ'상이 크게 나타났다. 용체화처리 온도와 시간의 증가에 따라 수지상 중심과 수지상간 영역의 γ'합금형성 원소 편석은 크게 감소하였으나, W, Co, Re과 같은 고용 강화원소들의 편석은 모든 열처리 후에도 어느 정도 잔존하였다. 특히, Re은 편석이 완전히 해소되지 않았다. 새로운 유해상의 생성이 없는 상온 인장 특성은 용체화처리 온도와 시간의 증가에 따라 개선되는 경향을 보였다.

• Journal of Welding and Joining
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• 제18권3호
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• pp.106-113
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• 2000

Single crystallization behavior ad high temperature tensile properties of TLP bonded joints of Ni-base single crystal superalloy, CMSX-2 were investigated using MBF-80 and F-24 insert metals. CMSX-2 was bonded at 1523~1548K for 1.5~1.8ks in vacuum. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. Crystallographic orientation analyzed points over the bonded region possessed the almost same orientation across the joint interface and misorientation $\Delta^{\theta}$ was negligibly small in as-bonded and post-bond heat-treated situations. It was confirmed that single crystallization could be readily achieved during TLP bonding. The tensile strengths of all joints at elevated temperatures were equal to or greater than those of base metal the range of testing temperature between 923K and 1173K. The elongation and reduction of area in values were almost the same as those of base metal. SEM observation of the fracture surfaces of joints after tensile test revealed that the fracture surface indicated the similar morphologies each other, and that the fracture of joints occurred in the base metal in any cases.

• 연구논문집
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• 통권23호
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• pp.15-27
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• 1993

The single crystal specimens were solidified by modified Bridgeman method. The surface recrystallized single crystal specimens were prepared by shot peening followed by heat treatment. The surface recrystallization begins at the dendrite cores on the surface. The recrystallized grains grew into the inner side of the specimen. The growth of recrystallized grains was inhibited by the pores and eutectic phases. The primary $\gamma'$ phases were dissolved at the recrystallized grain boundaries during the grain growth. The grain growth of recrystallized grains was similar to the cellular type transformation. No orientation relationships were found bewteen the recrystallized grains and the parent phase.